Lead Titanate Thin Films Prepared by Metallorganic Chemical Vapor Deposion (MOCVD) on Sapphire, Pt, and RuOx Substrates

1993 ◽  
Vol 335 ◽  
Author(s):  
Warren C. Hendricks ◽  
Seshu B. Desu ◽  
Chien H. Peng
Keyword(s):  
Thin Films ◽  
Ruthenium Oxide ◽  
Chemical Vapor ◽  
X Ray Diffraction ◽  
Experimental Conditions ◽  
X Ray ◽  
Composition Control ◽  
Oxide Substrates ◽  
Temperature Deposition ◽  
Titanium Ethoxide

AbstractTransparent and highly specular PbTiO3 thin films were deposited on sapphire, platinum and ruthenium oxide-coated silicon wafers by hot-wall metallorganic chemical vapor deposition (MOCVD). Lead bis-tetramethylheptadionate and titanium ethoxide were used as chemical precursors. Films were deposited over a range of experimental conditions. X-ray diffraction (XRD) was used to determine the phases present in the films; Scanning Electron Microscopy (SEM) was used to examine the surface morphology and Energy Dispersive Spectroscopy (EDS) was used to determine the composition. Optical spectra were obtained to confirm the highly dense and transparent nature of the films. The chemical stability of the ruthenium oxide substrates in the MOCVD environment as well as the existence of a high-temperature deposition regime for composition control are also discussed.

Hot Filament Assisted CVD of Titanium Nitride Films

1993 ◽  
Vol 327 ◽  
Author(s):  
Sadanand V. Deshpande ◽  
Erdogan Gulari
Keyword(s):  
Thin Films ◽  
Titanium Nitride ◽  
Photoelectron Spectroscopy ◽  
Chemical Vapor ◽  
X Ray Diffraction ◽  
Titanium Chloride ◽  
X Ray ◽  
Aluminum Metallization ◽  
Temperature Deposition ◽  
Hot Filament

AbstractTitanium nitride thin films have been deposited using a novel Hot Filament Chemical Vapor Deposition (HFCVD) technique. In this technique, a resistively heated tungsten wire (∼1700°C) is used to decompose ammonia to obtain highly reactive nitrogen precursor species. This approach allows for low temperature deposition of nitride thin films. In the past, we have used this method to deposit good quality silicon and aluminum nitride films. Titanium nitride thin films have been deposited on Si(100) at substrate temperatures from 500°C to 600°C. These films were characterized using X-ray photoelectron spectroscopy (XPS), X-ray diffraction, Rutherford backscattering spectroscopy (RBS) and scanning electron microscopy. The effects of deposition pressure, substrate temperature and titanium chloride flow rate on film properties have been studied. TiN films with resistivities as low as 80.0 μΩ-cm have been deposited. RBS analysis indicates that the films serve as excellent diffusion barriers for copper and aluminum metallization on silicon.

Conducting Thin Films of Ruthenium Oxide Prepared by Mocvd

1998 ◽  
Vol 514 ◽  
Author(s):  
P. Hones ◽  
C.-H. Kohli ◽  
R. Sanjinés ◽  
F. Lévy ◽  
T. Gerfin ◽  
...  
Keyword(s):  
Thin Films ◽  
Metalorganic Chemical Vapor Deposition ◽  
Resistivity Measurement ◽  
Ruthenium Oxide ◽  
Chemical Vapor ◽  
X Ray Diffraction ◽  
X Ray ◽  
Sputtered Films ◽  
Before And After

ABSTRACTConducting thin films of RuO2 were grown at temperatures down to 623K on glass by metalorganic chemical vapor deposition (MOCVD). Tris-trifluoroacetylacetonate-ruthenium(III) (Ru(tfa)3) served as precursor. Smooth, specular and well adherent films were deposited, if the reaction gas contained water. The films were investigated by X-ray diffraction, SEM, and fourprobe resistivity measurement. Growth kinetics were also studied by in situ ellipsometry. The results are compared with films prepared by d.c. reactive sputtering before and after annealing. The properties of the MOCVD films, in particular the resistivity (ρ down to 72 μΩcm), are comparable to CVD films deposited at much higher temperatures and sputtered films after high temperature annealing.

scholarly journals Influence of the growth parameters of TiO2 thin films deposited by the MOCVD method

Cerâmica ◽  
2002 ◽  
Vol 48 (305) ◽  
pp. 38-42 ◽  
Author(s):  
M. I. B. Bernardi ◽  
E. J. H. Lee ◽  
P. N. Lisboa-Filho ◽  
E. R. Leite ◽  
E. Longo ◽  
...  
Keyword(s):  
Thin Films ◽  
Growth Parameters ◽  
Structural Characteristics ◽  
Chemical Vapor ◽  
X Ray Diffraction ◽  
Tio2 Thin Films ◽  
X Ray ◽  
Force Microscopy ◽  
Atomic Force ◽  
Deposition Parameters

The synthesis of TiO2 thin films was carried out by the Organometallic Chemical Vapor Deposition (MOCVD) method. The influence of deposition parameters used during growth on the final structural characteristics was studied. A combination of the following experimental parameters was studied: temperature of the organometallic bath, deposition time, and temperature and substrate type. The high influence of those parameters on the final thin film microstructure was analyzed by scanning electron microscopy with electron dispersive X-ray spectroscopy, atomic force microscopy and X-ray diffraction.

Preparation of AlN thin films by means of CVD using iodide source under atmospheric pressure

2007 ◽  
Vol 1040 ◽  
Author(s):  
Hiroki Iwane ◽  
Naoki Wakiya ◽  
Naonori Sakamoto ◽  
Takato Nakamura ◽  
Hisao Suzuki
Keyword(s):  
Thin Films ◽  
Residual Stress ◽  
Sapphire Substrate ◽  
Atmospheric Pressure ◽  
Chemical Vapor ◽  
Lattice Parameter ◽  
X Ray Diffraction ◽  
Cross Sectional ◽  
X Ray ◽  
Aluminum Iodide

AbstractEpitaxial aluminum nitride (AlN) thin films were successfully prepared on the (0001) sapphire substrate by chemical vapor deposition (CVD) using aluminum iodide (AlI3) and ammonia (NH3) under atmospheric pressure at 750 ºC. The crystallographic relationship between AlN thin films and Al2O3 substrate is in the following; AlN(0001)//Al2O3(0001) and AlN[1010]//Al2O3[1120]. Lattice parameters of AlN thin film measured by X-ray diffraction revealed that c=0.498 and a=0.311 nm, respectively. Residual stress estimated by modified sin2ψ method was 0.38 GPa in compressive stress. Cross-sectional TEM observation revealed that an interlayer lies between the AlN films and the sapphire substrate. It was suggested that relaxation of residual stress caused by the mismatching of lattice parameter and thermal expansion coefficient was brought about by the interlayer.

Ferroelectric Thin Films of Bismuth Titanate Prepared by Mocvd

1991 ◽  
Vol 243 ◽  
Author(s):  
H. Wang ◽  
L. W. Fu ◽  
S. X. Shang ◽  
S. Q. Yu ◽  
X. L. Wang ◽  
...  
Keyword(s):  
Thin Films ◽  
Bismuth Titanate ◽  
Growth Parameters ◽  
Chemical Vapor ◽  
Dispersion Analysis ◽  
Ferroelectric Thin Films ◽  
Tetrabutyl Titanate ◽  
X Ray Diffraction ◽  
X Ray ◽  
Mocvd Technique

AbstractThe ferroelectric thin films of bismuth titanate (Bi4Ti3O12) have been prepared by metalorganic chemical vapor deposition ( MOCVD) technique at atmosphere. The triphenyl bismuth (Bi(CaH5 ) 3)and tetrabutyl titanate (C16H36O4Ti) were used as precursors. Dense Bi4Ti3 O12 films with smooth shinning surface have been grown on Si( 100) substrates at 550°C whithout postannealing. The as- grown films were characterized by X-ray diffraction analysis (XRD), scanning electron microscopy (SEM) and energy dispersion analysis ( EDAX). The films showed well-ordered crystallinity with an (001)preffered orientation. The influence of growth parameters on deposition rate, composition and morphology of as-grown films was also discussed.

scholarly journals Simple solvothermal approach to highly nanostructured hematite thin films

2020 ◽  
Author(s):  
Casey M. Platnich ◽  
Jachym Slaby ◽  
David O'Connell ◽  
Simon Trudel
Keyword(s):  
Thin Films ◽  
Precursor Solution ◽  
Electrochemical Characteristics ◽  
X Ray Diffraction ◽  
Simple Method ◽  
X Ray ◽  
Surface Areas ◽  
Nucleation Sites ◽  
Synthetic Procedure ◽  
Oxide Substrates

In this work, we present a solvothermal method for the synthesis of hematite thin films on fluorine-doped tin oxide substrates. This simple method uses a precursor solution of iron(III) 2,4-pentanedionate dissolved in ethanol with a microliter-scale amount of water and yields hematite ~ 500-nm thick films after annealing. The synthesised films were characterised using an array of methods, including scanning electron microscopy, energy-dispersive X-ray spectroscopy, diffuse reflectance, and powder x-ray diffraction. Incorporating water into the precursor solution provides nucleation sites for the reaction and results show that by altering the amount of water used in the synthesis, it is possible to generate nanocrystalline films of different morphologies, nanocrystal size distributions, and surface areas. This synthetic procedure therefore provides control over the films’ physical and electrochemical characteristics. Doping of hematite thin films is also possible using this synthesis, as exemplified by doping with tin by adding tin(II) 2,4-pentanedionate to the precursor solution. To demonstrate utility, we build prototype photoelectrochemical cells using the synthesized hemtatite as the photoanode.

scholarly journals Structural Property Study for GeSn Thin Films

Materials ◽  
2020 ◽  
Vol 13 (16) ◽  
pp. 3645
Author(s):  
Liyao Zhang ◽  
Yuxin Song ◽  
Nils von den Driesch ◽  
Zhenpu Zhang ◽  
Dan Buca ◽  
...  
Keyword(s):  
Electron Microscopy ◽  
Thin Films ◽  
Transmission Electron Microscopy ◽  
Molecular Beam ◽  
Chemical Vapor ◽  
Threading Dislocations ◽  
X Ray Diffraction ◽  
Cross Sectional ◽  
X Ray ◽  
Transmission Electron

The structural properties of GeSn thin films with different Sn concentrations and thicknesses grown on Ge (001) by molecular beam epitaxy (MBE) and on Ge-buffered Si (001) wafers by chemical vapor deposition (CVD) were analyzed through high resolution X-ray diffraction and cross-sectional transmission electron microscopy. Two-dimensional reciprocal space maps around the asymmetric (224) reflection were collected by X-ray diffraction for both the whole structures and the GeSn epilayers. The broadenings of the features of the GeSn epilayers with different relaxations in the ω direction, along the ω-2θ direction and parallel to the surface were investigated. The dislocations were identified by transmission electron microscopy. Threading dislocations were found in MBE grown GeSn layers, but not in the CVD grown ones. The point defects and dislocations were two possible reasons for the poor optical properties in the GeSn alloys grown by MBE.

Low Volume Resistivity Chemical Vapor Deposited Boron Doped Polycrystalline Thin Diamond Film Growth on Sapphire

1996 ◽  
Vol 423 ◽  
Author(s):  
Hassan Golestanian ◽  
S. Mirzakuchaki ◽  
E. J. Charlson ◽  
T. Stacy ◽  
E. M. Charlson
Keyword(s):  
Thin Films ◽  
Chemical Vapor ◽  
Polycrystalline Diamond ◽  
Volume Resistivity ◽  
X Ray Diffraction ◽  
X Ray ◽  
Boron Doped ◽  
Chemical Vapor Deposited ◽  
Low Volume ◽  
Diamond Thin Films

AbstractHot-filament chemical vapor deposited (HFCVD) boron doped polycrystalline diamond thin films having low volume resistivity were grown on sapphire. The films were characterized using scanning electron microscope (SEM), X-ray diffraction, and current-voltage measurements. SEM micrographs show good crystalline structure with preferred (100) orientation normal to the surface of the film. X-ray diffraction pattern revealed diamond characteristics with the four typical diamond peaks present. Finally, the obtained I-V characteristics indicated that the film's volume resistivity is at least two orders of magnitude lower than those of HFCVD polycrystalline diamond thin films grown on silicon under similar growth conditions.

Characterization of Epitaxial Pb(Zrx,Ti1-x)O3 Thin Films with Composition Near the Morphotropic Phase Boundary

2002 ◽  
Vol 748 ◽  
Author(s):  
Keisuke Saito ◽  
Toshiyuki Kurosawa ◽  
Takao Akai ◽  
Shintaro Yokoyama ◽  
Hitoshi Morioka ◽  
...  
Keyword(s):  
Thin Films ◽  
Vapor Deposition ◽  
Metalorganic Chemical Vapor Deposition ◽  
Composition Range ◽  
Chemical Vapor ◽  
X Ray Diffraction ◽  
Reciprocal Space Mapping ◽  
Pzt Thin Films ◽  
X Ray

ABSTRACT200-nm-thick Pb(Zrx,Ti1-x)O3 (PZT) thin films with zirconium composition in the range from 0% to 65% were epitaxially grown on (001)c SrRuO3 (SRO)//SrTiO3 (STO) single crystal substrates by pulsed metalorganic chemical vapor deposition (pulsed MOCVD). Constituent crystallographic phases were characterized by high-resolution X-ray diffraction reciprocal space mapping. It was found that PZT thin films having zirconium composition from 45% to 60% show mixed tetragonal and pseudocubic phases and their lattice parameters remained constant in this composition range.

Growth of Ruthenium and Ruthenium oxide nanoplates

2011 ◽  
Vol 1309 ◽  
Author(s):  
Lamartine Meda ◽  
Geoffrey D. Stevens
Keyword(s):  
Indium Tin Oxide ◽  
Ruthenium Oxide ◽  
Chemical Vapor ◽  
Growth Conditions ◽  
X Ray Diffraction ◽  
Coated Glass Substrate ◽  
X Ray ◽  
Average Area ◽  
Continuous Layer ◽  
Vertically Aligned

ABSTRACTBy carefully manipulating and controlling the growth conditions, Ruthenium (Ru) and ruthenium oxide (RuO2) two-dimensional (2-D) nanostructure were self-assembled into a stack of plates on indium tin oxide coated glass substrate. The nanoplates were grown in a horizontal hot-wall metalorganic chemical vapor deposition (MOCVD) from ruthenocene. Each nanoplate has a thickness in the range of 25 - 60 nm and the average area is 1000 x 300 nm2. Each stack of nanoplates is approximately 1.2 m in height. A continuous layer of Ru and RuO2 thin film, which may serve as the growth template, is observed on the bottom of the nanoplate stacks. Field-emission scanning electron microscopy reveals that each stack of nanoplates was grown vertically aligned on the substrate and exhibited elongated shape. Structural properties which were examined by X-ray diffraction show that the nanoplates are polycrystalline.

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