Substrate temperature: A critical parameter for the growth of microcrystalline silicon-carbon alloy thin films at low power

1999 ◽  
Vol 14 (6) ◽  
pp. 2554-2559 ◽  
Author(s):  
Arup Dasgupta ◽  
S. C. Saha ◽  
Swati Ray ◽  
R. Carius
Keyword(s):  
Thin Films ◽  
Low Power ◽  
Substrate Temperature ◽  
Critical Parameter ◽  
Chemical Vapor ◽  
Microcrystalline Silicon ◽  
High Hydrogen ◽  
Deposition Parameters ◽  
Silicon Carbon ◽  
Moderate Power

P-type microcrystalline silicon-carbon alloy thin films have been prepared at low power by employing radio-frequency plasma-enhanced chemical vapor deposition (rf-PECVD) technique; judicious choice of deposition parameters is necessary. Substrate temperature has been observed to be the most critical parameter, while high hydrogen dilution is necessary but not a sufficient condition for obtaining crystallinity in silicon-carbon alloy thin films. Best microcrystallinity at moderate power density (78 mW/cm2) has been obtained at a fairly low substrate temperature (180 °C). The highest conductivity of 5.7 Scm−1 of a boron-doped microcrystalline sample could be achieved. Incorporation of carbon in these films has been confirmed from x-ray photoelectron spectroscopic (XPS) studies. Carbon is, however, incorporated only in the amorphous phase while the crystallites are of silicon only as observed from Raman spectra.

Effect of the Substrate Temperature on the Transition from Amorphous to Microcrystalline Silicon with High Hydrogen Dilution

2013 ◽  
Vol 773 ◽  
pp. 520-523
Author(s):  
Ming Liang Zhang ◽  
Hui Dong Yang ◽  
Kai Zhao Yang
Keyword(s):  
Substrate Temperature ◽  
Volume Fraction ◽  
Chemical Vapor ◽  
Silicon Films ◽  
Microcrystalline Silicon ◽  
High Hydrogen ◽  
Hydrogenated Silicon ◽  
Glass Substrates ◽  
Amorphous Hydrogenated Silicon ◽  
The Stability

Transition films of amorphous hydrogenated silicon (a-Si:H) to microcrystalline silicon (μc-Si:H) have attracted much attention due to the stability, high overall quality for solar cells configuration. Hydrogenated amorphous and microcrystalline silicon films were deposited on glass substrates by a conventional plasma enhanced chemical vapor deposition (PEVCD) varying the substrate temperature from 275 to 350 °C. A silane concentration of 4% and a total flow rate of 100 sccm were used at a gas pressure of 267 Pa. The film thicknesses of the prepared samples were between 700 and 900 nm estimated from the optical transmission spectra. The deposition rates were between 0.2 and 0.3 nm/s. The phase composition of the deposited silicon films were investigated by Raman spectroscopy. The transition from amorphous to microcrystalline silicon was found at the higher temperatures. The crystallization process of the amorphous silicon can be affected by the substrate temperature. A narrow structural transition region was observed from the changes of the crystalline volume fraction. The dark electrical conductivity of the silicon films increased as the substrate temperature increasing.

The Study of Microcrystalline Silicon Thin Films Prepared by PECVD

2013 ◽  
Vol 537 ◽  
pp. 197-200
Author(s):  
Chun Ya Li ◽  
Hao Zhang ◽  
Jun Li ◽  
Xi Feng Li ◽  
Jian Hua Zhang
Keyword(s):  
Thin Films ◽  
Substrate Temperature ◽  
Process Parameters ◽  
Volume Fraction ◽  
Chemical Vapor ◽  
Silicon Films ◽  
Crystalline Volume Fraction ◽  
Microcrystalline Silicon ◽  
Reaction Pressure ◽  
Silicon Thin Films

Under different growth conditions, microcrystalline silicon thin films are deposited successfully on glass substrates by the double-frequency plasma enhanced chemical vapor deposition (PECVD). We report the systematic investigation of the effect of process parameters (hydrogen dilution, substrate temperature, forward power, reaction pressure, et al.) on the growth characteristics of microcrystalline silicon thin films. Raman scattering spectra are used to analyze the crystalline condition of the films and the experimental results. Optimizing the process parameters, the highest crystalline volume fraction of microcrystalline silicon films was achieved. It is found that the crystalline volume fraction of microcrystalline silicon films reaches 72.2% at the reaction pressure of 450 Pa, H2/SiH4 flow ratio of 800sccm/10sccm, power of 400 W and substrate temperature of 350 °C.

Influence of Substrate Temperature on Properties of Transition Materials from Amorphous to Microcrystalline Silicon Prepared by VHF-PECVD

2013 ◽  
Vol 750-752 ◽  
pp. 1906-1909
Author(s):  
Wen Ming Wang ◽  
Hui Dong Yang ◽  
Ji Sen Zhang ◽  
Shan Li ◽  
Xin Rong Luo ◽  
...  
Keyword(s):  
Thin Films ◽  
Substrate Temperature ◽  
Deposition Rate ◽  
Chemical Vapor ◽  
Dark Conductivity ◽  
Microcrystalline Silicon ◽  
Very High Frequency ◽  
Photoelectric Properties ◽  
Growth System ◽  
Influence Of Substrate

Thin films of amorphous/microcrystalline silicon transition zone prepared at different substrate temperature by very high frequency plasma enhanced chemical vapor deposition (VHF-PECVD) have been studied in this paper. The influence of substrate temperature on microstructure,photoelectric properties and growth of these materials have been investigated. The results show that in a certain extent with the increase of substrate temperature,the structure of material evaluated from amorphous to microcrystalline,the deposition rate and dark conductivity ,the photosensitivity had been improved.However,the optical conductivity had been reduced. The optimized substrate temperature for thin films deposition under our current growth system is about 240°C,at which deposition rate can reach 0.6nm/s.

scholarly journals Influence of the growth parameters of TiO2 thin films deposited by the MOCVD method

Cerâmica ◽  
2002 ◽  
Vol 48 (305) ◽  
pp. 38-42 ◽  
Author(s):  
M. I. B. Bernardi ◽  
E. J. H. Lee ◽  
P. N. Lisboa-Filho ◽  
E. R. Leite ◽  
E. Longo ◽  
...  
Keyword(s):  
Thin Films ◽  
Growth Parameters ◽  
Structural Characteristics ◽  
Chemical Vapor ◽  
X Ray Diffraction ◽  
Tio2 Thin Films ◽  
X Ray ◽  
Force Microscopy ◽  
Atomic Force ◽  
Deposition Parameters

The synthesis of TiO2 thin films was carried out by the Organometallic Chemical Vapor Deposition (MOCVD) method. The influence of deposition parameters used during growth on the final structural characteristics was studied. A combination of the following experimental parameters was studied: temperature of the organometallic bath, deposition time, and temperature and substrate type. The high influence of those parameters on the final thin film microstructure was analyzed by scanning electron microscopy with electron dispersive X-ray spectroscopy, atomic force microscopy and X-ray diffraction.

DEVELOPMENT OF HIGHLY CONDUCTIVE BORON-DOPED MICROCRYSTALLINE SILICON FILMS FOR APPLICATION IN SOLAR CELLS

2006 ◽  
Vol 20 (03) ◽  
pp. 303-314 ◽  
Author(s):  
QING-SONG LEI ◽  
ZHI-MENG WU ◽  
JIAN-PING XI ◽  
XIN-HUA GENG ◽  
YING ZHAO ◽  
...  
Keyword(s):  
Solar Cells ◽  
Substrate Temperature ◽  
Chemical Vapor ◽  
Dark Conductivity ◽  
Silicon Films ◽  
Microcrystalline Silicon ◽  
Very High Frequency ◽  
Boron Doped ◽  
Deposition Processes ◽  
P Type

We have examined the deposition of highly conductive boron-doped microcrystalline silicon (μc- Si:H ) films for application in solar cells. Depositions were conducted in a very high frequency plasma enhanced chemical vapor deposition (VHF PECVD) chamber. In the deposition processes, various substrate temperatures (TS) were applied. Highly conductive p-type microcrystalline silicon films were obtained at substrate temperature lower than 210°C. The factors that affect the conductivity of the films were investigated. Results suggest that the dark conductivity, which was determined by the Hall mobility and carrier concentration, is influenced by the structure. The properties of the films are strongly dependent on the substrate temperature. With TS increasing, the dark conductivity (σd) increases initially; reach the maximum values at certain TS and then decrease. Also, we applied the boron-doped μc- Si:H as p-layers to the solar cells. An efficiency of about 8.5% for a solar cell with μc- Si:H p-layer was obtained.

Deposition of Amorphous and Microcrystalline Si,C Alloy Thin Films by a Remote Plasma-Enhanced Chemical-Vapor Deposition Process

1991 ◽  
Vol 219 ◽  
Author(s):  
C. Wang ◽  
G. Lucovsky ◽  
R. J. Nemanich
Keyword(s):  
Raman Spectra ◽  
Chemical Vapor ◽  
Deposition Process ◽  
Degree Of Crystallinity ◽  
Microcrystalline Silicon ◽  
Electrical And Optical Properties ◽  
Silicon Carbon ◽  
Infrared Measurements ◽  
Si Films ◽  
The Degree Of Crystallinity

ABSTRACTWe have extended the remote PECVD process to the deposition of intrinsic and doped, amorphous and microcrystalline silicon, carbon alloy films, a-Si,C:H and μc-Si,C, respectively. The electrical and optical properties of a-Si,C:H deposited by remote PECVD are comparable to those of films deposited by the glow discharge or GD process. The degree of crystallinity in the μc-Si,C alloys, as determined from the relative intensities of crystalline and amorphous features in the Raman spectra, is lower than that of μc-Si films deposited under comparable deposition conditions. The Raman spectra indicate that the crystallites in the μc-Si,C alloys are Si, while the infrared measurements establish that the intervening amorphous component is an a-Si,C:H alloy.

Selective and low temperature synthesis of polycrystalline diamond

1991 ◽  
Vol 6 (6) ◽  
pp. 1278-1286 ◽  
Author(s):  
R. Ramesham ◽  
T. Roppel ◽  
C. Ellis ◽  
D.A. Jaworske ◽  
W. Baugh
Keyword(s):  
Thin Films ◽  
Low Temperature ◽  
Substrate Temperature ◽  
Microwave Plasma ◽  
Diamond Particle ◽  
Single Crystal Silicon ◽  
Chemical Vapor ◽  
Polycrystalline Diamond ◽  
Crystal Silicon ◽  
Diamond Thin Films

Polycrystalline diamond thin films have been deposited on single crystal silicon substrates at low temperatures (⋚ 600 °C) using a mixture of hydrogen and methane gases by high pressure microwave plasma-assisted chemical vapor deposition. Low temperature deposition has been achieved by cooling the substrate holder with nitrogen gas. For deposition at reduced substrate temperature, it has been found that nucleation of diamond will not occur unless the methane/hydrogen ratio is increased significantly from its value at higher substrate temperature. Selective deposition of polycrystalline diamond thin films has been achieved at 600 °C. Decrease in the diamond particle size and growth rate and an increase in surface smoothness have been observed with decreasing substrate temperature during the growth of thin films. As-deposited films are identified by Raman spectroscopy, and the morphology is analyzed by scanning electron microscopy.

Pulsed Laser Deposition of Bi4Ti3O12 Thin Films on Sapphire Substrates

1994 ◽  
Vol 361 ◽  
Author(s):  
William Jo ◽  
T.W. Noh
Keyword(s):  
Thin Films ◽  
Substrate Temperature ◽  
Pulsed Laser Deposition ◽  
Film Growth ◽  
Narrow Range ◽  
Pulsed Laser ◽  
Growth Behavior ◽  
Laser Deposition ◽  
Sapphire Substrates ◽  
Deposition Parameters

ABSTRACTUsing pulsed laser deposition, Bi4Ti3O12 thin films were grown on (0001) and (1102) surfaces of Al2O3. Substrate temperature from 700 to 800 °C and oxygen pressure from 50 to 1000 mtorr were varied, and their effects on Bi4Ti3O12 film growth behavior was investigated. Only for a narrow range of deposition parameters, can highly oriented Bi4Ti3O12(104) films be grown on Al2O3(0001). Further, epitaxial BTO(004) films can be grown on Al2O3(1102). The growth behavior of preferential BTO film orientations can be explained in terms of atomic arrangements in the Bi4Ti3O12 and the Al2O3 planes.

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