Interfacial Microstructure and Joint Strength of Sn–3.5Ag–X (X = Cu, In, Ni) Solder Joint

2002 ◽  
Vol 17 (1) ◽  
pp. 43-51 ◽  
Author(s):  
Won Kyoung Choi ◽  
Jong Hoon Kim ◽  
Sang Won Jeong ◽  
Hyuck Mo Lee
Keyword(s):  
Solder Joint ◽  
Joint Strength ◽  
Intermetallic Layer ◽  
Melting Behavior ◽  
Interfacial Microstructure ◽  
X Ray Diffraction ◽  
Solder Alloys ◽  
X Ray ◽  
Joint Characteristics ◽  
Ductile Fractures

Interfacial phase and microstructure, solder hardness, and joint strength of Sn–3.5Ag–X (X = Cu, In, Ni; compositions are all in wt% unless specified otherwise) solder alloys were investigated. Considering the melting behavior and the mechanical properties, five compositions of Sn–3.5Ag–X solder alloys were selected. To examine the joint characteristics, they were soldered on under bump metallurgy isothermally at 250 °C for 60 s. Aging and thermal cycling (T/C) were also performed on the solder joint. The interfacial microstructure of the joint was observed by scanning electron microscopy. X-ray diffraction and energy dispersive x-ray analyses were made toidentify the type of solder phase and to measure compositions. Excessive growth of an interfacial intermetallic layer in the Sn–3.5Ag–6.5 In solder joint led to a brittle fracture. In the other four solder joints, ductile fractures occurred through the solder region and the solder hardness was closely related with the joint strength.

Reballing/Rebumping Ultra-Fine Pitch Packages Less Than 0.5 mm Pitch for FA

2014 ◽  
Author(s):  
Bob Wettermann
Keyword(s):  
Solder Joint ◽  
Failure Analysis ◽  
Joint Strength ◽  
Semiconductor Devices ◽  
X Ray ◽  
Fine Pitch ◽  
Manual Methods

Abstract As the pitch and package sizes of semiconductor devices have shrunk and their complexity has increased, the manual methods by which the packages can be re-bumped or reballed for failure analysis have not kept up with this miniaturization. There are some changes in the types of reballing preforms used in these manual methods along with solder excavation techniques required for packages with pitches as fine as 0.3mm. This paper will describe the shortcomings of the previous methods, explain the newer methods and materials and demonstrate their robustness through yield, mechanical solder joint strength and x-ray analysis.

scholarly journals Evaluation of Biomedical Ti/ZrO2 Joint Brazed with Pure Au Filler: Microstructure and Mechanical Properties

Metals ◽  
2020 ◽  
Vol 10 (4) ◽  
pp. 526
Author(s):  
Yuzhen Lei ◽  
Hong Bian ◽  
Wei Fu ◽  
Xiaoguo Song ◽  
Jicai Feng ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Energy Dispersive Spectrometry ◽  
Filler Metal ◽  
Interfacial Microstructure ◽  
Holding Time ◽  
X Ray Diffraction ◽  
X Ray ◽  
Medical Products ◽  
Metallurgical Bonding ◽  
Brazed Joints

Titanium and zirconia (ZrO2) ceramics are widely used in biomedical fields. This study aims to achieve reliable brazed joints of titanium/ZrO2 using biocompatible Au filler for implantable medical products. The effects of brazing temperature and holding time on the interfacial microstructures and mechanical properties of titanium/Au/ZrO2 joints were fully investigated by scanning electron microscopy (SEM), energy-dispersive spectrometry (EDS) and X-ray diffraction (XRD). The results indicated that the typical interfacial microstructure of the titanium/Au/ZrO2 joint was titanium/Ti3Au layer/TiAu layer/TiAu2 layer/TiAu4 layer/TiO layer/ZrO2 ceramic. With an increasing brazing temperature or holding time, the thickness of the Ti3Au + TiAu + TiAu2 layer increased gradually. The growth of the TiO layer was observed, which promoted metallurgical bonding between the filler metal and ZrO2 ceramic. The optimal shear strength of ~35.0 MPa was obtained at 1150 °C for 10 min. SEM characterization revealed that cracks initiated and propagated along the interface of TiAu2 and TiAu4 reaction layers.

scholarly journals Influence of Molecular Orientation on the Melting Behavior of Poly(phenylene sulfide) Fibers

2013 ◽  
Vol 8 (3) ◽  
pp. 155892501300800
Author(s):  
Prabhakar Gulgunje ◽  
Gajanan Bhat ◽  
Joseph Spruiell
Keyword(s):  
Differential Scanning Calorimetry ◽  
Molecular Orientation ◽  
Polarized Light ◽  
Melting Behavior ◽  
Probable Mechanism ◽  
Wide Angle ◽  
X Ray Diffraction ◽  
Scanning Calorimetry ◽  
X Ray ◽  
Phenylene Sulfide

The influence of molecular orientation on the melting behavior of draw-annealed poly(phenylene sulfide) fibers is investigated in the present paper. Tools used to probe the investigation were differential scanning calorimetry, polarized light optical microscopy, wide angle X-ray diffraction, and small angle X-ray diffraction. It is shown that molecular orientation in the crystalline and amorphous regions play a key role in crystal rearrangement during melting. A probable mechanism by which amorphous orientation influences crystal rearrangement is also discussed.

Microstructure and Oxidation of 55%Al-Zn-Si Hot-Dip Coatings Deposited on Low Carbon Steel at High Temperature

2011 ◽  
Vol 399-401 ◽  
pp. 1998-2003 ◽  
Author(s):  
Biao Zhou ◽  
Feng Jin ◽  
Qun Luo ◽  
Qian Li ◽  
Kuo Chih Chou
Keyword(s):  
High Temperature ◽  
High Temperature Oxidation ◽  
Diffusion Rate ◽  
Intermetallic Layer ◽  
Low Carbon Steel ◽  
Low Carbon ◽  
X Ray Diffraction ◽  
Temperature Oxidation ◽  
X Ray ◽  
Good Agreement

The high temperature oxidation and microstructure evolution of 55%Al-Zn-Si coated sheets were studied by scanning electron microscopy (SEM) and X-ray diffraction (XRD). After oxidation, the coatings consisted of three phases including ZnO, Fe2Al5, and FeAl from topcoat to the substrate. The different diffusion rate of Fe and Al result in forming voids at the interface of intermetallic layer and the substrate. A good agreement has been reached between the experimental data and the calculation from Chou diffusion model, which has a good predicted function. Moreover, the characteristic oxidation time and the apparent activation energy were obtained.

Interface Reactions of Joining Al2O3 Ceramics by Microwave Method

2013 ◽  
Vol 753-755 ◽  
pp. 388-391
Author(s):  
Ying Na Zhao ◽  
Xiong Feng Zeng ◽  
Gui Qin Hou ◽  
Wen Li Zhang
Keyword(s):  
Interfacial Microstructure ◽  
Parent Material ◽  
Joint Interface ◽  
Ceramic Surface ◽  
Micro Hardness ◽  
X Ray Diffraction ◽  
X Ray ◽  
Interface Reactions ◽  
Interface Phase ◽  
Element Migration

Nanometer Si powders were used as interlayer materials, which were expected to be microwave heated rapidly and reacted with the surface of Al2O3ceramics to form the low eutectoid compound. The phenomena of element migration of joint samples were investigated by energy dispersive spectroscopy (EDS) and the interface phase transition was analyzed by X-ray diffraction (XRD). The results indicated that the low eutectoid compound of the joint interface wetted and penetrated to the ceramic surface. The variation of micro-hardness at the interface across the parent material was measured by micro-hardness instrument and the interfacial microstructure and the fracture surface were investigated by scanning electron microscopy (SEM).

Investigation on fatigue behavior of single SnAgCu/SnPb solder joint by rapid thermal cycling

2015 ◽  
Vol 27 (2) ◽  
pp. 76-83 ◽  
Author(s):  
Jibing Chen ◽  
Yanfang Yin ◽  
Jianping Ye ◽  
Yiping Wu
Keyword(s):  
Solder Joint ◽  
Thermal Cycling ◽  
Thermal Fatigue ◽  
Solder Bump ◽  
Fatigue Behavior ◽  
Interfacial Microstructure ◽  
Content Type ◽  
X Ray ◽  
Snpb Solder ◽  
Rapid Thermal Cycling

Purpose – The purpose of this paper is to investigate the thermal fatigue behavior of a single Sn-3.0Ag-0.5Cu (SAC) lead-free and 63Sn-37Pb (SnPb) solder joint treated by rapidly alternating heating and cooling cycles. Design/methodology/approach – With the application of electromagnetic-induced heating, the specimen was heated and cooled, controlled with a system that uses a fuzzy logic algorithm. The microstructure and morphology of the interface between the solder ball and Cu substrate was observed using scanning electron microscopy. The intermetallic compounds and the solder bump surface were analyzed by energy-dispersive X-ray spectroscopy and X-ray diffraction, respectively. Findings – The experimental results showed that rapid thermal cycling had an evident influence on the surface and interfacial microstructure of a single solder joint. The experiment revealed that microcracks originate and propagate on the superficial oxide of the solder bump after rapid thermal cycling. Originality/value – Analysis, based on finite element modeling and metal thermal fatigue mechanism, determined that the rimous cracks can be explained by the heat deformation theory and the function of temperature distribution in materials physics.

Nature of Stark Rubber

1955 ◽  
Vol 28 (4) ◽  
pp. 1007-1020 ◽  
Author(s):  
Donald E. Roberts ◽  
Leo Mandelkern
Keyword(s):  
Natural Rubber ◽  
Melting Temperature ◽  
Melting Behavior ◽  
X Ray Diffraction ◽  
Equilibrium Melting Temperature ◽  
X Ray ◽  
Melting Temperatures ◽  
Controlled Conditions ◽  
Previous Assignment ◽  
Diffraction Patterns

Abstract The melting behavior and x-ray diffraction patterns of four different samples of stark rubber have been investigated. The melting temperatures, 39° to 45.5° C, are substantially higher than that observed for natural rubber crystallized by cooling. The x-ray diffraction patterns indicate that the crystallites in stark rubber are oriented. This observation can explain the higher melting temperatures. Thus, the previous assignment of an equilibrium melting temperature, 28° (±1°) C, to unoriented crystalline natural rubber is shown to be appropriate. Several different methods that have been used successfully in preparing stark rubber under controlled conditions in the laboratory are outlined.

scholarly journals Exploring the Interfacial Phase and π–π Stacking in Aligned Carbon Nanotube/Polyimide Nanocomposites

Nanomaterials ◽  
2020 ◽  
Vol 10 (6) ◽  
pp. 1158
Author(s):  
Qian Jiang ◽  
Qian Zhang ◽  
Xianyan Wu ◽  
Liwei Wu ◽  
Jia-Horng Lin
Keyword(s):  
Carbon Nanotube ◽  
Conjugated Polymer ◽  
Emission Spectroscopy ◽  
Fluorescence Emission ◽  
Interfacial Microstructure ◽  
Phase System ◽  
X Ray Diffraction ◽  
X Ray ◽  
Π Stacking ◽  
Fluorescence Emission Spectroscopy

To characterize the interfacial microstructure and interaction at a nanoscale has a significant meaning for the interface improvement of the nanocomposites. In this study, the interfacial microstructure and features of aligned multiwalled carbon nanotube (MWNT) and conjugated polymer polyimide (PI) with three molecular structures were investigated using small-angle X-ray scattering (SAXS), wide-angle X-ray diffraction (WAXD), and fluorescence emission spectroscopy. It was found that aligned MWNT/PI nanocomposites had a nonideal two-phase system with the interfaces belonging to long period stacking ordered structure. Attributed to the π–π stacking effect, MWNT/BTDA-MPD presented the most regular arrangement verified by fractal dimension. By adopting a one-dimension correlation function, each phase dimension in aligned MWNT/PI nanocomposites was calculated and verified by high resolution transmission electron microscopy (HRTEM) and X-ray diffraction (XRD). The π–π stacking was demonstrated to be an important interaction between MWNT and PI via WAXD and fluorescence emission spectroscopy, and it was influenced by the linkage bond between benzene rings in PIs. This work is of significance to reveal the interfacial features between conjugated polymer and carbon nanotubes (CNTs), which is favorable for the interface design of CNT-based high performance nanocomposites.

Microstructural study of MBE-grown ZnO film on GaN/sapphire (0001) substrate

Open Physics ◽  
2008 ◽  
Vol 6 (3) ◽  
Author(s):  
Hua Li ◽  
Jianping Sang ◽  
Chang Liu ◽  
Hongbing Lu ◽  
Juncheng Cao
Keyword(s):  
Interface Layer ◽  
Interfacial Microstructure ◽  
X Ray Diffraction ◽  
Zno Film ◽  
Epitaxial Relationship ◽  
Cross Sectional ◽  
X Ray ◽  
Transmission Electron ◽  
Diffraction Patterns ◽  
Gan Heterostructure

AbstractSingle crystalline ZnO film is grown on GaN/sapphire (0001) substrate by molecular beam epitaxy. Ga2O3 is introduced into the ZnO/GaN heterostructure intentionally by oxygen-plasma pre-exposure on the GaN surface prior to ZnO growth. The crystalline orientation and interfacial microstructure are characterized by X-ray diffraction and transmission electron microscopy. X-ray diffraction analysis shows strong c-axis preferred orientation of the ZnO film. Cross-sectional transmission electron microscope images reveal that an additional phase is formed at the interface of ZnO/GaN. Through a comparison of diffraction patterns, we confirm that the interface layer is monoclinic Ga2O3 and the main epitaxial relationship should be $$ (0001)_{ZnO} \parallel (001)_{Ga_2 O_3 } \parallel (0001)_{GaN} $$ and $$ [2 - 1 - 10]_{ZnO} \parallel [010]_{Ga_2 O_3 } \parallel [2 - 1 - 10]_{GaN} $$.

A microstructural and electrical investigation of Pd/Ge/Ti/Au ohmic contact to n-type GaAs

1996 ◽  
Vol 427 ◽  
Author(s):  
J. S. Kwak ◽  
H. K. Baik ◽  
H. Kim ◽  
J. -L. Lee ◽  
D. W. Shin ◽  
...  
Keyword(s):  
Ohmic Contact ◽  
Gaas Substrate ◽  
Isothermal Annealing ◽  
Interfacial Microstructure ◽  
X Ray Diffraction ◽  
Cross Sectional ◽  
X Ray ◽  
Electrical Investigation ◽  
Transmission Electron ◽  
Elemental Diffusion

AbstractInterfacial microstructure and elemental diffusion of Pd/Ge/Ti/Au ohmic contact to n-type GaAs have been investigated using x-ray diffraction(XRD), Auger electron spectroscopy(AES), and cross-sectional transmission electron microscopy(XTEM), and their results are used to interpret the electrical properties. The lowest contact resistance of 0.43 Ωmm is obtained after annealing at 380°C. The contact is thermally stable even after isothermal annealing for 5h at 400°C. The good Pd/Ge/Ti/Au ohmic contact is due to the formation of both AuGa and TiO compounds. The AuGa compound enhances the creation of more Ga vacancies, followed by incorporation of Ge into Ga vacancies and TiO compound suppresses As outdiffusion from GaAs substrate, respectively.

Sign in / Sign up

Export Citation Format

Share Document