Electroless Nickel/Gold Under-Bump-Metallization Cost Comparisons

2019 ◽  
Vol 18 (1) ◽  
pp. 751-756 ◽  
Author(s):  
Andrew J. Strandjord ◽  
Axel Scheffler ◽  
Elke Zakel ◽  
Thomas Oppert ◽  
Thorsten Teutsch
Keyword(s):  
Electroless Nickel ◽  
Under Bump Metallization

Effect of Soldier Bump Size On Interfacial Reactions During Soldering Between PB–Free Solder and Cu and Cu Ni/Pd/Au Surface Finishes

2012 ◽  
Author(s):  
Nor Akmal Fadil ◽  
Ali Ourdjini ◽  
Azmah Hanim Mohamed Ariff ◽  
Siti Rabiatul Aisha Idris
Keyword(s):  
Intermetallic Compounds ◽  
Surface Finish ◽  
Isothermal Aging ◽  
Flip Chip ◽  
Electroless Nickel ◽  
Lead Free ◽  
Lead Free Solder ◽  
Under Bump Metallization ◽  
Surface Finishes ◽  
Free Solder

Teknologi flip chip memberikan ketumpatan I/O yang sangat tinggi dan mengambil kira prestasi elektrikal yang paling baik dalam penyambungan komponen elektronik. Oleh itu, kajian tentang sebatian antara logam dilaksanakan untuk mengkaji kesan saiz bebola pateri bagi beberapa penyudahan permukaan, iaitu Kuprum dan Nikel tanpa elektrod/Palladium tanpa elektrod/Emas rendaman (ENEPIG). Pelogaman di bawah pateri (UBM) Ni/Pd/Au bagi aplikasi flip chip digunakan dengan sangat meluas dalam pembungkusan elektronik. Analisis FESEM dilakukan untuk menganalisis morfologi dan komposisi bagi sebatian antara logam (IMC). IMC yang terbentuk antara pateri Sn–Pb dan tanpa Pb dengan penyudahan permukaan kuprum semasa proses pematrian logam secara umumnya adalah (Cu, Ni)6Sn5 dan Cu6Sn5 dan Cu6Sn5. Sementara IMC utama yang terbentuk antara pateri Sn–Pb dan tanpa Pb dengan penyudahan permukaan ENEPIG adalah (Ni, Cu)3Sn4 dan Ni3Sn4. Hasil daripada analisis morfologi menggunakan FESEM dengan EDX menyatakan penuaan sesuhu pada suhu 150°C menyebabkan penebalan dan pengasaran struktur IMC serta menjadikan bentuknya kepada lebih sfera. Tebal IMC bagi kedua–dua penyudahan yang dikaji adalah lebih tinggi bagi bebola patri yang lebih kecil. Daripada hasil kajian juga, didapati bahawa kadar pertumbuhan IMC adalah lebih tinggi apabila pematrian dilakukan atas penyudahan kuprum berbanding ENEPIG. Hasil kajian juga menunjukkan ketebalan IMC adalah berkadaran dengan masa penuaan sesuhu. Kata kunci: Flip chip; Kumprum dan Nikel tanpa elektrod; Palladium tanpa elektrod; Emas rendaman (ENEPIG); Pelogaman di bawah pateri (UMB) Ni/Pd/Au Flip chip technology provides the ultimate in high I/O–density and count with superior electrical performance for interconnecting electronic components. Therefore, the study of the intermetallic compounds was conducted to investigate the effect of solder bumps sizes on several surface finishes which are copper and Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) which is widely used in electronics packaging as under–bump metallization (UBM) for flip–chip application nowadays. In this research, field emission scanning electron microscopy (FE–SEM) analyses were conducted to analyze the morphology and composition of intermetallic compounds (IMCs) formed at the interface between the solder and UBM. The IMCs between Sn–Pb and lead–free solder with Cu surface finish during reflowing were mainly (Cu, Ni)6Sn5 dan Cu6Sn5. While the main IMCs formed between Sn–Pb and lead–free solder on ENEPIG surface finish are (Ni, Cu)3Sn4 and Ni3Sn4. The results from FESEM with energy dispersive x–ray (EDX) have revealed that isothermal aging at 150°C has caused the thickening and coarsening of IMCs as well as changing them into more spherical shape. The thickness of the intermetallic compounds in both finishes investigated ware found to be higher in solders with smaller bump size. From the experimental results, it also appears that the growth rate of IMCs is higher when soldering on copper compared to ENEPIG finish. Besides that, the results also showed that the thickness of intermetallic compounds was found to be proportional to isothermal aging duration. Key words: Electroless nickel; electroless palladium; immersion gold (ENEPIG); flip chip; Ni/Pd/Au Under–bump metallization (UMB)

The evaluation of mechanical stresses developed in underlying silicon substrates due to electroless nickel under bump metallization using synchrotron X-ray topography

2006 ◽  
Vol 37 (11) ◽  
pp. 1372-1378 ◽  
Author(s):  
D. Noonan ◽  
P.J. McNally ◽  
W.-M. Chen ◽  
A. Lankinen ◽  
L. Knuuttila ◽  
...  
Keyword(s):  
Electroless Nickel ◽  
Mechanical Stresses ◽  
Silicon Substrates ◽  
Under Bump Metallization ◽  
X Ray

Analysis of electroless nickel thin films

1991 ◽  
Vol 49 ◽  
pp. 510-511 ◽  
Author(s):  
C. W. Price ◽  
E. F. Lindsey
Keyword(s):  
Thin Films ◽  
Inertial Confinement Fusion ◽  
Electroless Nickel ◽  
Inertial Confinement ◽  
Plating Bath ◽  
X Ray ◽  
Nickel Thin Films ◽  
Nickel Deposits ◽  
Confinement Fusion ◽  
Thickness Measurements

Thickness measurements of thin films are performed by both energy-dispersive x-ray spectroscopy (EDS) and x-ray fluorescence (XRF). XRF can measure thicker films than EDS, and XRF measurements also have somewhat greater precision than EDS measurements. However, small components with curved or irregular shapes that are used for various applications in the the Inertial Confinement Fusion program at LLNL present geometrical problems that are not conducive to XRF analyses but may have only a minimal effect on EDS analyses. This work describes the development of an EDS technique to measure the thickness of electroless nickel deposits on gold substrates. Although elaborate correction techniques have been developed for thin-film measurements by x-ray analysis, the thickness of electroless nickel films can be dependent on the plating bath used. Therefore, standard calibration curves were established by correlating EDS data with thickness measurements that were obtained by contact profilometry.

ENPLATE NI-423

Alloy Digest ◽  
1986 ◽  
Vol 35 (11) ◽  
Keyword(s):  
Wear Resistance ◽  
Physical Properties ◽  
Surface Treatment ◽  
High Speed ◽  
Chemical Reduction ◽  
Electronic Devices ◽  
Electroless Nickel ◽  
Heat Treating ◽  
Corrosion And Wear ◽  
Phosphorus Alloy

Abstract ENPLATE NI-423 is a nickel-phosphorus alloy deposited by chemical reduction without electric current. It is deposited by a stable, relatively high-speed functional electroless nickel process that produces a low-stress coating with good ductility and excellent resistance to corrosion. Its many uses include equipment for chemicals and food, aerospace components, molds and electronic devices. This datasheet provides information on composition, physical properties, and hardness. It also includes information on corrosion and wear resistance as well as heat treating, machining, joining, and surface treatment. Filing Code: Ni-343. Producer or source: Enthone Inc..

ELECTROLESS NICKEL

Alloy Digest ◽  
1986 ◽  
Vol 35 (4) ◽  
Keyword(s):  
Nickel Coating ◽  
Chemical Reduction ◽  
Electroless Nickel ◽  
Heat Treating ◽  
Corrosion And Wear ◽  
Sodium Hypophosphite ◽  
Work Piece ◽  
Nickel Ions ◽  
Continuous Contact ◽  
Chemical Corporation

Abstract ELECTROLESS NICKEL is a nickel coating deposited by chemical reduction of nickel ions. The most widely used reducing agent is sodium hypophosphite. The thickness of the deposited coating is uniform over all areas of the work-piece that are in continuous contact with fresh plating solution. The process is applicable to a wide variety of metal and nonmetal substrates. This datasheet provides information on composition, physical properties, hardness, elasticity, and tensile properties. It also includes information on corrosion and wear resistance as well as heat treating and joining. Filing Code: Ni-332. Producer or source: Occidental Chemical Corporation.

Case Studies of Brittle Interfacial Failures in Area Array Solder Interconnects

2000 ◽  
Author(s):  
George M. Wenger ◽  
Richard J. Coyle ◽  
Patrick P. Solan ◽  
John K. Dorey ◽  
Courtney V. Dodd ◽  
...  
Keyword(s):  
Failure Analysis ◽  
Case Studies ◽  
Failure Modes ◽  
Electroless Nickel ◽  
Electrical Performance ◽  
Printed Wiring Board ◽  
Solder Interconnects ◽  
Area Array ◽  
Surface Finishes ◽  
Soldering Reaction

Abstract A common pad finish on area array (BGA or CSP) packages and printed wiring board (PWB) substrates is Ni/Au, using either electrolytic or electroless deposition processes. Although both Ni/Au processes provide flat, solderable surface finishes, there are an increasing number of applications of the electroless nickel/immersion gold (ENi/IAu) surface finish in response to requirements for increased density and electrical performance. This increasing usage continues despite mounting evidence that Ni/Au causes or contributes to catastrophic, brittle, interfacial solder joint fractures. These brittle, interfacial fractures occur early in service or can be generated under a variety of laboratory testing conditions including thermal cycling (premature failures), isothermal aging (high temperature storage), and mechanical testing. There are major initiatives by electronics industry consortia as well as research by individual companies to eliminate these fracture phenomena. Despite these efforts, interfacial fractures associated with Ni/Au surface finishes continue to be reported and specific failure mechanisms and root cause of these failures remains under investigation. Failure analysis techniques and methodologies are crucial to advancing the understanding of these phenomena. In this study, the scope of the fracture problem is illustrated using three failure analysis case studies of brittle interfacial fractures in area array solder interconnects. Two distinct failure modes are associated with Ni/Au surface finishes. In both modes, the fracture surfaces appear to be relatively flat with little evidence of plastic deformation. Detailed metallography, scanning electron microscopy (SEM), energy dispersive x-ray analysis (EDX), and an understanding of the metallurgy of the soldering reaction are required to avoid misinterpreting the failure modes.

scholarly journals Effect of Intermetallic Compound Bridging on the Cracking Resistance of Sn2.3Ag Microbumps with Different UBM Structures under Thermal Cycling

Metals ◽  
2021 ◽  
Vol 11 (7) ◽  
pp. 1065
Author(s):  
Chun-Chieh Mo ◽  
Dinh-Phuc Tran ◽  
Jing-Ye Juang ◽  
Chih Chen
Keyword(s):  
Electron Microscope ◽  
Intermetallic Compound ◽  
Thermal Cycling ◽  
Thermal Cycle ◽  
Crack Formation ◽  
Thermal Cycling Test ◽  
Under Bump Metallization ◽  
Reflow Time ◽  
Cracking Resistance ◽  
Scanning Electron

In this study, the effect of intermetallic compound (IMC) bridging on the cracking resistance of microbumps with two different under bump metallization (UBM) systems, Cu/solder/Cu and Cu/solder/Ni, under a thermal cycling test (TCT) is investigated. The height of the Sn2.3Ag solders was ~10 µm, which resembles that of the most commonly used microbumps. We adjusted the reflow time to control the IMC bridging level. The samples with different bridging levels were tested under a TCT (−55–125 °C). After 1000 and 2000 TCT cycles (30 min/cycle), the samples were then polished and characterized using a scanning electron microscope (SEM). Before IMC bridging, various cracks in both systems were observed at the IMC/solder interfaces after the 1000-cycle tests. The cracks propagated as cyclic shapes from the sides to the center and became more severe as the thermal cycle was increased. With IMC bridging, we could not observe any further failure in all the samples even when the thermal cycle was up to 2000. We discovered that IMC bridging effectively suppressed crack formation in microbumps under TCTs.

Effect of copper incorporation on phase transformation behavior of electroless nickel–phosphorous coating and its effect on the tribological behavior

2020 ◽  
pp. 146442072098160
Author(s):  
Abhijit Biswas ◽  
Suman Kalyan Das ◽  
Prasanta Sahoo
Keyword(s):  
Heat Treatment ◽  
Phase Transformation ◽  
Tribological Behavior ◽  
Electroless Nickel ◽  
Two Phase ◽  
Microstructural Changes ◽  
Treatment Conditions ◽  
Heat Treated ◽  
Higher Temperature ◽  
Effect Of Copper

The microstructural changes of electroless Ni–P–Cu coating at various heat-treatment conditions are investigated to understand its implications on the tribological behavior of the coating. Coatings are heat-treated at temperatures ranging between 200°C and 800 °C and for 1–4 h duration. Ni–P–Cu coatings exhibit two-phase transformations in the temperature range of 350–450 °C and the resulting microstructural changes are found to significantly affect their thermal stability and tribological attributes. Hardness of the coating doubles when heat-treated at 452 °C, due to the formation of harder Ni3P phase and crystalline NiCu. Better friction and wear performance are also noted upon heat treatment of the coating at the phase transformation regime, particularly at 400 °C. Wear mechanism is characterized by a mixed adhesive cum abrasive wear phenomena. Heat treatment at higher temperature (600 °C and above) and longer duration (4 h) results in grain coarsening phenomenon, which negatively influences the hardness and tribological characteristics of the coating. Besides, diffusion of iron from the ferrous substrate as well as greater oxide formation are noticed when the coating is heat-treated at higher temperatures and for longer durations (4 h).

Reactive Bilayers by Self-activated Electroless Nickel-Phosphorous Deposition on Pure Aluminum

JOM ◽  
2021 ◽  
Author(s):  
Meghna Narayanan ◽  
Allakonda Harsha ◽  
Anirban Chakraborty ◽  
Parasuraman Swaminathan
Keyword(s):  
Pure Aluminum ◽  
Electroless Nickel
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