Surface Morphological Changes of Polyimide with Oxygen Reactive Ion Beam Etching (RIBE)

1988 ◽  
Vol 129 ◽  
Author(s):  
Kyung W. Paik ◽  
Arthur L. Ruoff
Keyword(s):  
Morphological Changes ◽  
Ion Beam ◽  
X Ray Diffraction ◽  
Cross Sectional ◽  
Ion Beam Etching ◽  
X Ray ◽  
Disordered Phase ◽  
Beam Incidence ◽  
Yield Difference ◽  
Sectional Plane

ABSTRACTAt the beginning of etching, surface asperities appeared on the top plane of the polyimide (PI) film. The formation of surface asperities is due to the ordered phase in PI film. The known dimension of the ordered phase measured by X-ray diffraction is consistant with the size of surface asperities, 100 Å, observed by TEM. Further ion doses made these asperties evolve into smooth bumps which then eroded into cones as a result of etch yield difference as a function of the angle of beam incidence Y(θ)/Y(0) which has a maximum at θ=70. Finally cones led to the development of grass-likestructure on the top plane of the PI film. The formation of platelike structure on the cross-sectional plane of PI indicates that the structural inhomogeniety of the PI film(the ordered and disordered phase) is the main cause for the surface morphological changes of PI.

Oxygen Reactive Ion Beam Etching on Polyimide to Enhance Copper Film Adhesion

1988 ◽  
Vol 119 ◽  
Author(s):  
Kyung W. Paik ◽  
Arthur L. Ruoff
Keyword(s):  
Morphological Changes ◽  
Ion Beam ◽  
Copper Film ◽  
Peel Strength ◽  
Cohesive Failure ◽  
Cross Sectional ◽  
Ion Beam Etching ◽  
Film Adhesion ◽  
Sectional Plane ◽  
Reactive Ion Beam Etching

AbstractPolyimide(PI) films were modified by O2 reactive ion beam etching(RIBE) to make special surface features which enhance the adhesion of copper films. The top plane and the cross-sectional plane of PI films were changed to a grass-like structure and a plate-like structure, respectively. The reason for these surface morphological changes is presumably due to the structural inhomogeniety of PI. XPS studies show that the O2 RIBE oxygenates the PI, resulting in an increase in oxygen and a decrease in carbon and nitrogen. The adhesion of evaporated copper on the O2 RIBE modified PI was substantially increased. In this study, the maximum peel strength of modified PI, 70 grams/mm, is more than 25 times larger than that of the unmodified PI, 2.5 grams/mm. Two types of failure mechanisms were observed with various ion doses:adhesive failure at the Cu/PI interface and at very large doses cohesive failure at the roots of the thin and long grass blades of PI.

Stress Gradients Observed in Cu Thin Films Induced by Capping Layers

2009 ◽  
Vol 1156 ◽  
Author(s):  
Conal E. Murray ◽  
Paul R. Besser ◽  
Christian Witt ◽  
Jean L. Jordan-Sweet
Keyword(s):  
Deposition Temperature ◽  
Morphological Changes ◽  
Film Surface ◽  
Stress Distributions ◽  
X Ray Diffraction ◽  
Cross Sectional ◽  
X Ray ◽  
Cu Films ◽  
Transmission Electron ◽  
Cu Film

AbstractGlancing-incidence X-ray diffraction (GIXRD) has been applied to the investigation of depth-dependent stress distributions within electroplated Cu films due to overlying capping layers. 0.65 μm thick Cu films plated on conventional barrier and seed layers received a CVD SiCxNyHz cap, an electrolessly-deposited CoWP layer, or a CoWP layer followed by a SiCxNyHz cap. GIXRD and conventional X-ray diffraction measurements revealed that strain gradients were created in Cu films possessing a SiCxNyHz cap, where a greater in-plane tensile stress was generated near the film / cap interface. The constraint imposed by the SiCxNyHz layer during cooling from the cap deposition temperature led to an increase in the in-plane stress of approximately 180 MPa from the value measured in the bulk Cu. However, Cu films possessing a CoWP cap without a SiCxNyHz layer did not exhibit depth-dependent stress distributions. Because the CoWP capping deposition temperature was much lower than that employed in SiCxNyHz deposition, the Cu experienced elastic deformation during the capping process. Cross-sectional transmission electron microscopy indicated that the top surface of the Cu films exhibited extrusions near grain boundaries for the samples undergoing the thermal excursion during SiCxNyHz deposition. The conformal nature of these caps confirmed that the morphological changes of the Cu film surface occurred prior to capping and are a consequence of the thermal excursions associated with cap deposition.

Processing Effects on the Contact Resistance of Ion Beam Sputtered Silver on Highly Oriented C-Axis and A-Axis YBCO Films

1992 ◽  
Vol 275 ◽  
Author(s):  
M. Narbutovskih ◽  
J. Rosner ◽  
P. Merchant ◽  
R. D. Jacowitz
Keyword(s):  
Thin Films ◽  
Contact Resistance ◽  
Ion Beam ◽  
Substrate Surface ◽  
Amorphous Layer ◽  
X Ray Diffraction ◽  
Axis Orientation ◽  
Ion Beam Etching ◽  
X Ray ◽  
Processing Effects

ABSTRACTThis paper reports on the processes used to achieve low resistance silver contacts to YBCO thin films that have either c-axis or a-axis orientation. Characterization by x-ray diffraction and TEM verified that these films are highly oriented with either the a or the c axis oriented perpendicular to the substrate surface. TEM examination of some of the Ag/YBCO interfaces reveals the presence of an amorphous layer. We will describe the effects of ion beam etching and RTA alloying on the contact resistivity for both orientations.

scholarly journals Ion Beam Synthesis of Buried Single Crystal Erbium Silicide

1990 ◽  
Vol 201 ◽  
Author(s):  
A. Golanski ◽  
R. Feenstra ◽  
M. D. Galloway ◽  
J. L. Park ◽  
S. J. Pennycook ◽  
...  
Keyword(s):  
Single Crystal ◽  
Ion Beam ◽  
Annealing Process ◽  
X Ray Diffraction ◽  
Cross Sectional ◽  
Single Crystalline ◽  
X Ray ◽  
Buried Layer ◽  
High Doses

AbstractHigh doses (1016–1017/cm2) of 170 keV Er+ were implanted into single-crystal 〈111〉Si at implantation temperatures between 350°C and 520°C. Annealing at 800°C in vacuum following the implant, the growth and coalescence of ErSi2 precipitates leads to a buried single crystalline ErSi2 layer. This has been studied using Rutherford backscattering/channeling, X-ray diffraction, cross-sectional TEM and resistance versus temperature measurements. Samples implanted at 520°C using an Er dose of 7 × 1016/cm2 and thermally annealed were subsequently used as seeds for the mesocpitaxial growth of the buried layer during a second implantation and annealing process. Growth occurs meso-epitaxially along both interfaces through beam induced, defect mediated mobility of Er atoms. The crystalline quality of the ErSi2 layer strongly depends on the temperature during the second implantation.

Novel Multiferroic Lead-Free BaTiO3/FeBSi Composite Films

2010 ◽  
Vol 123-125 ◽  
pp. 157-160
Author(s):  
Zhen Zhen Zhou ◽  
Deng Lu Hou ◽  
Li Ma ◽  
Cong Mian Zhen
Keyword(s):  
Intermediate Phase ◽  
Ion Beam ◽  
Composite Films ◽  
Ion Beam Sputtering ◽  
X Ray Diffraction ◽  
Cross Sectional ◽  
X Ray ◽  
Si Substrates ◽  
Microscopy Image ◽  
Beam Sputtering

“Green” multiferroic BaTiO3/FeBSi composite films were grown by pulsed laser deposition and ion beam sputtering on general Pt/Ti/SiO2/Si substrates. Room temperature X-ray diffraction and Raman scattering show that the crystal structures of BaTiO3 and FeBSi are tetragonal and amorphous, respectively, and no additional or intermediate phase peaks appears in the composite films. A cross-sectional scanning electron microscopy image clearly demonstrates a 2-2 type structure with sharp interface between the top FeBSi layer and bottom BaTiO3 layer. The magnetic properties of the top FeBSi are obviously modified by the bottom BaTiO3. The composite films show obvious ferroelectric feature.

scholarly journals Structural Transition in Cu/Fe Multilayered Thin Films

1996 ◽  
Vol 441 ◽  
Author(s):  
Tai D. Nguyen ◽  
Alison Chaiken ◽  
Troy W. Barbee
Keyword(s):  
Layer Thickness ◽  
Ion Beam ◽  
Microstructural Development ◽  
Ion Beam Sputtering ◽  
X Ray Diffraction ◽  
Cross Sectional ◽  
X Ray ◽  
Transmission Electron ◽  
Beam Sputtering ◽  
Bcc Structure

AbstractMicrostructural development of Fe and Cu in Cu/Fe multilayers of layer thickness 1.5–10 nm prepared on Si, Ge, and MgO substrates by ion beam sputtering has been studied using x-ray diffraction and cross-sectional transmission electron microscopy (TEM). High-angle x-ray results show an fcc Cu structure and a distorted bcc structure in the Fe layers at 5 nm-layer-thickness and smaller, and bcc Fe (110) and fcc Cu (111) peaks in the 10 nm-layer-thickness samples. Lowangle x-ray diffraction indicates that the layers in the samples grown on MgO substrates have a more uniform and smooth layered structure than the multilayers grown on Si and Ge substrates, which results from larger grains in the MgO substrate samples for the same layer thickness. Relationships among growth, microstructure, and interfaces with layer thickness are discussed.

Antiphase Boundaries in Ordered Ni3FE Crystals

1969 ◽  
Vol 27 ◽  
pp. 62-63
Author(s):  
Y. H. Liu
Keyword(s):  
Domain Size ◽  
Antiphase Domain ◽  
X Ray Diffraction ◽  
X Ray ◽  
Hardening Mechanism ◽  
Superlattice Structure ◽  
Disordered Phase ◽  
Domain Boundaries ◽  
Atomic Scattering ◽  
The Difference

Ordered Ni3Fe crystals possess a LI2 type superlattice similar to the Cu3Au structure. The difference in slip behavior of the superlattice as compared with that of a disordered phase has been well established. Cottrell first postulated that the increase in resistance for slip in the superlattice structure is attributed to the presence of antiphase domain boundaries. Following Cottrell's domain hardening mechanism, numerous workers have proposed other refined models also involving the presence of domain boundaries. Using the anomalous X-ray diffraction technique, Davies and Stoloff have shown that the hardness of the Ni3Fe superlattice varies with the domain size. So far, no direct observation of antiphase domain boundaries in Ni3Fe has been reported. Because the atomic scattering factors of the elements in NijFe are so close, the superlattice reflections are not easily detected. Furthermore, the domain configurations in NioFe are thought to be independent of the crystallographic orientations.

scholarly journals Multi-Scale Studies of 3D Printed Mn–Na–W/SiO2 Catalyst for Oxidative Coupling of Methane

Catalysts ◽  
2021 ◽  
Vol 11 (3) ◽  
pp. 290
Author(s):  
Tim Karsten ◽  
Vesna Middelkoop ◽  
Dorota Matras ◽  
Antonis Vamvakeros ◽  
Stephen Poulston ◽  
...  
Keyword(s):  
Oxidative Coupling ◽  
Oxidative Coupling Of Methane ◽  
Operating Conditions ◽  
Homogeneous Distribution ◽  
Silica Support ◽  
X Ray Diffraction ◽  
Cross Sectional ◽  
X Ray ◽  
Multi Scale ◽  
3D Printed

This work presents multi-scale approaches to investigate 3D printed structured Mn–Na–W/SiO2 catalysts used for the oxidative coupling of methane (OCM) reaction. The performance of the 3D printed catalysts has been compared to their conventional analogues, packed beds of pellets and powder. The physicochemical properties of the 3D printed catalysts were investigated using scanning electron microscopy, nitrogen adsorption and X-ray diffraction (XRD). Performance and durability tests of the 3D printed catalysts were conducted in the laboratory and in a miniplant under real reaction conditions. In addition, synchrotron-based X-ray diffraction computed tomography technique (XRD-CT) was employed to obtain cross sectional maps at three different positions selected within the 3D printed catalyst body during the OCM reaction. The maps revealed the evolution of catalyst active phases and silica support on spatial and temporal scales within the interiors of the 3D printed catalyst under operating conditions. These results were accompanied with SEM-EDS analysis that indicated a homogeneous distribution of the active catalyst particles across the silica support.

Physico-Chemical and Morphological Changes of Sayong Kaolinite Clay Treated with Sulphuric Acid for Enzyme Immobilization

2013 ◽  
Vol 832 ◽  
pp. 589-595 ◽  
Author(s):  
N.A. Edama ◽  
A. Sulaiman ◽  
K.H. Ku Hamid ◽  
M.N. Muhd Rodhi ◽  
Mohibah Musa ◽  
...  
Keyword(s):  
Surface Area ◽  
Sulphuric Acid ◽  
Enzyme Immobilization ◽  
Morphological Changes ◽  
Chemical Properties ◽  
X Ray Diffraction ◽  
Kaolinite Clay ◽  
X Ray ◽  
Mineral Oxides ◽  
Physico Chemical

This study analyzed the effects of sulphuric acid (H2SO4) treatment on pysico-chemical properties and morphological changes of clay obtained from Sg. Sayong, Perak. The clay was ground and sieved to <150μm and treated with different concentrations of H2SO4. The treatment was completed by refluxing the clay with different concentration of H2SO4 (1M, 5M and 10M ) at 100 °C for 4 hours and followed by calcination at 500 °C for 1 hour. The physic-chemical properties and morphological changes of the untreated and treated clay were compared using Surface Area Analyser, X-Ray Diffraction (XRD), Field Emission Scanning Electron Micrograph (FESEM), X-Ray Diffraction (XRD) and Fourier Transformed Infrared Spectroscopy (FTIR). The results showed that acid treatment of 5M increased the surface area from 25 m2/g to 75 m2/g and the pore volume increased from 0.1518 cc/g to 0.3546 cc/g. The nanopore size of the clay decreased from 24.8 nm to 19.4 nm after treated with acid. This can be explained due to the elimination of the exchangeable cations and generation of microporosity. The results of XRF showed SiO2 increased from 58.34% to 74.52% and Al2O3 reduced from 34.6% to 18.31%. The mineral oxides such as Fe2O3, MgO, CaO, K2O and TiO2 also reduced. This concluded that H2SO4 treatment has led to significant removal of octahedral Al3+, Fe3+ cations and other impurities. In conclusion, this study showed the physico-chemical properties and morphology of Sayong clay were improved once treated with H2SO4 and therefore suggests better supporting material for enzyme immobilization.

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