Preferential crystal growth of germanium by solid phase crystallization

2014 ◽  
Vol 92 (7/8) ◽  
pp. 576-581 ◽  
Author(s):  
Mikuri Kanai ◽  
Yuji Kojima ◽  
Masao Isomura

We have investigated the preparation of crystalline germanium films by the solid phase crystallization (SPC) of amorphous germanium (a-Ge) precursor on single crystalline silicon substrates. The a-Ge precursor easily incorporates the impurities from the surface exposed to the air, and the impurities affect the crystallinity after the SPC. In the a-Ge precursor prepared by Knudsen-cell evaporation, the preferential crystalline growth following the Si substrates is disturbed by the high density of impurities and the random crystalline structures are formed. The a-Ge precursors prepared by electron beam evaporation have high impurity concentrations only near the surface because the impurity diffusion is slow because of the relatively high density. The preferential growth is successfully obtained in a-Ge precursor prepared on n-type Si substrates, although the random crystallization is slightly observed on p-type Si substrates. By sufficiently reducing the impurity concentrations by avoiding the air exposure, the preferential growth can be promoted on p-type Si substrates. The impurity incorporation because of the air exposure is sufficiently reduced for the preferential growth by covering a-Ge with a-Si blocking layers. This method is effective for future practical applications of SPC Ge films.

Author(s):  
А.О. Замчий ◽  
Е.А. Баранов ◽  
И.Е. Меркулова ◽  
Н.А. Лунев ◽  
В.А. Володин ◽  
...  

A novel fabrication method of polycrystalline silicon by indium-induced crystallization (InIC) of amorphous silicon suboxide thin films with a stoichiometric coefficient of 0.5 (a-SiO0.5) is proposed. It was shown that the use of indium in the annealing process of a SiO0.5 allowed to decrease the crystallization temperature to 600°С which was significantly lower than the solid-phase crystallization temperature of the material - 850°С. As a result of the high-vacuum InIC of a-SiO0.5, the formation of free-standing micron-sized crystalline silicon particles took place.


1990 ◽  
Vol 182 ◽  
Author(s):  
Ichio Yudasaka ◽  
Hiroyuki Ohshima

AbstractPolysilicon thin film transistors are now in mass production. Key factors of the success are thinner polysilicon film and thermal oxidation. Practical applications of polysilicon thin film transistors have been limited, however, because of high temperature processing. Alternative technologies to thermal oxidation are very low pressure deposition, solid-phase crystallization, laser-annealing and hydrogenation. These technologies are compatible with low temperature processing and will contribute to the advance of polysilicon thin film transistors in the future.


Author(s):  
Chih-Pin Lin ◽  
Hao-Hua Hsu ◽  
Jyun-Hong Huang ◽  
Yu-Wei Kang ◽  
Chien-Ting Wu ◽  
...  

The lack of effective synthesis techniques for achieving wafer-scale uniformity and high crystallinity remains one of the major obstacles for two-dimensional (2D) layered materials in practical applications. 2D solid-phase crystallization...


2011 ◽  
Vol 287-290 ◽  
pp. 2140-2143 ◽  
Author(s):  
Jian Huang ◽  
Lin Jun Wang ◽  
Ke Tang ◽  
Ji Jun Zhang ◽  
Wei Min Shi ◽  
...  

ZnS films were prepared by radio-frequency (RF) magnetron sputtering method. The effects of substrate temperature and annealing treatment on the properties of ZnS films were studied. The ZnS films were characterized by X-ray diffraction (XRD), UV-visible spectrophotometer, and electrical measurements. The results showed that the higher substrate temperature and post-deposition annealing treatment was helpful in improving the crystalline quality of the films, and the film had an n-type conductivity. N-type ZnS films were also deposited on p-type single-crystalline silicon (Si) substrates to fabricate ZnS/ Si heterojunction. The current-voltage (I-V) characteristic of the heterojunction was examined, which showed a rectifying behavior with turn-on voltage of about 2V.


2013 ◽  
Vol 1493 ◽  
pp. 59-64 ◽  
Author(s):  
Daniel Lockau ◽  
Tobias Sontheimer ◽  
Veit Preidel ◽  
Christiane Becker ◽  
Florian Ruske ◽  
...  

ABSTRACTRigorous finite element optical simulations have been used to examine the absorption of light in various crystalline silicon based, nanostructured solar cell architectures. The compared structures can all be produced on glass substrates using a periodically structured dielectric coating and a combination of electron-beam evaporation of silicon and subsequent solid phase crystallization. A required post-treatment by selective etching of non-compact silicon regions results in an absorber material loss. We show that by adequately tailoring the optical design around the processed silicon layer, the absorptance loss due to material removal can be completely overcome. The resulting silicon structure, which is an array of holes with non-vertical sidewalls, shows promising light path enhancement and features an even higher absorptance than the initial nanodome structure of the unetched absorber.


2017 ◽  
Vol 621 ◽  
pp. 207-210 ◽  
Author(s):  
Kyota Kuroiwa ◽  
Tetsuya Kaneko ◽  
Masao Isomura

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