scholarly journals Substrate integrated circuits for high frequency of opto electronics

2020 ◽  
Vol 9 (3) ◽  
pp. 224
Author(s):  
Mounika Punati ◽  
R. Yuvaraj
Keyword(s):  
Integrated Circuits ◽  
Millimeter Wave ◽  
High Frequency ◽  
Cutting Edge ◽  
Potential Outcomes ◽  
Work Patterns ◽  
Earth Models ◽  
Implementation Stages ◽  
Innovative Work

Another age of high-recurrence coordinated circuits is displayed, which is called substrate incorporated circuits (SICS). Current cutting edge of circuit plan and implementation stages dependent on this new idea are assessed and dis-cussed in delail. Various potential outcomes and various favorable circumstances of the SICS are appeared for microwave, millimeter-wave and opto hardware applications. Down to earth models are delineated with hypothetical and trial results for substrate coordinated waveguide (SIW), substrate incorporated chunk waveguide (SISW) and substrate incorporated non-transmitting dielectric (SI") direct circuits. Future innovative work patterns are likewise dis-cussed regarding ease imaginative plan of millimeter-wave and optoelectronic coordinated circuits.

scholarly journals Design of On chip Spiral Inductors for Millimeter Wave Frequency Synthesizers

2020 ◽  
Vol 14 ◽  
Keyword(s):  
Integrated Circuits ◽  
Millimeter Wave ◽  
High Frequency ◽  
Impedance Matching ◽  
Vital Role ◽  
Wave Band ◽  
Lumped Model ◽  
Lc Oscillator ◽  
On Chip ◽  
Millimeter Wave Oscillators

The energy storing element, inductor plays a vital role in CMOS based high frequency integrated circuits, especially in signal generation and impedance matching blocks.An on chip inductor is considered as a critical component because its performance directly impacts the associated circuitry when it is used as a load device or as a matching element. Out of the various requirements of an inductor which resides inside a chip, the inductance value,quality factor and self resonance frequency with smaller area is often preferred. This paper focuses on the lumped model of inductors for high frequency circuits working in the Millimeter wave region from 30 GHz to 300 GHz. For millimeter wave oscillators,inductance value in the range of pico Henry are essential and hence a complete model of an inductor is presented. Using electromagnetic simulator SONNET, all the parameters are extracted. The extracted model is used in the design of an LC Oscillator for millimeter wave band. A Q factor of 26 is achieved for an inductor value close to 153 pH at 60 GHz.The circuits employing this inductor shows promising results when simulated using 45 nm CMOS pdks

scholarly journals A RF Redundant TSV Interconnection for High Resistance Si Interposer

Micromachines ◽  
2021 ◽  
Vol 12 (2) ◽  
pp. 169
Author(s):  
Mengcheng Wang ◽  
Shenglin Ma ◽  
Yufeng Jin ◽  
Wei Wang ◽  
Jing Chen ◽  
...  
Keyword(s):  
Millimeter Wave ◽  
High Frequency ◽  
High Performance ◽  
Rapid Development ◽  
Coplanar Waveguide ◽  
Equivalent Circuit Model ◽  
High Resistivity ◽  
Performance Requirements ◽  
Wave Radar ◽  
Interconnect Design

Through Silicon Via (TSV) technology is capable meeting effective, compact, high density, high integration, and high-performance requirements. In high-frequency applications, with the rapid development of 5G and millimeter-wave radar, the TSV interposer will become a competitive choice for radio frequency system-in-package (RF SIP) substrates. This paper presents a redundant TSV interconnect design for high resistivity Si interposers for millimeter-wave applications. To verify its feasibility, a set of test structures capable of working at millimeter waves are designed, which are composed of three pieces of CPW (coplanar waveguide) lines connected by single TSV, dual redundant TSV, and quad redundant TSV interconnects. First, HFSS software is used for modeling and simulation, then, a modified equivalent circuit model is established to analysis the effect of the redundant TSVs on the high-frequency transmission performance to solidify the HFSS based simulation. At the same time, a failure simulation was carried out and results prove that redundant TSV can still work normally at 44 GHz frequency when failure occurs. Using the developed TSV process, the sample is then fabricated and tested. Using L-2L de-embedding method to extract S-parameters of the TSV interconnection. The insertion loss of dual and quad redundant TSVs are 0.19 dB and 0.46 dB at 40 GHz, respectively.

scholarly journals Force detection of high-frequency electron spin resonance near room temperature using high-power millimeter-wave source gyrotron

2021 ◽  
Vol 118 (2) ◽  
pp. 022407
Author(s):  
Hideyuki Takahashi ◽  
Yuya Ishikawa ◽  
Tsubasa Okamoto ◽  
Daiki Hachiya ◽  
Kazuki Dono ◽  
...  
Keyword(s):  
Electron Spin Resonance ◽  
Millimeter Wave ◽  
Electron Spin ◽  
High Power ◽  
High Frequency ◽  
Room Temperature ◽  
Force Detection ◽  
Wave Source ◽  
Spin Resonance ◽  
Millimeter Wave Source

scholarly journals Optimization of spaceflight millimeter-wave impedance matching networks using laser trimming

2021 ◽  
pp. 1-7
Author(s):  
K. Parow-Souchon ◽  
D. Cuadrado-Calle ◽  
S. Rea ◽  
M. Henry ◽  
M. Merritt ◽  
...  
Keyword(s):  
Integrated Circuits ◽  
Millimeter Wave ◽  
Impedance Matching ◽  
Wave Impedance ◽  
Low Noise ◽  
Device Performance ◽  
Interface Circuits ◽  
Interface Circuit ◽  
Noise Amplifier

Abstract Realizing packaged state-of-the-art performance of monolithic microwave integrated circuits (MMICs) operating at millimeter wavelengths presents significant challenges in terms of electrical interface circuitry and physical construction. For instance, even with the aid of modern electromagnetic simulation tools, modeling the interaction between the MMIC and its package embedding circuit can lack the necessary precision to achieve optimum device performance. Physical implementation also introduces inaccuracies and requires iterative interface component substitution that can produce variable results, is invasive and risks damaging the MMIC. This paper describes a novel method for in situ optimization of packaged millimeter-wave devices using a pulsed ultraviolet laser to remove pre-selected areas of interface circuit metallization. The method was successfully demonstrated through the optimization of a 183 GHz low noise amplifier destined for use on the MetOp-SG meteorological satellite series. An improvement in amplifier output return loss from an average of 12.9 dB to 22.7 dB was achieved across an operational frequency range of 175–191 GHz and the improved circuit reproduced. We believe that our in situ tuning technique can be applied more widely to planar millimeter-wave interface circuits that are critical in achieving optimum device performance.

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