scholarly journals Investigation of PVT-Aware STT-MRAM Sensing Circuits for Low-VDD Scenario

Micromachines ◽  
2021 ◽  
Vol 12 (5) ◽  
pp. 551
Author(s):  
Zhongjian Bian ◽  
Xiaofeng Hong ◽  
Yanan Guo ◽  
Lirida Naviner ◽  
Wei Ge ◽  
...  
Keyword(s):  
Nonvolatile Memory ◽  
High Speed ◽  
Low Voltage ◽  
Supply Voltage ◽  
Random Access ◽  
Magnetic Tunnel Junction ◽  
Complementary Metal Oxide Semiconductor ◽  
Current Mode ◽  
Cmos Technology ◽  
Oxide Semiconductor

Spintronic based embedded magnetic random access memory (eMRAM) is becoming a foundry validated solution for the next-generation nonvolatile memory applications. The hybrid complementary metal-oxide-semiconductor (CMOS)/magnetic tunnel junction (MTJ) integration has been selected as a proper candidate for energy harvesting, area-constraint and energy-efficiency Internet of Things (IoT) systems-on-chips. Multi-VDD (low supply voltage) techniques were adopted to minimize energy dissipation in MRAM, at the cost of reduced writing/sensing speed and margin. Meanwhile, yield can be severely affected due to variations in process parameters. In this work, we conduct a thorough analysis of MRAM sensing margin and yield. We propose a current-mode sensing amplifier (CSA) named 1D high-sensing 1D margin, high 1D speed and 1D stability (HMSS-SA) with reconfigured reference path and pre-charge transistor. Process-voltage-temperature (PVT) aware analysis is performed based on an MTJ compact model and an industrial 28 nm CMOS technology, explicitly considering low-voltage (0.7 V), low tunneling magnetoresistance (TMR) (50%) and high temperature (85 °C) scenario as the worst sensing case. A case study takes a brief look at sensing circuits, which is applied to in-memory bit-wise computing. Simulation results indicate that the proposed high-sensing margin, high speed and stability sensing-sensing amplifier (HMSS-SA) achieves remarkable performance up to 2.5 GHz sensing frequency. At 0.65 V supply voltage, it can achieve 1 GHz operation frequency with only 0.3% failure rate.

Performance analysis of differential spin hall effect (DSHE)-MRAM-based logic gates

Circuit World ◽  
2019 ◽  
Vol 45 (4) ◽  
pp. 300-310
Author(s):  
Piyush Tankwal ◽  
Vikas Nehra ◽  
Sanjay Prajapati ◽  
Brajesh Kumar Kaushik
Keyword(s):  
Hall Effect ◽  
Random Access ◽  
Magnetic Tunnel Junction ◽  
Complementary Metal Oxide Semiconductor ◽  
Logic Gates ◽  
Cmos Technology ◽  
Spin Transfer Torque ◽  
Spin Hall Effect ◽  
Oxide Semiconductor ◽  
Content Type

Purpose The purpose of this paper is to analyze and compare the characteristics of hybrid conventional complementary metal oxide semiconductor/magnetic tunnel junction (CMOS/MTJ) logic gates based on spin transfer torque (STT) and differential spin Hall effect (DSHE) magnetic random access memory (MRAM). Design/methodology/approach Spintronics technology can be used as an alternative to CMOS technology as it is having comparatively low power dissipation, non-volatility, high density and high endurance. MTJ is the basic spin based device that stores data in form of electron spin instead of charge. Two mechanisms, namely, STT and SHE, are used to switch the magnetization of MTJ. Findings It is observed that the power consumption in DSHE based logic gates is 95.6% less than the STT based gates. DSHE-based write circuit consumes only 5.28 fJ energy per bit. Originality/value This paper describes how the DSHE-MRAM is more effective for implementing logic circuits in comparison to STT-MRAM.

A New Technique for Designing Low-Power High-Speed Domino Logic Circuits in FinFET Technology

2019 ◽  
Vol 28 (10) ◽  
pp. 1950165 ◽  
Author(s):  
Sandeep Garg ◽  
Tarun K. Gupta
Keyword(s):  
Low Power ◽  
High Speed ◽  
Supply Voltage ◽  
Complementary Metal Oxide Semiconductor ◽  
Cmos Technology ◽  
Power Reduction ◽  
Maximum Power ◽  
Oxide Semiconductor ◽  
Domino Logic ◽  
Maximum Delay

In this paper, a fin field-effect transistor (FinFET)-based domino technique dynamic node-driven feedback transistor domino logic (DNDFTDL) is designed for low-power, high-speed and improved noise performance. In the proposed domino technique, the concept of current division is explored below the evaluation network for enhancement of performance parameters. Simulations are carried out for 32-nm complementary metal–oxide–semiconductor (CMOS) and FinFET node using HSPICE for 2-, 4-, 8- and 16-input OR gates with a DC supply voltage of 0.9[Formula: see text]V. Proposed technique shows a maximum power reduction of 73.93% in FinFET short-gate (SG) mode as compared to conditional stacked keeper domino logic (CSKDL) technique and a maximum power reduction of 72.12% as compared to modified high-speed clocked delay domino logic (M-HSCD) technique in FinFET low-power (LP) mode. The proposed technique shows a maximum delay reduction of 35.52% as compared to voltage comparison domino (VCD) technique in SG mode and a reduction of 25.01% as compared to current mirror footed domino logic (CMFD) technique in LP mode. The unity noise gain (UNG) of the proposed circuit is 1.72–[Formula: see text] higher compared to different existing techniques in FinFET SG mode and is 1.42–[Formula: see text] higher in FinFET LP mode. The Figure of Merit (FOM) of the proposed circuit is up to [Formula: see text] higher as compared to existing domino logic techniques because of lower values of power, delay and area and higher values of UNG of the proposed circuit. In addition, the proposed technique shows a maximum power reduction of up to 68.64% in FinFET technology as compared to its counterpart in CMOS technology.

scholarly journals An Analogue Multiplier using CNTFET Technology

2020 ◽  
Vol 19 ◽  
Keyword(s):  
Analog Circuits ◽  
Supply Voltage ◽  
Complementary Metal Oxide Semiconductor ◽  
Current Mode ◽  
Cmos Technology ◽  
Oxide Semiconductor ◽  
Analog Multiplier ◽  
Effect Transistor ◽  
Four Quadrant ◽  
Better Than

The endeavor to overcome problems of complementary metal oxide semiconductor technology makes the advent of Carbon nanotube field effect transistor (CNTFET). Improvement of structure transistor CNTFET makes higher mobility and electrostatics of gate electrons. Therefore, many analog circuits are now designed based on CNTFET technology. This paper presents a low power current mode four-quadrant analog multiplier based on CNTFET and CMOS technologies. All simulations were done with the synopsys Hspice simulator using 32nm CNTFET model from Stanford University and 32nm CMOS from PTM library at a supply voltage of 3.3 v. It was shown that the simulation of a multiplier based on CNTFET technology performs better than a multiplier based on CMOS technology.

scholarly journals MCML D-Latch Using Triple-Tail Cells: Analysis and Design

2013 ◽  
Vol 2013 ◽  
pp. 1-9 ◽  
Author(s):  
Kirti Gupta ◽  
Neeta Pandey ◽  
Maneesha Gupta
Keyword(s):  
High Speed ◽  
Analytical Modeling ◽  
Low Voltage ◽  
Supply Voltage ◽  
Current Mode ◽  
Cmos Technology ◽  
Power Efficient ◽  
Analysis And Design ◽  
Current Mode Logic ◽  
Voltage Swing

A new low-voltage MOS current mode logic (MCML) topology for D-latch is proposed. The new topology employs a triple-tail cell to lower the supply voltage requirement in comparison to traditional MCML D-latch. The design of the proposed MCML D-latch is carried out through analytical modeling of its static parameters. The delay is expressed in terms of the bias current and the voltage swing so that it can be traded off with the power consumption. The proposed low-voltage MCML D-latch is analyzed for the two design cases, namely, high-speed and power-efficient, and the performance is compared with the traditional MCML D-latch for each design case. The theoretical propositions are validated through extensive SPICE simulations using TSMC 0.18 µm CMOS technology parameters.

Atomic Force High Frequency Phonons Non-volatile Dynamic Random-Access Memory Compatible with Sub-7nm ULSI CMOS Technology

MRS Advances ◽  
2019 ◽  
Vol 4 (48) ◽  
pp. 2577-2584
Author(s):  
James N. Pan
Keyword(s):  
Quantum Wells ◽  
High Frequency ◽  
Nonvolatile Memory ◽  
High Speed ◽  
Random Access ◽  
Cost Effective ◽  
Cmos Technology ◽  
Access Time ◽  
Cmos Process ◽  
Atomic Force

ABSTRACTThis paper reports a novel low power, fast nonvolatile memory utilizing high frequency phonons, atomic force dual quantum wells, ferromagnetism, coupled magnetic dipoles and random accessed magnetic devices. Very high-speed memories, such as SRAM and DRAM, are mostly volatile (data are lost when power is off). Nonvolatile memories, including FLASH and MRAM, are typically not as fast has DRAM or SRAM, and the voltages for WRITE/ERASE operations are relatively high. This paper describes a silicon nonvolatile memory that is compatible with advanced sub-7nm CMOS process. It consists of only one transistor (MOSFET) – small size, and more cost effective, compared with a 6-Transistor SRAM. There is no need to refresh, as required by DRAM. The access time can be less than 1ns – close to the speed level of relaxation time - much faster than traditional FLASH memories and comparable to volatile DRAM. The operating voltages for all memory functions can be as low as high speed CMOS.

scholarly journals DIGITAL CONTROLLED OSCILLATOR (DCO) FOR ALL DIGITAL PHASE-LOCKED LOOP (ADPLL) – A REVIEW

2019 ◽  
Vol 82 (1) ◽  
Author(s):  
Florence Choong ◽  
Mamun Ibne Reaz ◽  
Mohamad Ibrahim Kamaruzzaman ◽  
Md. Torikul Islam Badal ◽  
Araf Farayez ◽  
...  
Keyword(s):  
Supply Voltage ◽  
Complementary Metal Oxide Semiconductor ◽  
Phase Locked Loop ◽  
Cmos Technology ◽  
Oxide Semiconductor ◽  
Cmos Process ◽  
Process Technology ◽  
Chip Area ◽  
Digital Phase ◽  
Low Power Dissipation

Digital controlled oscillator (DCO) is becoming an attractive replacement over the voltage control oscillator (VCO) with the advances of digital intensive research on all-digital phase locked-loop (ADPLL) in complementary metal-oxide semiconductor (CMOS) process technology. This paper presents a review of various CMOS DCO schemes implemented in ADPLL and relationship between the DCO parameters with ADPLL performance. The DCO architecture evaluated through its power consumption, speed, chip area, frequency range, supply voltage, portability and resolution. It can be concluded that even though there are various schemes of DCO that have been implemented for ADPLL, the selection of the DCO is frequently based on the ADPLL applications and the complexity of the scheme. The demand for the low power dissipation and high resolution DCO in CMOS technology shall remain a challenging and active area of research for years to come. Thus, this review shall work as a guideline for the researchers who wish to work on all digital PLL.

scholarly journals A 2.6 GS/s 8-Bit Time-Interleaved SAR ADC in 55 nm CMOS Technology

Electronics ◽  
2019 ◽  
Vol 8 (3) ◽  
pp. 305 ◽  
Author(s):  
Dong Wang ◽  
Xiaoge Zhu ◽  
Xuan Guo ◽  
Jian Luan ◽  
Lei Zhou ◽  
...  
Keyword(s):  
High Speed ◽  
Complementary Metal Oxide Semiconductor ◽  
Cmos Technology ◽  
Sar Adc ◽  
Oxide Semiconductor ◽  
Power Measurement ◽  
Cmos Process ◽  
Analog To Digital ◽  
Full Speed ◽  
Time Interleaved

This paper presents an eight-channel time-interleaved (TI) 2.6 GS/s 8-bit successive approximation register (SAR) analog-to-digital converter (ADC) prototype in a 55-nm complementary metal-oxide-semiconductor (CMOS) process. The channel-selection-embedded bootstrap switch is adopted to perform sampling times synchronization using the full-speed master clock to suppress the time skew between channels. Based on the segmented pre-quantization and bypass switching scheme, double alternate comparators clocked asynchronously with background offset calibration are utilized in sub-channel SAR ADC to achieve high speed and low power. Measurement results show that the signal-to-noise-and-distortion ratio (SNDR) of the ADC is above 38.2 dB up to 500 MHz input frequency and above 31.8 dB across the entire first Nyquist zone. The differential non-linearity (DNL) and integral non-linearity (INL) are +0.93/−0.85 LSB and +0.71/−0.91 LSB, respectively. The ADC consumes 60 mW from a 1.2 V supply, occupies an area of 400 μm × 550 μm, and exhibits a figure-of-merit (FoM) of 348 fJ/conversion-step.

scholarly journals A low-voltage CMOS current-mode incremental signaling scheme for high-speed parallel links

2021 ◽  
Author(s):  
Tao Wang
Keyword(s):  
High Speed ◽  
Low Voltage ◽  
Low Cost ◽  
Current Mode ◽  
Cmos Technology ◽  
Fully Differential ◽  
Parallel Links ◽  
Data Links ◽  
Parallel Data ◽  
The Cost

Point-to-point parallel links are widly used in short-distance high-speed data communications. For these links, the design goal is not only to integrate a large number of I/Os in the systems, but also to increase the bit rate per I/O. The cost per I/O has to be kept low as performance improves. Voltage and timing error sources limit the performance of data links and affect its robustnest. These kinds of noise impose greater challenges in parallel data links, such as inter-signal timing skew and inter-signal cross-talk. The use of low-cost schemes, such as single-ended signaling, is effected signaficantly [sic] by the voltage and timging [sic] noise. Fully differential signaling schemes, two physical paths per signal channel, significantly increases the cost of system. Therefore, overcoming the voltage noise, keeping the cost low are two challenges in high-speed parallel links. In this thesis, we propose a new current-mode signaling scheme current-mode incremtnal [sic] signaling for high-speed parallel links. Also, the circuits of the receiver called current-integrating receiver are presented. To assess the effectiveness of the proposed signaling scheme, a 4-bit parallel link consisting of four bipolar current-mode drivers, five 10 cm microstrip lines with a FR4 substrate, and four proposed current-integrating receivers is implemented in UMC 0.13[micro]m, 1.2V CMOS technology and analyzed using SpectreRF from Cadence Design Systems with BSIM3V3 device models. Simulation results demonstrate that the proposed current-mode incremental signaling scheme and the current-integrating receiver are capable of transmitting parallel data at 2.5 Gbyte/s.

scholarly journals A Fully-Integrated 180 nm CMOS 1.2 V Low-Dropout Regulator for Low-Power Portable Applications

Electronics ◽  
2021 ◽  
Vol 10 (17) ◽  
pp. 2108
Author(s):  
Jorge Pérez-Bailón ◽  
Belén Calvo ◽  
Nicolás Medrano
Keyword(s):  
Low Voltage ◽  
Low Cost ◽  
Complementary Metal Oxide Semiconductor ◽  
Cmos Technology ◽  
High Gain ◽  
Oxide Semiconductor ◽  
Fully Integrated ◽  
Low Voltage Operation ◽  
Error Amplifier ◽  
Ldo Regulator

This paper presents the design and postlayout simulation results of a capacitor-less low dropout (LDO) regulator fully integrated in a low-cost standard 180 nm Complementary Metal-Oxide-Semiconductor (CMOS) technology which regulates the output voltage at 1.2 V from a 3.3 to 1.3 V battery over a –40 to 120°C temperature range. To meet with the constraints of system-on-chip (SoC) battery-operated devices, ultralow power (Iq = 8.6 µA) and minimum area consumption (0.109 mm2) are maintained, including a reference voltage Vref = 0.4 V. It uses a high-gain dynamically biased folded-based error amplifier topology optimized for low-voltage operation that achieves an enhanced regulation-fast transient performance trade-off.

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