Contact Angle Tuning of Copper Microporous Structures

2021 ◽  
Author(s):  
Farid Soroush ◽  
Tanya Liu ◽  
Qianying Wu ◽  
Mehdi Asheghi ◽  
Kenneth E. Goodson ◽  
...  

Abstract Two-phase, capillary-fed cooling devices are appealing thermal management technologies due to their potential for high heat transfer performance and ease of system-level integration. While existing evaporative wicking structures such as copper inverse opals (CIOs) and copper wire meshes (CWMs) have shown promise for achieving target heat dissipation rates of 100 Wcm−2 or greater, the reliability of these structures for long-term device operation and optimal capillary-driven boiling performance has not received much attention. To ensure proper functionality of the evaporator wick, the microporous copper structures must retain a hydrophilic contact angle during device operation. Surface oxidation of the copper is a critical degradation mechanism that must be addressed to preserve the integrity of the wick. In this study, we systematically investigate the contact angle change of untreated copper and various copper oxides under different conditions. To avoid the formation of hydrophobic Cu2O, we pre-oxidize the copper micro porous wick to form hydrophilic cupric oxide CuO and study the effect of various thermal and chemical oxidation recipes on the hydrophilicity and morphology of the resulting structures. A chemical oxidation formula is implemented for the creation of a stable superhydrophilic surface at a low temperature (70°C) for copper inverse opals (CIOs) (5 μm pore size) and copper wire meshes (CWMs) (76 μm pore opening). The recipe has been optimized to create nano CuO needles with a length of < 100 nm and keep the necks (∼1 μm diameter) open for better capillary wicking of the working fluid. The findings of this study potentially benefit the development of copper-based capillary-fed cooling devices.

Author(s):  
Yu Li ◽  
Shengke Yang ◽  
Yangyang Chen ◽  
Dan Zhang

The hydrophobicity and anti-fouling properties of materials have important application value in industrial and agricultural production and people’s daily life. To study the relationship between the unit width L0 of the parabolic hydrophobic material and the hydrophobicity and anti-fouling properties, the rough surface structure of the parabolic with different widths was prepared by grinding with different SiC sandpapers, and further, to obtain hydrophobic materials through chemical oxidation and chemical etching, and modification with stearic acid (SA). The morphology, surface wetting and anti-fouling properties of the modified materials were characterized by SEM and contact angle measurement. The oil–water separation performance and self-cleaning performance of the materials were explored. The surface of the modified copper sheet forms a rough structure similar to a paraboloid. When ground with 1500 grit SiC sandpaper, it is more conducive to increase the hydrophobicity of the copper sheet surface and increase the contact angle of water droplets on the copper surface. Additionally, the self-cleaning and anti-fouling experiments showed that as L0 decreases, copper sheets were less able to stick to foreign things such as soil, and the better the self-cleaning and anti-fouling performance was. Based on the oil–water separation experiment of copper mesh, the lower L0 has a higher oil–water separation efficiency. The results showed that material with parabolic morphology has great self-cleaning, anti-fouling, and oil–water separation performance. The smaller the L0 was, the larger the contact angle and the better hydrophobic performance and self-cleaning performance were.


Author(s):  
Ichiro Kano ◽  
Takahiro Sato ◽  
Naoki Okamoto

Boiling heat transfer enhancement via compound effect of Electro-Hydro-Dynamic (EHD) and contact angle has been experimentally and analytically investigated. A fluorinated dielectric liquid (Asahi Glass Co. Ltd, AE-3000) was selected as the working fluid. Pool boiling heat transfer in the saturated liquid was measured at atmospheric pressure. In order to change the contact angle between the boiling surface and the dielectric liquid, the different materials Cu, Cr, NiB, Sn, and mixture of 5 and 1.5 micro meter diamond particles were electrically deposited on a boiling surface. The critical heat flux (CHF) for different contact angles showed 20.5 ∼ 26.9 W/cm2 which was −7 ∼ 25 % of that for a non-coated Cu surface (21.5 W/cm2). Upon application of a −5 kV/mm electric field to the micro structured surface (the mixture of 5 and 1.5 micro meter particles), a CHF of 99 W/cm2 at a superheat of 33.5 K was obtained. The previous theoretical equation of pool boiling predicted the CHF with the electric field and without the electrode.


Author(s):  
Alexandru Herescu ◽  
Jeffrey S. Allen

The viscous deposition of a liquid film on the inside of a capillary has been experimentally investigated with a focus on the relationship between the film thickness and surface wettability. With distilled water as a working fluid tests were run in a 622 microns diameter glass tube with contact angles of 30° and 105°, respectively. In the first set of experiments the tube was uncoated while in the second set a fluoropolymer coating was applied to increase the contact angle. A film thickness dependence with the contact angle θ (surface wettability) as well as the Capillary number in the form hR ∼ Ca2/3/cosθ is inferred from scaling arguments. For partial wetting it may explain the existence of a thicker film for nonzero contact angle. It was further found that the non-wetting case of 105° contact angle deviates significantly from the existing theories, the film thickness presenting a weak dependence with the Capillary number. This deviation as well as the apparent non-uniqueness of the solution is thought to be caused by the film instability (rupture) observed during the tests. The thickness of the deposited film as a function of the Capillary number was estimated from the liquid mass exiting the capillary and the gas-liquid interface (meniscus) velocity, and compared to Bretherton’s data and a correlation proposed by Quere. The film thickness measurements as well as the meniscus velocity were determined with the aid of a Photron high speed camera with 10000 frames per second sampling capability coupled with a Nikon TE-2000 inverted microscope and a Precisa electronic balance.


2012 ◽  
Vol 58 (2) ◽  
Author(s):  
Fudhail Abd Munir ◽  
Mohd Irwan Mohd Azmi ◽  
Nadlene Razali ◽  
Ernie Mat Tokit

The effect of parameter changes on triangular shaped interrupted microchannel performance was studied by simulation using FLUENT software. The parameters that were studied are total length, and the contact angle. On the other hand, the investigated effects were pressure drop and platinum film temperature. The flow in microchannel is laminar and single phase. Water was used as the working fluid and the interrupted microchannel is made of silicon. A thin platinum film plate was deposited to provide uniform heat flux. The geometry dimension of the heat sink is 30 mm in length, width of 7 mm and the thickness of 0.525 mm. From the simulation results, it is found that the improvement on heat dissipation may be achieved by increasing the microchannel length at the expense of increase in pressure drop. In addition to that, by reducing the contact angle will result to reduction in term of pressure drop and increases the improvement thermal dissipation.


Author(s):  
Tushara Pasupuleti ◽  
Satish G. Kandlikar

An approach towards practical application of microchannel cooling system is necessary as the demand of high power density devices is increasing. Colgan et. al. [1] have designed a unit known as Single Chip Module (SCM) by considering the practical issues for packaging a microchannel cooling system with a microelectronic device. The performance of the SCM has already been investigated by using water as working fluid by Colgan et. al. [1]. Considering the actual working conditions, water cannot be used in electronic devices as the working fluid because any leakage may lead to system damage. Alternative fluids like refrigerants were considered. In this research, the performance of SCM has been studied by using refrigerant R-123 as working fluid and compared with water cooled system. Cooling of 83.33 W/cm2 has been achieved for a powered area of 3 cm2 by maintaining chip temperature of 60°C. The heat transfer co-efficient obtained at a flowrate of 0.7 lpm was 34.87 kW/m2-K. The results obtained indicate that from a thermal viewpoint, R-123 can be considered as working fluid for microelectronic cooling devices.


Author(s):  
Wangcun Jia ◽  
Vijay K. Dhir

Contact angle is a critical parameter needed in the mechanistic models for the prediction of flow boiling heat transfer. In this paper, variations of upstream and downstream contact angles for a single vapor bubble in flow boiling on horizontal and vertical surfaces were investigated experimentally. The nucleation site is a well-characterized cavity, which was etched on a highly polished silicon wafer surface using micro-fabrication techniques. Water at one atmosphere pressure was used as the working fluid. Photographic images of the bubble were recorded during its inception, growth and liftoff by using high-speed video system and analyzed by an image-processing program. The results provide clean data on the dependence of upstream and downstream contact angles on surface orientation and flow velocity.


Author(s):  
Asadullah Saeed ◽  
Ali Al-Alili

Fixed bed and rotatory desiccant systems have been widely studied and used for dehumidification; they suffer from decreasing sorption capacity as the desiccant’s temperature increases due to the released heat of adsorption. The desiccant coated heat exchangers (DCHX) overcome this limitation. Such heat exchangers are able to deliver combined heat and mass transfer between the process air and the working fluid. The process air can be cooled and dehumidified simultaneously by pumping cooling water/refrigerant in the DCHX. The DCHX has to be heated cyclically to regenerate the desiccant material. This paper presents a review on the studies conducted on air-to-liquid DCHX. It summarizes various modeling approaches used to simulate the performance of DCHX as well as the experimental studies conducted to validate these models. It also reviews the current and potential applications of these heat exchangers. Current work in this field consists of experiments conducted on the DCHX as standalone equipment (i.e. component level) as well as an integrated component into cooling and dehumidification systems (system level). The integration of the DCHX in such systems was found to improve the COP, leading to energy savings.


Author(s):  
Ying Zhang ◽  
Arun Kumar Narasimhan ◽  
Mengjie Bai ◽  
Li Zhao ◽  
Shuai Deng ◽  
...  

Abstract Solar driven ORC system is a possible solution for small-scale power generation. A scroll expander is considered due to its better suitability among other positive displacement expanders for small-scale power outputs. This work conducted a test of an ORC system with an expansion valve by varying the working fluid mass flow rate in two scenarios. A dynamic system-level model of ORC was developed and validated with experimental data. The validated model was used to predict the ORC performance considering off-design conditions of expander and solar insolation. The experimental data showed that pressures and temperatures exhibited the same trend as that of the working fluid mass flow rate, of which the evaporation pressure was the most sensitive to this variation. The simulation results are in good agreement with the experimental results. Results from the dynamic model showed that the ORC power output was underestimated by up to 54.7%, when off-design performance of expander was not considered. Considering the expander off-design performance and solar insolation, a highest thermal efficiency of 7.6% and an expander isentropic efficiency of 80.6% were achieved.


Author(s):  
Brian M. Fronk ◽  
Saad A. Jajja

This paper explores the interactions between micro-pin concentrated receiver designs with overall solar thermal energy system performance, with different operating conditions, working fluid, and required materials of construction. A 320 MW thermal plant coupled to a 160 MW electric sCO2 Brayton cycle is considered as the baseline. The circulating fluid enters the receiver at 550°C, and leaves at 720°C. The thermal storage/power block are located 150 m from the receiver at the base of the receiver tower. A resistance network based thermal and hydraulic model is used to predict heat transfer and pressure drop performance of the micro-pin receiver. This output of this model is coupled to a system level model of the pressure loss and compressor power required in the remainder of the high temperature gas loop. Overall performance is investigated for supercritical carbon dioxide and helium as working fluids, at pressures from 7.5 to 25 MPa, and at delivery temperatures of 720°C. The results show that by modifying pin depth and flow lengths, there are design spaces for micro-pin devices that can provide high thermal performance without significantly reducing the overall solar thermal system output at lower operating pressures. Use of lower pressure fluids enables lower cost materials of construction in the piping and distribution system, reducing the cost of electricity.


Author(s):  
Yoon Jo Kim ◽  
Sarah Kim ◽  
Yogendra K. Joshi ◽  
Andrei G. Fedorov ◽  
Paul A. Kohl

An ionic-liquid (IL) is a salt in a liquid state usually with an organic cation and inorganic anion. ILs provide an alternative to the normally toxic working fluids in absorption systems, such as the ammonia/water system. They also eliminate the problems of poor temperature match, crystallization and metal-compatibility problems of the water/LiBr system. In the present study, an IL is explored the working fluid of a miniature absorption refrigeration system so as to utilize waste-heat within the system for low-cost, high-power electronics cooling. To determine performance benchmarks for the refrigerant/IL (e.g. [bmim][PF6]) pairs, system-level simulations have been carried out. An NRTL model was built and used to predict the solubility of the mixture as well as the mixture properties such as enthalpy and entropy. The properties of the refrigerants were determined using REFPROP 6.0. Saturation temperatures at the evaporator and condenser were 25°C and 50°C, respectively. Chip power was fixed at 100 W with the operating temperature set at 85°C. R32 gave the highest operating efficiency with the maximum coefficient of performance (COP) of ca. 0.55 while R134a and R152a showed comparable performance with the maximum COP of ca. 0.4 at the desorber outlet temperature of 80°C. When waste-heat is available for the system operation, R134a and R152a COPs were comparable or better than that of R32.


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