A study of partial layout of adhesive on the thermal drift of MEMS capacitive accelerometers

2017 ◽  
Vol 31 (07) ◽  
pp. 1741006 ◽  
Author(s):  
Peng Peng ◽  
Wu Zhou ◽  
Huijun Yu ◽  
Qu Hao ◽  
Bei Peng ◽  
...  
Keyword(s):  
Thermal Stability ◽  
Thermal Drift ◽  
Mems Devices ◽  
Element Analysis ◽  
Adhesive Bonds ◽  
Microelectromechanical System ◽  
Die Attachment ◽  
Capacitive Accelerometer ◽  
Stress And Deformation ◽  
Thermal Stability Of

The die attachment adhesive is commonly fully deposited on the substrate to connect the chips and the package shell in the packaging of microelectromechanical system (MEMS) devices. The packaging stress and deformation will be changed under temperature variation and further impact the thermal stability of devices. This paper describes a partial layout of die attachment adhesive used in a comb MEMS capacitive accelerometer, which can attenuate the thermal deformation and reduce the thermal drift of the sensor. The accelerometers with the bonded area designed from the global portion to nonsensitive portion of the sensor die are modeled by using finite element analysis (FEA) to study the deformation of the sensitive component induced by temperature change, and the corresponding thermal drift is obtained by simulation and theoretical methods. Both the results indicate that the thermal drift will decrease when the length of the unbonded area is larger than about 700 μm, and when the adhesive bonds only in the area of the nonsensitive portion of the sensor, the thermal drift will reduce about 19% relative to the global attachment. The partial layout of die attachment adhesive is therefore a useful method to improve the thermal stability for stress-sensitive MEMS devices.

Syntheses, Crystal Structures and Thermal Stability of Co(II) and Zn(II) Complexes with Ethyl Carbazate

2005 ◽  
Vol 60 (5) ◽  
pp. 505-510 ◽  
Author(s):  
Tong-Lai Zhang ◽  
Jiang-Chuang Song ◽  
Jian-Guo Zhang ◽  
Gui-Xia Ma ◽  
Kai-Bei Yu
Keyword(s):  
Thermal Stability ◽  
Aqueous Solutions ◽  
Diffraction Analysis ◽  
Single Crystals ◽  
Slow Evaporation ◽  
X Ray Diffraction ◽  
Element Analysis ◽  
Thermal Stabilities ◽  
X Ray ◽  
Thermal Stability Of

Cobalt(II) and zinc(II) complexes of ethyl carbazate (ECZ), [Co(ECZ)3](NO3)2 and [Zn(ECZ)3] (NO3)2, were synthesized. Single crystals of these two compounds were grown from aqueous solutions using a slow evaporation method. Their structures have been determined by X-ray diffraction analysis. Both of them are monoclinic with space group P21/n. The complexes are further characterized by element analysis and IR measurements. Their thermal stabilities are studied by using TG-DTG, DSC techniques. When heated to 350 °C, only metal oxide was left for both complexes.

Finite Element Analysis and Optimization of Thermal Deformation of Resin Concrete Manufacturing Bases

2014 ◽  
Vol 543-547 ◽  
pp. 4010-4013
Author(s):  
Yao Chen ◽  
Xiu Xia Liang ◽  
Shuang Qiu
Keyword(s):  
Thermal Stability ◽  
Machine Tool ◽  
Thermal Deformation ◽  
Precision Machining ◽  
Element Analysis ◽  
Excellent Thermal Stability ◽  
Good Thermal Stability ◽  
Machining Center ◽  
Ultra Precision ◽  
Thermal Stability Of

Resin concrete generally has good mechanical properties, excellent thermal stability and great vibration resistance, the model of the ultra-precision machining center bed is established to study the thermal stability of the resin concrete using virtual reality and collaborative simulation technology based on Pro/E and ANSYS Workbench. The main factors that affect the machine tool bed thermal deformation were found through analyzing the deformation results and the materials and restrain conditions were optimized. The results proved that the optimized machine tool bed has good thermal stability and theoretical basis was provided to improve the thermal stability of the ultra-precision machining centers.

scholarly journals Design and Thermal Stability Analysis of Swing Micro-Mirror Structure for Gravitational Wave Observatory in Space

Machines ◽  
2021 ◽  
Vol 9 (5) ◽  
pp. 104
Author(s):  
Kunyao Zheng ◽  
Mingming Xu
Keyword(s):  
Thermal Stability ◽  
Gravitational Wave ◽  
Natural Frequency ◽  
Solution Method ◽  
Element Analysis ◽  
Temperature Changes ◽  
First Order ◽  
Angle Deviation ◽  
Thermal Stability Of ◽  
Mirror Structure

A kind of swing micro-mirror structure with high stability for gravitational wave observatory in space is proposed in this paper. As the key interface instrument in the gravitational wave observatory, the swing micro-mirror structure plays a very important role. Firstly, the 3D model of the mechanism is designed and established. Then, the solution method of the index of stability, pointing jitter, is researched. After that, the thermal stability and the first-order natural frequency of the mechanism are researched via finite element analysis. The first-order natural frequency of the mechanism is 247.55 Hz, which can meet the requirements of the design. It can be seen from the results of the simulation, the amplitude spectral density of the mirror angle deviation is 3.975 nrad/√Hz when the range of temperature variation is 0.1 °C, which is able to meet the requirements of the design. The thermal stability has a closed relationship with the structural stability around the X-axis. In addition, this article also studies the thermal stability of the mechanism in the case of temperature changes in different directions. It is found that the thermal stability of the mechanism around the Y-axis would be significantly affected by the temperature changes along the Y-axis.

The Influence of Die-Attach Adhesives on the Packaging of MEMS Accelerometer

2015 ◽  
Vol 645-646 ◽  
pp. 533-537 ◽  
Author(s):  
Peng Peng ◽  
Xiao Ping He ◽  
Lian Ming Du ◽  
Wu Zhou ◽  
Hui Jun Yu ◽  
...  
Keyword(s):  
Thermal Coefficient ◽  
Adhesive Material ◽  
Accelerometer Sensor ◽  
Element Analysis ◽  
Mems Accelerometer ◽  
Capacitive Accelerometer ◽  
Die Attach ◽  
Stress And Deformation ◽  
Output Characteristics ◽  
Significant Factors

The attachment of the micromechanical silicon die to the substrate is one of the most critical steps in the packaging of highly accurate MEMS (microelectro-mechanical systems) accelerometer. The stress and strains, induced during die-attach process because of TCE (thermal coefficient of expansion) mismatches between different materials, will adversely affect the output characteristics of the accelerometer sensor. In this paper, three different materials: OE138, DG-3S and H70E are selected as the die-attach adhesives of a MEMS comb capacitive accelerometer. The stress and deformation of the silicon die, after the accelerometer model is cured from 80 °C to 20 °C, are evaluated with the aid of finite element analysis (FEA). As the results show, Young’s modulus and the thickness of the adhesives are the most significant factors influencing the stress and deformation of the silicon die. Soft adhesive material (OE138) have better stress absorption, and the stress and deformation of the silicon die decrease with the increasing thickness of the adhesive. Consequently, a soft and thick adhesive is recommended for the die-attach packaging of MEMS accelerometer.

Rheological Properties of Wood-Plastic Composites Based on Polypropylene and Birch Wood Plywood Production Residues

2018 ◽  
Vol 762 ◽  
pp. 226-230 ◽  
Author(s):  
Janis Kajaks ◽  
Karlis Kalnins ◽  
Juris Matvejs
Keyword(s):  
Thermal Stability ◽  
Rheological Properties ◽  
Low Molecular Weight ◽  
Birch Wood ◽  
Capillary Rheometer ◽  
Wood Plastic Composites ◽  
Aliphatic Carboxylic Acid ◽  
Plastic Composites ◽  
Stress And Deformation ◽  
Thermal Stability Of

Article summarizes investigation results of rheological and thermal stability properties of industrially prepared wood plastic composites, based on virgin polypropylene and birch wood plywood production residues-plywood sanding dust (PSD). WPCs PP+40 wt. % PSD contain different modifiers, such as lubricant Struktol TWP (blend of an aliphatic carboxylic acid salts and mono and diamides), sterically hindered phenolic antioxidant 1010, thermal stabilizer 168 (hydrolytically stable phosphite), UV stabilizer 770-low molecular weight hindered amine light stabilizer (HALS) and pigments based on LDPE. According to our studies, we could conclude that rheological properties studied by capillary rheometer method, strongly depends on WPCs composition. MFI values fluctuate in limits from 0.212 up to 0.724 g/10min. that is changes 3.4 times. Thermal and antioxidant stabilizers promote increase of thermal stability of WPCs noted by TGA. Curves of fluidity indicates character of typical pseudo-plastic liquids for which viscosity not only depends on temperature and shear stress and deformation rate, but also decrease with increase of shear rate. That confirms fluidity index n values which are smaller than 1.

Study on Synthesis of Complexes of Maleamic Acid and Lanthanum Ion

2014 ◽  
Vol 881-883 ◽  
pp. 74-77
Author(s):  
Chuang Qian Chen ◽  
Kan She Li ◽  
Jie Kang ◽  
Jin Li
Keyword(s):  
Thermal Stability ◽  
Structural Formula ◽  
Reaction Conditions ◽  
Element Analysis ◽  
Lanthanum Ion ◽  
Lanthanide Metal ◽  
Maleamic Acid ◽  
Stability Time ◽  
Thermal Stability Of ◽  
Uv Absorption Spectrum

Double maleamic acid (DMA) was synthesized with maleic anhydride and ethylenediamine in this paper, and its lanthanide metal complex (LMC) was synthesized in aqueous solution with lanthanum chloride (LaCl).The reaction conditions and the product were determined by UV absorption spectrum, IR spectrum and element analysis. The results showed that the product is La (OH)[C10H10O6N2]·2H2O. And it is the structural formula of speculation. Congo red experiments show that the thermal stability of PVC product was improved significantly after blending with Poly Vinyl Chloride (PVC) and LMC. The thermal stability time can be up to 20 minutes.

Influence of Composition and Microstructure on the Mechanical Properties of SiC Ceramic Fibers

2015 ◽  
Vol 816 ◽  
pp. 163-168
Author(s):  
Yan Zi Gou ◽  
Hao Wang ◽  
Ke Jian ◽  
Yong Cai Song ◽  
Jun Wang
Keyword(s):  
Mechanical Properties ◽  
Thermal Stability ◽  
Tensile Strength ◽  
Outer Surface ◽  
Ceramic Fibers ◽  
Structural Morphology ◽  
Element Analysis ◽  
Sic Ceramic ◽  
Sintering Conditions ◽  
Thermal Stability Of

In this work, the influences of composition and microstructure on the mechanical properties and thermal stability of SiC ceramic fibers were investigated. XPS, XRD, SEM, and element analysis were used to analyze the elemental composition and structural morphology. The contents of oxygen and free carbon influence the crystallinity of SiC fibers, which inhibit the grain growth of β-SiC. The reduction of tensile strength of the fibers sintered under temperatures above 1700°C is attributed to the appearance of massive defects on the outer surface of the fibers, which can be overcome by the change of sintering conditions of the pyrolysis fibers.

High Performance Anisotropic Conductive Adhesives Using Copper Particles With an Anti-Oxidant Coating Layer

2010 ◽  
Vol 132 (1) ◽  
Author(s):  
Myung Jin Yim ◽  
Yi Li ◽  
Kyoung Sik Moon ◽  
C. P. Wong
Keyword(s):  
Thermal Stability ◽  
Coupling Agent ◽  
High Performance ◽  
Low Cost ◽  
Particle Surface ◽  
Surface Characteristics ◽  
Conductive Adhesives ◽  
Element Analysis ◽  
Copper Surfaces ◽  
Thermal Stability Of

This paper describes the development and characterization of anisotropically conductive films (ACFs) incorporated with copper (Cu) particles as electrically conductive fillers for environmentally friendly, low cost, high electrical, and high thermal interconnect applications in microelectronics packaging. The Cu particle surface modification by a coupling agent and its effects on the electrical conductivity and thermal stability of Cu-filled ACF joints were investigated for the potential alternatives of conventional Au-coated polymer and Au-coated Ni-filled ACFs. The surface characteristics of a thin film of the coupling agent on copper surfaces such as element analysis, their hydrophobicity, and thermal stability were evaluated. The treated Cu ball-filled ACF showed the lowest contact resistance 1.0×10−5 Ω, higher current carrying capability, and higher thermal stability of ACF joints compared with the conventional Au-coated polymer ball and Au-coated Ni ball-filled anisotropically conductive adhesives.

The Ordered Phase Formation in Ti-Al-Ga Alloys

1970 ◽  
Vol 28 ◽  
pp. 440-441
Author(s):  
Shiro Fujishiro ◽  
Harold L. Gegel
Keyword(s):  
Thermal Stability ◽  
High Temperature ◽  
Titanium Alloys ◽  
Growth Kinetics ◽  
Stoichiometric Composition ◽  
Good Potential ◽  
Alpha Titanium ◽  
Cold Rolled ◽  
Kinetics Of ◽  
Thermal Stability Of

Ordered-alpha titanium alloys having a DO19 type structure have good potential for high temperature (600°C) applications, due to the thermal stability of the ordered phase and the inherent resistance to recrystallization of these alloys. Five different Ti-Al-Ga alloys consisting of equal atomic percents of aluminum and gallium solute additions up to the stoichiometric composition, Ti3(Al, Ga), were used to study the growth kinetics of the ordered phase and the nature of its interface.The alloys were homogenized in the beta region in a vacuum of about 5×10-7 torr, furnace cooled; reheated in air to 50°C below the alpha transus for hot working. The alloys were subsequently acid cleaned, annealed in vacuo, and cold rolled to about. 050 inch prior to additional homogenization

Sign in / Sign up

Export Citation Format

Share Document