Measurement of Elastic Strains in Crystal Surfaces by X-Ray Diffraction Topography

1967 ◽  
Vol 11 ◽  
pp. 385-393
Author(s):  
Brian R. Lawn
Keyword(s):  
Strain Field ◽  
Crystal Surface ◽  
Silicon Surfaces ◽  
X Ray Diffraction ◽  
Crystal Surfaces ◽  
Strain Fields ◽  
Diamond Surfaces ◽  
X Ray ◽  
Detailed Nature ◽  
Elastic Strains

AbstractThe use of X-ray topographic techniques for studying elastic strains in crystals deformed at their surfaces is becoming widespread, especially in the field of silicon semiconductor devices. Although the broad features of the phenomenological processes involved in producing the strain patterns on the X-ray micrographs are understood, little attention has been devoted to evaluating the detailed nature or range of the strain fields in the crystal. In this paper, an clastic model is proposed for cases in which a region of crystal surface is uniformly deformed over a thin layer. With this model, the associated strain field in the surrounding crystal, which is readily computed from elasticity theory, may be characterized by a single parameter. The model is in accord with observed strain patterns on topographs of abraded diamond surfaces and silicon surfaces onto which a strip of metal film has been evaporated. From the spatial range of the diffraction contrast, an estimate of the parameter characterizing the strain field may be made.

X-Ray Diffraction Contrast from Impurity Precipitates in CdS Single Crystals

1966 ◽  
Vol 10 ◽  
pp. 153-158 ◽  
Author(s):  
Jun-ichi Chikawa
Keyword(s):  
Strain Field ◽  
Crystal Surface ◽  
Bragg Angle ◽  
X Rays ◽  
Bragg Condition ◽  
X Ray Diffraction ◽  
Crystal Surfaces ◽  
X Ray ◽  
Impurity Doped ◽  
Free Plane

AbstractImpurity-doped crystals CdS(GaGl3) have been studied by X-ray topography. Some large precipitates are formed close to the crystal surfaces by annealing at 300°C. In the symmetrical Laue case, the precipitates show circular images (30-60 μ in diameter) due to the radial strains around the precipitates which consist of two semicircles separated by a contrast-free plane parallel to the reflecting plane. The observations indicate that the strain field between the crystal surface and precipitate is not responsible for the contrast, and that the images are formed by X-rays which are deviated from the Bragg condition for the perfect region and satisfy the Bragg condition in the strain field on the inside of the precipitate. One of the semicircles is formed by the incident X-rays with larger glancing angles than the Bragg angle and the other with smaller ones. It is concluded that this contrast is due to the strain around a convex lens shaped precipitate.

scholarly journals Strain mapping on gold thin film buckling and silicon blistering

2005 ◽  
Vol 875 ◽  
Author(s):  
P. Goudeau ◽  
N. Tamura ◽  
G. Parry ◽  
J. Colin ◽  
C. Coupeau ◽  
...  
Keyword(s):  
Thin Film ◽  
X Ray Diffraction ◽  
Crystal Surfaces ◽  
Strain Mapping ◽  
Strain Fields ◽  
Single Crystal Surfaces ◽  
X Ray ◽  
Gold Thin Film ◽  
Compressive Stresses ◽  
Strain Stress

AbstractStress/Strain fields associated with thin film buckling induced by compressive stresses or blistering due to the presence of gas bubbles underneath single crystal surfaces are difficult to measure owing to the microscale dimensions of these structures. In this work, we show that micro Scanning X-ray diffraction is a well suited technique for mapping the strain/stress tensor of these damaged structures.

The Evolution of Strain Relaxation Close to The Critical Thickness

1993 ◽  
Vol 317 ◽  
Author(s):  
P. Kidd ◽  
P.F. Fewster
Keyword(s):  
Residual Strain ◽  
Strain Field ◽  
Critical Thickness ◽  
Strain Relaxation ◽  
Epitaxial Layers ◽  
X Ray Diffraction ◽  
Strain Fields ◽  
X Ray ◽  
Local Relaxation ◽  
Homogeneous Strain

ABSTRACTHigh resolution X-ray diffraction space mapping has been used to follow the change in the distribution of residual strain and localised relaxation in low mismatched epitaxial layers. Using this new technique, we have obtained a series of diffraction space maps of partially relaxed epitaxial layers of In.1Ga.9As on GaAs. The layers have different thicknesses and hence different degrees of strain relaxation. The diffuse scatter close to the Bragg peaks provides information about the imperfect and distorted regions in the structure and this has allowed us to examine the extent and distribution of residual strain close to the dislocations. We have followed the evolution of local relaxation, which is confined initially to regions around isolated dislocations, through to the case of overlapping dislocation strain fields, leading to a more homogeneous strain field distribution and microscopic and macroscopic tilting of the layers.

scholarly journals Quantitative Imaging of the Stress/Strain Fields and Generation of Macroscopic Cracks from Indents in Silicon

2017 ◽  
Author(s):  
Brian K. Tanner ◽  
David Allen ◽  
Jochen Wittge ◽  
Andreas N. Danilewsky ◽  
Jorge Garagorri ◽  
...  
Keyword(s):  
Strain Field ◽  
Strain Relaxation ◽  
Quantitative Imaging ◽  
Mechanical Damage ◽  
X Ray Diffraction ◽  
Strain Fields ◽  
X Ray ◽  
Diffraction Imaging ◽  
Bevel Edge ◽  
Contrast Feature

The crack geometry and associated strain field around Berkovich and Vickers indents on silicon have been studied by X-ray diffraction imaging and micro-Raman spectroscopy scanning. The techniques are complementary, the Raman data coming from within a few micrometers of the indentation, whereas the X-ray image probes the strain field at a distance of typically tens of micrometers. For example, Raman data provides an explanation for the central contrast feature in the X-ray images of an indent. Strain relaxation from breakout and high temperature annealing are examined and it is demonstrated that millimeter length cracks, similar to those produced by mechanical damage from misaligned handling tools, can be generated in a controlled fashion by indentation within 75 micrometers of the bevel edge of 200mm diameter wafers.

SURFACE AND INTERFACE STRAINS REVEALED BY X-RAY DIFFRACTION

1999 ◽  
Vol 06 (06) ◽  
pp. 963-966 ◽  
Author(s):  
KOICHI AKIMOTO ◽  
TAKASHI EMOTO ◽  
YUYA ISHIKAWA ◽  
AYAHIKO ICHIMIYA
Keyword(s):  
Silicon Substrate ◽  
Strain Field ◽  
Theoretical Calculations ◽  
Incident Angle ◽  
Experimental Results ◽  
Lattice Expansion ◽  
X Rays ◽  
X Ray Diffraction ◽  
Strain Fields ◽  
X Ray

We measured strain fields near semiconductor surface by X-ray diffraction. The diffraction geometry was using the extremely asymmetric Bragg-case bulk reflection of a small incident angle to the surface and a large angle exiting from the surface. The incident angle of the X-rays was set near critical angle of total reflection by tuning X-ray energy of synchrotron radiation. The X-ray intensity of the silicon substrate 311 reflection was measured to study a Si(111) surface in the ultrahigh vacuum chamber. A clean Si (111)-(7 × 7) surface was found to give a sharper X-ray diffraction peak than that of the native oxide/Si(111) system. By comparison of experimental results and theoretical calculations, it was concluded that the thin silicon oxide film itself gives strong strain fields to the silicon substrates of lattice expansion toward the [311] direction. The strain fields at the Al- and Ag- induced [Formula: see text] surface reconstruction on the Si(111) substrate were also measured. By comparison of experimental results and theoretical calculations, Al-induced reconstruction was suggested to give a strain field to the silicon substrate of lattice expansion toward the [311] direction, whereas Ag-induced reconstruction was suggested to give a strain field to the silicon substrate of lattice compression toward the [311] direction.

Use of coherent X-ray diffraction to map strain fields in nanocrystals

2001 ◽  
Vol 182 (3-4) ◽  
pp. 186-191 ◽  
Author(s):  
I.K. Robinson ◽  
I.A. Vartanyants
Keyword(s):  
X Ray Diffraction ◽  
Strain Fields ◽  
X Ray

Grazing-angle Incidence X-ray Diffraction by the Si1-α(x)-β(x)Geβ(x)Cβ(x)/Si Heterojunction where the Germanium and the Carbon Concentrations are Periodically Varying along the Flat Layer Surface

2002 ◽  
Vol 716 ◽  
Author(s):  
Hayk H. Bezirganyan ◽  
Siranush E. Bezirganyan ◽  
Hakob P. Bezirganyan ◽  
Petros H. Bezirganyan
Keyword(s):  
Strain Field ◽  
Grazing Angle ◽  
Layer Surface ◽  
X Ray Diffraction ◽  
X Ray ◽  
Intermediate Transformation ◽  
Long Period ◽  
Theoretical Paper ◽  
Carbon Concentrations ◽  
Coherent Part

AbstractPresented theoretical paper concerns the investigation of SiGeC/Si heterojunction by the Grazing-angle Incidence X-ray Diffraction (GIXD) method. We consider a possibility in principal of the GIXD by the specific long-range harmonic variations of the germanium and carbon compositions in the thin SiGeC layer. Evaluation of the theoretically calculated coherent part of x-radiation scattered by the SiGeC layer points the way to the experimental direct investigations of the long-period structured intermediate transformation states of SiGeC layer that emerge owing to inhomogeneity of the strain field along the heterojunction surface.

Wettability and Nanotribological Response of Silicon Surfaces Functionalized by Ion Implantation

2012 ◽  
Vol 730-732 ◽  
pp. 257-262
Author(s):  
Bruno Nunes ◽  
Sergio Magalhães ◽  
Nuno Franco ◽  
Eduardo Alves ◽  
Ana Paula Serro ◽  
...  
Keyword(s):  
Electron Microscopy ◽  
Scanning Electron Microscopy ◽  
Ion Implantation ◽  
Silicon Surfaces ◽  
Iron Ions ◽  
X Ray Diffraction ◽  
X Ray ◽  
Force Microscopy ◽  
Atomic Force ◽  
Scanning Electron

Aiming to improve the nanotribological response of Si-based materials we implanted silicon wafers with different fluences of iron ions (up to 2x1017 cm-2). Implantation was followed by annealing treatments at temperatures from 550°C to 1000°C. The implanted surfaces were analyzed by scanning electron microscopy (SEM), X-ray diffraction (XRD), atomic force microscopy (AFM) and wettability tests. Then, samples were submitted to AFM-based nanowear tests. We observe an increase of both hidrophobicity and and wear resistance of the implanted silicon, indicating that ion implantation of Si can be a route to be deeper explored in what concerns tribomechanical improvement of Si.

Structural and superconducting properties of melt-grown Y–Ba–Cu–O superconductors

1996 ◽  
Vol 11 (10) ◽  
pp. 2406-2415 ◽  
Author(s):  
R. Gopalan ◽  
T. Rajasekharan ◽  
T. Roy ◽  
G. Rangarajan ◽  
V. Ganesan ◽  
...  
Keyword(s):  
Electron Microscopy ◽  
Strain Field ◽  
Crack Width ◽  
Growth Process ◽  
Critical Radius ◽  
Radius Of Curvature ◽  
Superconducting Properties ◽  
X Ray Diffraction ◽  
X Ray ◽  
Transmission Electron

YBa2Cu3O7 (123) samples with varying Y2BaCuO5 (211) concentrations (0 mol%, 20 mol%, 28 mol%, and 50 mol%) were synthesized by the melt-growth process. Microstructural characterizations were done using x-ray diffraction (XRD), optical microscopy, scanning electron microscopy, and transmission electron microscopy (TEM). It was found that 123 platelet width, crack width between the platelets, and 211 particle size decreased systematically with increasing 211 concentration. TEM study showed that there is a critical radius of curvature (rc ≤ 0.2 μm-0.3 μm) of the 123/211 interface where defects/contrasts of strain field start to appear, and these defects are believed to be responsible for pinning the magnetic flux. Microhardness measurements showed that Vickers hardness (VHN) increases with increasing 211 content. Critical current density (Jc) values obtained from magnetization measurements using a SQUID magnetometer were found to increase in melt-grown samples by the addition of 211 content.

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