Joint Development of a Package-Level Thermal Interface Material Test System

2009 ◽  
Author(s):  
Yanshu Susan Chen ◽  
Stanley Pecavar ◽  
Vadim Gektin
Keyword(s):  
Material Selection ◽  
Test System ◽  
Thermal Design ◽  
Test Method ◽  
Thermal Interface Material ◽  
Test Results ◽  
Performance Measurements ◽  
Thermal Interface ◽  
Application Performance ◽  
Successful Model

As the microelectronics industry continues to trend towards smaller, lighter, and higher power devices, thermal management is becoming more important than ever. Thermal interface materials (TIMs) play a crucial role in removing heat from both bare die and lidded packages. A serious challenge the industry has been facing is the lack of an agreed upon test standard that is specifically tailored for TIM thermal performance measurements between TIM suppliers and OEM customers. ASTM D 5470 is not necessarily the best gauge for TIMs in-application performance. Data generated by the OEM often differ from TIM supplier’s results, and thus can not be used confidently in thermal design. An OEM’s material selection can also prove to be unreliable when comparing data from different TIM suppliers. This paper presents a successful model that an OEM customer (Sun Microsystems) and a TIM supplier (LORD Corporation) have established for characterization of TIMs, and illustrates a package-level thermal test vehicle (TTV) setup for junction-to-sink thermal resistance measurements. Also presented are test results for several TIMs and repeatability of the test method. The effects of a few influencing factors, such as pressure load and TIM staging time, on the test results are also discussed.

Dynamic Characterization of Thermal Interface Material for Electronic Cooling

2003 ◽  
Author(s):  
Rocky Shih ◽  
Cullen E. Bash
Keyword(s):  
Standardized Testing ◽  
Test System ◽  
Independent Study ◽  
Test Method ◽  
Thermal Interface Material ◽  
Thermal Interface ◽  
Automated Test ◽  
And Performance ◽  
Interface Materials

The principle of measuring thermal resistance of thermal interface material (TIM) by sandwiching the material between a hot block and cold block is well known in the industry. TIM manufacturers usually use a variation of the industrial standard ASTM D5470 test method, and subsequently provide data that is difficult for the end user to effectively utilize for product development. This paper will discuss the design and construction of an automated TIM test system based on the ASTM D5470 standard. This automated test vehicle provides an independent study of various TIMs. The instrument enables standardized testing and performance documentation of interface materials from a wide array of manufacturers making it easier for end-users to compare and select the appropriate material for various applications. The automated test method is faster and easier to use than previous methods. It requires minimal operator intervention during the test and can perform preconditioning, and non-uniform heating if required. Experimental results obtained from the instrument will be discussed.

The Research of IC Test Based on LTX-77 Test System

2014 ◽  
Vol 496-500 ◽  
pp. 1176-1179
Author(s):  
Li Tan ◽  
Yu Fang
Keyword(s):  
Test Object ◽  
Test System ◽  
Test Method ◽  
Test Results ◽  
Analog Ic ◽  
Test Platform ◽  
Logic Functions ◽  
Actual Test ◽  
Ic Test

LTX-77 test system is a large IC test system that is used for various kinds of analog IC, digital IC and analog digital mixed IC. It can be used to test DC parameters, AC parameters and logic functions. In the paper, the IC test platform is LTX-77 test system. IC ADC0804 was tested as the test object. The test method of IC is described in the view of actual test. The test results show that the test system is convenient and accurate, which has important practical value for IC manufacturers and users.

The Improved Friction Properties of Bonded MoS2 Films by MAO Treating of Al Substrate

2013 ◽  
Vol 275-277 ◽  
pp. 1911-1914 ◽  
Author(s):  
Han Jun Hu ◽  
Hui Zhou ◽  
Yu Gang Zheng ◽  
Kai Feng Zhang ◽  
Zhi Hua Wan
Keyword(s):  
Tribological Properties ◽  
Solid Lubricants ◽  
Ceramic Coatings ◽  
Test System ◽  
Test Method ◽  
Test Results ◽  
Specimen Test ◽  
Micro Arc Oxidation ◽  
A New Technique ◽  
Porous Microstructures

The bonded MoS2 films are widely used as solid lubricants in aerospace mechanisms due to their excellent tribological properties. Traditionally, the MoS2 was directly bonded on the Al substrate that was only treated by the technique named of sandblast. For improving the tribological properties of MoS2 films, micro arc oxidation (MAO) instead of sandblast was introduced as a new technique for treating of Al substrate. In this article, the tribological properties of MoS2 films which were bonded on different surface of Al substrate as mentioned above were discussed, respectively. It was concluded from the test results that the MoS2 films bonded on substrate treated by MAO have better tribological properties than those samples treated by sandblast. The endurance life against abrasion of the former is as high as twenty times of the latter by the stand test method of ball on disk using the UMT Multi-Specimen Test System. This test results could be illustrated by the following reasons. The first is the porous microstructures of MAO ceramic coatings on the Al substrate. The coatings have numerous pits to be good at increasing the binding force with the MoS2 films, and the pits can also provide a MoS2 lubricants reservoir during processes of friction. Both of them improved the MoS2 film’s ability of wear-protective. The second is that hardness of the coating is higher than the Al, and this ensures well wearing resistance, especially in practical application to big load-supporting moving parts, such as bearing, gear, etc…

A Test Method of CCD Photoelectric Parameters

2011 ◽  
Vol 317-319 ◽  
pp. 1119-1122
Author(s):  
Nao Sheng Qiao ◽  
Chun Mei Yao ◽  
Yan Li ◽  
Xue Juan Chen
Keyword(s):  
Output Voltage ◽  
Measurement Method ◽  
Test System ◽  
Test Method ◽  
Test Results ◽  
The Real ◽  
Real Relation ◽  
Comparison Of The Results ◽  
The Ideal

Until now, no effective method to measure CCD photoelectric parameters. To solve the problem, a novel measurement method that combines hardware with software is proposed, and it can let hardware and software collaborate with each other to finish assignment together. Firstly, the ideal relation between output voltage and input exposure quantity of CCD is given. Secondly, some main photoelectric parameters of CCD are elaborated. Then based on the principle, test system of CCD photoelectric parameters that combines hardware with software is designed. Lastly, the real relation between output voltage and input exposure quantity of CCD is given, and the test results of experiment of each photoelectric parameter are obtained according to the relation. What’s more, analysis and comparison of the results of the experiment are given in this paper. The method is reliable and the precision is high in the experiment.

Simulation of Nano Carbon Tube (NCT) in Thermal Interface Material for Electronic Packaging Application by Using CFD Software

2014 ◽  
Vol 803 ◽  
pp. 337-342 ◽  
Author(s):  
Mazlan Mohamed ◽  
A.M. Mustafa Al Bakri ◽  
Razak Wahab ◽  
A.K. Zulhisyam ◽  
A.M. Iqbal ◽  
...  
Keyword(s):  
Electronic Packaging ◽  
Material Selection ◽  
Three Dimensional ◽  
Thermal Interface Material ◽  
Junction Temperature ◽  
Thermal Interface ◽  
Different Types ◽  
Fluent Software ◽  
Transfer Problems ◽  
Heat And Fluid Flow

This paper presents the nanocarbon tube in thermal interface material for electronic packaging application by using three dimensional numerical analysis of heat and fluid flow in computer. 3D model of electronic packaging is built using GAMBIT and simulated using FLUENT software. The study was made for a microprocessors arranged in line under different types of inlet velocities and package (chip) powers. The results are presented in terms of average junction temperature when chip powers have been increased from 2 W to 5 W. The junction temperature is been observed and it was found that the junction temperature of the electronic packaging using nanocarbon was able to wind stand the increasing in chip power from 2 W until 5 W. It also found that the material selection play important roles to control and manage the junction temperature. The strength of CFD software in handling heat transfer problems is proved to be excellent.

Measuring and Optimizing Thermal Interface Material Performance for VR Heatsink Designs

2015 ◽  
Author(s):  
Jun Lu ◽  
Michelle C. Lin ◽  
Bernie Short
Keyword(s):  
Thermal Performance ◽  
Mechanical Test ◽  
Thermal Interface Material ◽  
Thermal Testing ◽  
Performance Measurements ◽  
Thermal Interface ◽  
Test Board ◽  
And Performance ◽  
The Right ◽  
The Given

With increasingly high powers on processors, memories, and chipsets, the voltage regulators (VR) become heavily loaded and a heatsink is often required to prevent overheating the surrounding components on the board. For VR heatsink designs, thermal interface silicone gap filler pads are often used and there is an increasing need to improve VR thermal solutions by reducing thermal resistance of the TIM. A series of TIM2 thickness and performance measurements based on thermal testing was performed in order to understand gap filler characteristics, optimize TIM performance, and utilize best retention design. By utilizing a VR thermal and mechanical test board in wind tunnel testing using the same VR heatsink, thermal performance of TIM2 using gap filler pads over a range of airflow velocities can be measured and compared. The study shows how the optimum TIM performance can be achieved by using the gap filler pads with appropriate thickness for the given designed heatsink standoff heights. The benefit of choosing the right thickness pads over others can be significant and is a valuable learning that can be applied to future VR heatsink designs. Furthermore, the silicone gap filler characteristics and its relationship to board bending and result TIM thickness and thermal performance are investigated and further improved. The learnings help understand the limitations and where the area of improvement can be for future VR heatsink designs.

Comparison of Thermal Performance of Current High-End Thermal Interface Materials

2007 ◽  
Author(s):  
Gamal Refai-Ahmed ◽  
Zhaojuan He ◽  
Ellen Heian ◽  
Ramzi Vincent ◽  
Tim Rude ◽  
...  
Keyword(s):  
Thermal Performance ◽  
Phase Change Materials ◽  
Bond Line ◽  
Heat Sinks ◽  
Thermal Interface Material ◽  
Test Results ◽  
Thermal Interface ◽  
Graphics Processor ◽  
Significant Performance ◽  
Bonding Technology

Reactive NanoTechnologies (RNT) has developed a reactive bonding technology to directly bond silicon dies to heat sinks with indium solder using a reactive multilayered foil. In this new method of bonding, heat is generated locally by exothermic mixing within the multilayered foil. This heat is used to melt indium solder layers to join the dies to the heat sinks. The measured thermal resistance of the resulting solder bond is 4 to 5 K mm2/W (0.006 to 0.008 K in2/W). In addition, the reactive foil also localizes the heat to the interface, thus minimizing residual stress and thermal damage in the components. In this paper we discuss the thermal performance and reliability test results for reactive multilayer bonding with different bond line thicknesses. We also present detailed comparisons of thermal performance between reactive multilayer bonding and other current Thermal Interface Material (TIM) solutions, including polymer-based greases, phase change materials, and low melting metallic alloy. Benchmark tests were done using the graphics processor on an operational video card as a test vehicle. The test results show that the introduction of a reactive multilayer bond as an interface material between the graphics processor and the thermal management device demonstrates significant performance advantages over any of the other current commercially available TIM solutions.

scholarly journals The reliability acceleration test method of special vehicle transfer box

2021 ◽  
Vol 243 ◽  
pp. 02006
Author(s):  
Rui Liu ◽  
Wanying Liu ◽  
Yihui Zhao
Keyword(s):  
Product Development ◽  
New Product Development ◽  
New Product ◽  
Test System ◽  
Test Method ◽  
Reliability Test ◽  
Test Results ◽  
Development Cycle ◽  
Special Vehicle ◽  
Acceleration Test

This paper introduces the principle of the simulation load acceleration test system, the principle of accelerating test, and discusses the technology and method of the reliability acceleration test of the box.The accelerated test results show that the simulation load acceleration test can meet the reliability test of the unit, which can shorten the development cycle and have important production practical value for research and new product development.

Framework and performance analysis of college English testing system based on data mining technology

2021 ◽  
pp. 1-11
Author(s):  
Liu Narengerile ◽  
Li Di ◽  
Keyword(s):  
Data Mining ◽  
Test System ◽  
Test Time ◽  
Testing System ◽  
Test Results ◽  
System Software ◽  
Examination System ◽  
Mining Technology ◽  
College English ◽  
And Performance

At present, the college English testing system has become an indispensable system in many universities. However, the English test system is not highly humanized due to problems such as unreasonable framework structure. This paper combines data mining technology to build a college English test framework. The college English test system software based on data mining mainly realizes the computer program to automatically generate test papers, set the test time to automatically judge the test takers’ test results, and give out results on the spot. The test takers log in to complete the test through the test system software. The examination system software solves the functions of printing test papers, arranging invigilation classrooms, invigilating teachers, invigilating process, collecting test papers, scoring and analyzing test papers in traditional examinations. Finally, this paper analyzes the performance of this paper through experimental research. The research results show that the system constructed in this paper has certain practical effects.

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