Effects of a Void Beneath a Kapton Heater Patch in a Vacuum

2004 ◽  
Author(s):  
Ryan A. Schmidt
Keyword(s):  
Heat Flux ◽  
Hot Spot ◽  
Thermal Control ◽  
Heat Fluxes ◽  
Void Size ◽  
Conduction Path ◽  
Space Applications ◽  
Affected Area ◽  
Conduction Pathway ◽  
Substrate Temperatures

The vacuum of space can lead to some interesting heater problems. In many space applications, heater patches consisting of Inconel elements joined together with Teflon sandwiched together between two Kapton layers are bonded to a structure (substrate) to provide thermal control. A void between the heater patch and the substrate can lead to a hot spot due to the loss of conduction path from the heater to the substrate. When the heater is in a vacuum with a void beneath it, heat is transferred to the substrate by radiation and fin effects through the heater and then to the substrate. The localized hot spot can cause heater layers to separate and further reduce the conduction pathway from the affected area and eventually burnout the heater. A large enough void combined with high heater heat fluxes and substrate temperatures can induce heater failures. For this paper the sensitivity of peak temperature with respect to heat flux (power density), substrate temperature, void size, and void location is considered.

Performance of Elastomeric Silicones in Ablative and Space Environments

1966 ◽  
Vol 39 (4) ◽  
pp. 1247-1257 ◽  
Author(s):  
Clyde L. Whipple ◽  
John A. Thorne
Keyword(s):  
High Vacuum ◽  
Thermal Control ◽  
Heat Fluxes ◽  
Space Environment ◽  
Space Applications ◽  
Wide Range ◽  
Environmental Extremes ◽  
Temperature Ranges ◽  
Space Environments ◽  
Thermal Control Coatings

Abstract Elastomeric silicones are among the best materials available for many ablative and space applications. In ablative applications, these materials protect launching equipment, safeguard various parts of vehicles and spacecraft during flight, and shield re-entering spacecraft. Generally, elastomeric silicones are used where ablative conditions involve low to moderate heat fluxes and shear forces. Ablative characteristics of materials can vary widely depending on polymer type, fillers, and applications techniques, and no one elastomeric silicone will perform in a wide range of ablative missions. A good knowledge of the ablative characteristics of silicone materials is required to select the best candidates for a given application. In the space environment, silicones are often used for seals, thermal control coatings, potting materials, and other applications because they perform well over wide temperature ranges, and because they are inherently stable to high-vacuum and ultraviolet conditions. Data given in this paper illustrate that silicones show little weight loss or loss of properties on exposure to space environmental extremes. Furthermore, these losses can be made almost negligible by proper conditioning of the finished elastomer.

Experimental Study of a Single Microchannel Flow Under Non-Uniform Heat Flux

2017 ◽  
Author(s):  
Ahmed Eltaweel ◽  
Abdulla Baobeid ◽  
Ibrahim Hassan
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Heat Dissipation ◽  
Hot Spot ◽  
Heat Fluxes ◽  
Heat Sinks ◽  
Uniform Heat Flux ◽  
Maximum Heat ◽  
Uniform Heat ◽  
Microchannel Heat Sinks

Non-uniform heat fluxes are commonly observed in thermo-electronic devices that require distinct thermal management strategies for effective heat dissipation and robust performance. The limited research available on non-uniform heat fluxes focus mostly on microchannel heat sinks while the fundamental component, i.e. a single microchannel, has received restricted attention. In this work, an experimental setup for the analysis of variable axial heat flux is used to study the heat transfer in a single microchannel with fully developed flow under the effect of different heat flux profiles. Initially a hot spot at different locations, with a uniform background heat flux, is studied at different Reynolds numbers while varying the maximum heat fluxes in order to compute the heat transfer in relation to its dependent variables. Measurements of temperature, pressure, and flow rates at a different locations and magnitudes of hot spot heat fluxes are presented, followed by a detailed analysis of heat transfer characteristics of a single microchannel under non-uniform heating. Results showed that upstream hotspots have lower tube temperatures compared to downstream ones with equal amounts of heat fluxes. This finding can be of importance in enhancing microchannel heat sinks effectiveness in reducing maximum wall temperatures for the same amount of heat released, by redistributing spatially fluxes in a descending profile.

Inverse Design of Cooling of Electronic Chips Subject to Specified Hot Spot Temperature and Coolant Inlet Temperature

2015 ◽  
Author(s):  
Sohail R. Reddy ◽  
George S. Dulikravich
Keyword(s):  
Heat Flux ◽  
Hot Spot ◽  
Heat Fluxes ◽  
Operating Conditions ◽  
Heat Transfer Analysis ◽  
Maximum Temperature ◽  
Fluid Temperature ◽  
Cooling Fluid ◽  
Pin Fin ◽  
The Given

Most methods for designing electronics cooling schemes do not offer the information on what levels of heat fluxes are maximally possible to achieve with the given material, boundary and operating conditions. Here, we offer an answer to this inverse problem posed by the question below. Given a micro pin-fin array cooling with these constraints: - given maximum allowable temperature of the material, - given inlet cooling fluid temperature, - given total pressure loss (pumping power affordable), and - given overall thickness of the entire electronic component, find out the maximum possible average heat flux on the hot surface and find the maximum possible heat flux at the hot spot under the condition that the entire amount of the inputted heat is completely removed by the cooling fluid. This problem was solved using multi-objective constrained optimization and metamodeling for an array of micro pin-fins with circular, airfoil and symmetric convex cross sections that is removing all the heat inputted via uniform background heat flux and by a hot spot. The goal of this effort was to identify a cooling pin-fin shape and scheme that is able to push the maximum allowable heat flux as high as possible without the maximum temperature exceeding the specified limit for the given material. Conjugate heat transfer analysis was performed on each of the randomly created candidate configurations. Response surfaces based on Radial Basis Functions were coupled with a genetic algorithm to arrive at a Pareto frontier of best trade-off solutions. The Pareto optimized configuration indicates the maximum physically possible heat fluxes for specified material and constraints.

Evaporative Thermal Performance of Vapor Chambers Under Nonuniform Heating Conditions

2008 ◽  
Vol 130 (12) ◽  
Author(s):  
Je-Young Chang ◽  
Ravi S. Prasher ◽  
Suzana Prstic ◽  
P. Cheng ◽  
H. B. Ma
Keyword(s):  
Heat Flux ◽  
Thermal Resistance ◽  
Thermal Performance ◽  
Hot Spots ◽  
Hot Spot ◽  
Heat Fluxes ◽  
Experimental Results ◽  
Nonuniform Heating ◽  
Test Results ◽  
Uniform Heating

This paper reports the test results of vapor chambers using copper post heaters and silicon die heaters. Experiments were conducted to understand the effects of nonuniform heating conditions (hot spots) on the evaporative thermal performance of vapor chambers. In contrast to the copper post heater, which provides ideal heating, a silicon chip package was developed to replicate more realistic heat source boundary conditions of microprocessors. The vapor chambers were tested for hot spot heat fluxes as high as 746 W/cm2. The experimental results show that evaporator thermal resistance is not sensitive to nonuniform heat conditions, i.e., it is the same as in the uniform heating case. In addition, a model was developed to predict the effective thickness of a sintered-wick layer saturated with water at the evaporator. The model assumes that the pore sizes in the sintered particle wick layer are distributed nonuniformly. With an increase of heat flux, liquid in the larger size pores are dried out first, followed by drying of smaller size pores. Statistical analysis of the pore size distribution is used to calculate the fraction of the pores that remain saturated with liquid at a given heat flux condition. The model successfully predicts the experimental results of evaporative thermal resistance of vapor chambers for both uniform and nonuniform heat fluxes.

Experimental Study of a Single Microchannel Flow Under Nonuniform Heat Flux

2019 ◽  
Vol 12 (1) ◽  
Author(s):  
Ahmed Eltaweel ◽  
Ibrahim Hassan
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Heat Dissipation ◽  
Hot Spot ◽  
Management Strategies ◽  
Heat Fluxes ◽  
Heat Sinks ◽  
Nonuniform Heating ◽  
Maximum Heat ◽  
Microchannel Heat Sinks

Abstract Nonuniform heat fluxes are commonly observed in thermo-electronic devices that require distinct thermal management strategies for effective heat dissipation and robust performance. The limited research available on nonuniform heat fluxes focus mostly on microchannel heat sinks while the fundamental component, i.e., a single microchannel, has received restricted attention. In this work, an experimental setup for the analysis of variable axial heat flux is used to study the heat transfer in a single microchannel with fully developed flow under the effect of different heat flux profiles. Initially, a hot spot at different locations, with a uniform background heat flux, is studied at different Reynolds numbers, while varying the maximum heat fluxes in order to compute the heat transfer in relation to its dependent variables. Measurements of temperature, pressure, and flow rates at a different locations and magnitudes of hot spot heat fluxes are presented, followed by a detailed analysis of heat transfer characteristics of a single microchannel under nonuniform heating. Results showed that upstream hotspots have lower tube temperatures compared to downstream ones with equal amounts of heat fluxes. This finding can be of importance in enhancing microchannel heat sinks effectiveness in reducing maximum wall temperatures for the same amount of heat released, by redistributing spatially fluxes in a descending profile.

Evaporators for High Temperature Lift Vapor Compression Loop for Space Applications

2009 ◽  
Author(s):  
Tadej Semenic ◽  
Xudong Tang
Keyword(s):  
Heat Flux ◽  
High Temperature ◽  
Circular Tube ◽  
Heat Fluxes ◽  
Working Fluid ◽  
Twisted Tape ◽  
Vapor Compression ◽  
Space Applications ◽  
Used Oil ◽  
Expansion Valve

An Advanced Vapor Compression Loop (AVCL) for high temperature lift for heat rejection to hot lunar surface during lunar daytime was developed. The loop consists of an evaporator, a compressor, a condenser, and an electronic expansion valve. Different types of evaporators were evaluated in this study: a circular tube evaporator, a circular tube evaporator with a twisted tape, a circular tube evaporator with a wick, and a circular tube evaporator with a wick and a twisted tape. The evaporators were tested with two different compressors. The first was a 0.5hp oil-less compressor and the second was a 5.3hp compressor that used oil as lubricant. A heat exchanger (recuperator) was used to subcool the high pressure liquid and to superheat the low pressure vapor. Tests were performed with and without the recuperator. Vapor superheat during the tests was controlled with an electronic expansion valve controller. The working fluid was R134a. The results show that the heat source-to-working fluid thermal resistance of the circular tube evaporator with the wick and the twisted tape was one-third of that of the circular tube evaporator. The recuperator was able to decrease the vapor quality at the evaporator inlet and increase the vapor superheat at the compressor inlet. The evaporators without wicks were able to operate at a heat flux of 5.7W/cm2 with the recuperator and vapor superheat set at 5°C. Evaporators with wicks reached dryout at lower heat fluxes when maintaining superheat at 5°C. However, the wicked evaporators reached a heat flux of 7.6W/cm2 when decreasing superheat below 5°C. A temperature lift of 70°C was achieved with the 5.3hp compressor.

Development of Miniature Loop Heat Pipes for the Thermal Control of Laptops

2008 ◽  
Author(s):  
Masataka Mochizuki ◽  
Yuji Saito ◽  
Thang Nguyen ◽  
Tien Nguyen ◽  
Vijit Wuttijumnong ◽  
...  
Keyword(s):  
Heat Flux ◽  
Electronic Devices ◽  
Thermal Control ◽  
High Heat ◽  
Control Device ◽  
Heat Fluxes ◽  
High Heat Flux ◽  
Total Thermal Resistance ◽  
Evaporation Zone ◽  
Loop Heat Pipes

Thermal management of laptops is becoming increasingly challenging task due to the high heat flux associated with the microprocessors and limited available space for the integration of the thermal control device inside the cabinet. In this paper, results from the investigation of two different designs of miniature Loop Heat Pipe (mLHP) for thermal control of compact electronic devices including notebooks have been discussed. Two prototypes of mLHP, one with a disk shaped evaporator of 30 mm in diameter and 10 mm thick, and the other with a rectangular shaped evaporator of 45×35 mm2 planar area and 5 mm thick, were designed to handle heat fluxes of up to 50 W/cm2. Total thermal resistance of these mLHPs lies in the range of 1 to 5 °C/W. In addition to this, two new designs of the mLHP pertaining to enhance the heat transfer inside the evaporation zone and to develop the loop evaporator with thickness as small as 3 mm are discussed. In conclusions, the designed mLHPs were able to satisfy the thermal and design requirements of the current laptop equipments and can be classified as potential candidates for cooling of the compact electronic devices with restricted space and high heat flux chipsets.

Numerical Simulation of Transient Conjugate Heat Transfer in Liquid Jet Impingement

2014 ◽  
Author(s):  
Jaewon Lee ◽  
Gihun Son
Keyword(s):  
Numerical Simulation ◽  
Heat Flux ◽  
Jet Impingement ◽  
Thermal Control ◽  
Temporal Variations ◽  
Heat Fluxes ◽  
Liquid Jet ◽  
Gas Phases ◽  
Solid Interface ◽  
Liquid Vapor

Numerical simulation is performed for a quenching process in liquid jet impingement, which is applicable to thermal control in metal manufacturing and emergency cooling of nuclear reactors. The flow and cooling characteristics of jet impingement are investigated by solving the conservation equations of mass, momentum and energy in the liquid and gas phases. The liquid-vapor and liquid-air interfaces are tracked by a sharp-interface level-set method which is modified to include the effect of phase change at the liquid-vapor interface. The temporal and spatial variation of solid temperature is analyzed by solving a conjugate problem with the conduction in the solid as well as the convection in the liquid and gas phases. The numerical results demonstrate that the temporal variations of the temperature and heat flux near the fluid-solid interface are very steep compared to those inside the solid. The heat flux variations at the fluid-solid interface are observed to be much larger in the convection mode than in the film boiling mode. The solid temperatures and heat fluxes obtained from the present study are compared with the experimental data reported in the literature.

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