scholarly journals CrFe 2O4 - BiFeO3 Perovskite Multiferroic Nanocomposites – A Review

2014 ◽  
Vol 11 (2) ◽  
pp. 128-145 ◽  
Author(s):  
Ratnakar Pandu
Keyword(s):  
Nonvolatile Memory ◽  
Ferroelectric Properties ◽  
Tungsten Bronze ◽  
Random Access ◽  
Frequency Dispersion ◽  
Processing Technique ◽  
Conductive Composites ◽  
Peak Broadening ◽  
High Dielectric ◽  
Ferroelectric Hysteresis

Though semiconductor technology has advanced significantly in miniaturization and processor speed the “ideal” nonvolatile memory - memory that retains information even when the power goes is still elusive. There is a large demand for non-volatile memories with the popularity of portable electronic devices like cell phones and note books. Semiconductor memories like SRAMs and DRAMs are available but, such memories are volatile. After the advent of ferroelectricity many materials with crystal structures of Perovskite, pyrochlore and tungsten bronze have been derived and studied for the applications in memory devices. Ferroelectric Random Access Memories (FeRAM) are most promising. They are nonvolatile and have the greater radiation hardness and higher speed. These devices use the switchable spontaneous polarization arising suitable positional bi-stability of constituent ions and store the information in the form of charge. This paper is focused on the synthesis and characterizations of BiFeO3 and xCrFe2O4-(1-x) BiFeO3 nanoceramics which are most promising FeRAM materials. The effect of various-dopant-induced changes in structural, dielectric, ac impedance, ferroelectric hysteresis, mechanism of the dielectric peak broadening and frequency dispersion have been addressed. It also deals with low temperature processing technique of those nanoceramics which has high dielectric and ferroelectric properties. These studies can be further extended to reinforce BiFeO3 and CrFeO4 materials with carbon nanotubes to obtain conductive composites using appropriate techniques.

Epitaxial ferroelectric thin films

1994 ◽  
Vol 52 ◽  
pp. 572-573
Author(s):  
S. G. Ghonge ◽  
E. Goo ◽  
R. Ramesh ◽  
R. Haakenaasen ◽  
D. K. Fork
Keyword(s):  
Single Crystal ◽  
Work Function ◽  
Nonvolatile Memory ◽  
Ferroelectric Properties ◽  
Electrical Contact ◽  
Memory Devices ◽  
Ferroelectric Films ◽  
Si Substrates ◽  
Electro Optic ◽  
Wide Range

Microstructure of epitaxial ferroelectric/conductive oxide heterostructures on LaAIO3(LAO) and Si substrates have been studied by conventional and high resolution transmission electron microscopy. The epitaxial films have a wide range of potential applications in areas such as non-volatile memory devices, electro-optic devices and pyroelectric detectors. For applications such as electro-optic devices the films must be single crystal and for applications such as nonvolatile memory devices and pyroelectric devices single crystal films will enhance the performance of the devices. The ferroelectric films studied are Pb(Zr0.2Ti0.8)O3(PLZT), PbTiO3(PT), BiTiO3(BT) and Pb0.9La0.1(Zr0.2Ti0.8)0.975O3(PLZT).Electrical contact to ferroelectric films is commonly made with metals such as Pt. Metals generally have a large difference in work function compared to the work function of the ferroelectric oxides. This results in a Schottky barrier at the interface and the interfacial space charge is believed to responsible for domain pinning and degradation in the ferroelectric properties resulting in phenomenon such as fatigue.

scholarly journals Investigation of PVT-Aware STT-MRAM Sensing Circuits for Low-VDD Scenario

Micromachines ◽  
2021 ◽  
Vol 12 (5) ◽  
pp. 551
Author(s):  
Zhongjian Bian ◽  
Xiaofeng Hong ◽  
Yanan Guo ◽  
Lirida Naviner ◽  
Wei Ge ◽  
...  
Keyword(s):  
Nonvolatile Memory ◽  
High Speed ◽  
Low Voltage ◽  
Supply Voltage ◽  
Random Access ◽  
Magnetic Tunnel Junction ◽  
Complementary Metal Oxide Semiconductor ◽  
Current Mode ◽  
Cmos Technology ◽  
Oxide Semiconductor

Spintronic based embedded magnetic random access memory (eMRAM) is becoming a foundry validated solution for the next-generation nonvolatile memory applications. The hybrid complementary metal-oxide-semiconductor (CMOS)/magnetic tunnel junction (MTJ) integration has been selected as a proper candidate for energy harvesting, area-constraint and energy-efficiency Internet of Things (IoT) systems-on-chips. Multi-VDD (low supply voltage) techniques were adopted to minimize energy dissipation in MRAM, at the cost of reduced writing/sensing speed and margin. Meanwhile, yield can be severely affected due to variations in process parameters. In this work, we conduct a thorough analysis of MRAM sensing margin and yield. We propose a current-mode sensing amplifier (CSA) named 1D high-sensing 1D margin, high 1D speed and 1D stability (HMSS-SA) with reconfigured reference path and pre-charge transistor. Process-voltage-temperature (PVT) aware analysis is performed based on an MTJ compact model and an industrial 28 nm CMOS technology, explicitly considering low-voltage (0.7 V), low tunneling magnetoresistance (TMR) (50%) and high temperature (85 °C) scenario as the worst sensing case. A case study takes a brief look at sensing circuits, which is applied to in-memory bit-wise computing. Simulation results indicate that the proposed high-sensing margin, high speed and stability sensing-sensing amplifier (HMSS-SA) achieves remarkable performance up to 2.5 GHz sensing frequency. At 0.65 V supply voltage, it can achieve 1 GHz operation frequency with only 0.3% failure rate.

Relaxor behavior and ferroelectric properties of a new Ba 4 SmFe 0.5 Nb 9.5 O 30 tungsten bronze ceramic

2016 ◽  
Vol 42 (13) ◽  
pp. 14999-15004 ◽  
Author(s):  
Changzheng Hu ◽  
Zhen Sun ◽  
Qihua Zhu ◽  
Fengqi Lu ◽  
Chunchun Li ◽  
...  
Keyword(s):  
Ferroelectric Properties ◽  
Tungsten Bronze ◽  
Relaxor Behavior

Hydrothermal synthesis of heteroepitaxial Pb(ZrxTi1−x)O3 thin films at 90–150 °C

1997 ◽  
Vol 12 (5) ◽  
pp. 1176-1178 ◽  
Author(s):  
A. T. Chien ◽  
J. S. Speck ◽  
F. F. Lange
Keyword(s):  
Thin Films ◽  
Low Temperatures ◽  
High Dielectric Constant ◽  
Ambient Pressure ◽  
Random Access ◽  
Random Access Memory ◽  
Molar Ratio ◽  
Access Memory ◽  
Eds Analysis ◽  
High Dielectric

Pb(ZrxTi1−x)O3 and PbZrO3 heteroepitaxial thin films were produced in an aqueous solution (10 M KOH) at ambient pressure and low temperatures (90–150 °C) on (001) SrTiO3 and LaAlO3 single crystal substrates. Growth of the Pb(ZrxTi1−x)O3 and PbZrO3 thin films initiates by the formation of {100} faceted islands. Energy dispersive spectroscopy (EDS) analysis of the Pb(ZrxTi1−x)O3 thin film shows that the Zr: Ti ratio is 45: 56, nearly identical to the molar ratio of the precursors. This route might provide a viable low temperature alternative for the formation of high dielectric constant thin films for applications such as dynamic random access memory (DRAM).

Crystalline and Electrical Properties of Ferroelectric Silver Niobate-tantalate thin Films

2000 ◽  
Vol 655 ◽  
Author(s):  
Jung-Hyuk Koh ◽  
S.I. Khartsev ◽  
Alex Grishin ◽  
Vladimir Petrovsky
Keyword(s):  
Temperature Stability ◽  
Frequency Dispersion ◽  
Processing Temperature ◽  
High Temperature Stability ◽  
X Ray Diffraction ◽  
Ferroelectric State ◽  
X Ray ◽  
Ferroelectric Hysteresis ◽  
First Time

AbstractFor the first time AgTa0.38Nb0.62O3 (ATN) films have been grown on the La0.7Sr0.3CoO3 (LSCO)/LaAlO3 single crystal as well as onto Pt80Ir20 (PtIr) polycrystalline substrate. Comprehensive X-ray diffraction analyses reveal epitaxial quality of ATN and LSCO films on the LaAlO3(001) substrate, while ATN/PtIr films have been found to be (001) preferentially oriented. Dielectric spectroscopy performed for ATN films and bulk ceramics in a wide temperature range 77 to 420 K shows the structural monoclinic M1-to-monoclinic M2 phase transition occurs in films at the temperature 60 °C lower than in ceramics. The tracing of the ferroelectric hysteresis P-E loops indicates the ferroelectric state in ATN films at temperatures below 125 K and yields remnant polarization of 0.4 μC/cm2 @ 77 K. Weak frequency dispersion, high temperature stability of dielectric properties as well as low processing temperature of 550 °C make ATN films to be attractive for various applications.

Dielectric and ferroelectric properties of Sr 4 CaSmTi 3 Nb 7 O 30 with tetragonal tungsten bronze structure

2014 ◽  
Vol 23 (9) ◽  
pp. 097701
Author(s):  
Gao-Shang Gong ◽  
Yu-Jiao Fang ◽  
Shuai Huang ◽  
Chong-Yang Yin ◽  
Song-Liu Yuan ◽  
...  
Keyword(s):  
Ferroelectric Properties ◽  
Tungsten Bronze ◽  
Tungsten Bronze Structure ◽  
Tetragonal Tungsten Bronze

Sputter Synthesis of Ferroelectric Films and Heterostructures

MRS Bulletin ◽  
1996 ◽  
Vol 21 (6) ◽  
pp. 25-30 ◽  
Author(s):  
O. Auciello ◽  
A.I. Kingon ◽  
S.B. Krupanidhi
Keyword(s):  
Ion Beam ◽  
Random Access ◽  
Chemical Vapor ◽  
Ferroelectric Materials ◽  
Process Technology ◽  
Ferroelectric Films ◽  
Pyroelectric Properties ◽  
Wide Range ◽  
High Dielectric ◽  
New Generation

Ferroelectric films can display a wide range of dielectric, ferroelectric, piezoelectric, electrostrictive, and pyroelectric properties. The potential utilization of these properties in a new generation of devices has driven the intensive studies on the synthesis, characterization, and determination of processing-microstructure-property relationships of ferroelectric thin films during the last five years. In addition there has been an increased drive for integrating ferroelectric film-based heterostructures with different substrate materials to demonstrate numerous devices that exploit the dielectric, ferroelectric, piezoelectric, electrostrictive, and pyroelectric properties of these materials. For example the high dielectric permittivities of perovskite-type materials can be advantageously used in dynamic random-access memories (DRAMs), while the large values of switchable remanent polarization of ferroelectric materials are suitable for nonvolatile ferroelectric random-access memories (NVFRAMs).Various vapor-phase deposition techniques such as plasma and ion-beam sputter deposition (PSD and IBSD, respectively), pulsed laser-ablation deposition (PLAD), electron-beam or oven-induced evaporation for molecular-beam epitaxy (MBE), and chemical vapor deposition (CVD) have been applied to produce ferroelectric films and layered heterostructures. See References 4–7 for recent reviews. However, work is still necessary to optimize the techniques to produce device-quality films on large semiconductor substrates in a way that is fully compatible with existing semiconductor process technology. Therefore research efforts should be focused on the optimization of suitable process methods and on the investigation of processing-composition-microstructure property relationships. These efforts are the focus of this article with emphasis on PSD and IBSD techniques.

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