Electrical Characteristics of Tisi2/n+-Polysilicon/Sio2/Si Mos Capacitors Stressed Under High Temperature Silicide Processing Conditions
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AbstractDetailed electrical characteristics of TiSi2/n+-polysilicon/SiO2/Si MOS capacitors stressed under a variety of high temperature processing conditions is reported. These devices have ˜2000Å TiSi2 formed by a two-step thermal anneal on heavily POCl3doped polysilicon with thicknesses of 6 kÅ and 8 kÅ. These structures were capped with 8 kÅ of SiO2 and stressed in nitrogen at process temperatures in the range of 700° C to 1100° C. The electrical performance was evaluated in terms of I-V, C-V, Fowler-Nordheim tunneling, and SiO2/Si interface characteristics of MOS structures. A systematic degradation of the SiO2/Si interface was observed due to process limitations of TiSi2 at high Lemperatures.
2010 ◽
Vol 58
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pp. 11740-11748
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2013 ◽
Vol 96
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pp. 1966-1971
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2010 ◽
Vol 645-648
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pp. 519-522
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1995 ◽
Vol 53
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pp. 334-335
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1984 ◽
Vol 47
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pp. 105-107
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Measurement of Fowler-Nordheim tunneling currents in MOS structures under charge trapping conditions
1985 ◽
Vol 28
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pp. 717-720
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