Plasma Effects on Thin Film Microstructure

1994 ◽  
Vol 343 ◽  
Author(s):  
Munir D. Naeem ◽  
Stephen M. Rossnagel ◽  
Krishna Rajan
Keyword(s):  
Grain Growth ◽  
Thermal Effects ◽  
Low Energy ◽  
Copper Films ◽  
Rf Power ◽  
Plasma Exposure ◽  
Microstructural Changes ◽  
Cu Films ◽  
Transmission Electron ◽  
Plasma Effects

ABSTRACTWe have studied the effects of low energy ion bombardment on thin copper films. Evaporated, sputtered and CVD copper films (∼50 nm) were exposed to Magnetically Enhanced (ME) Ar plasmas. The microstructural changes (grain size) in the films were studied using Transmission Electron Microscopy (TEM).Grain growth is observed in thin Cu films when the films are exposed to low energy (87 eV) Ar plasmas. The microstructural changes in sputtered and evaporated films are quite significant whereas the plasma bombardment has less effect on CVD films. These changes occur very rapidly and cannot be attributed solely to the thermal effects, especially at low RF power levels (500 W). The initial microstructure of the film has a significant effect on grain growth during plasma exposure.

In-Situ Tem Investigation During Thermal Cycling of thin Copper Films

1996 ◽  
Vol 436 ◽  
Author(s):  
R.-M. Keller ◽  
W. Sigle ◽  
S. P. Baker ◽  
O. Kraft ◽  
E. Arzt
Keyword(s):  
Grain Growth ◽  
Room Temperature ◽  
Dislocation Motion ◽  
In Situ Tem ◽  
Copper Films ◽  
Stress Evolution ◽  
Cu Films ◽  
Transmission Electron ◽  
Insight Into

AbstractIn-situ transmission electron microscopy (TEM) was performed to study grain growth and dislocation motion during temperature cycles of Cu films with and without a cap layer. In addition, the substrate curvature method was employed to determine the corresponding stresstemperature curves from room temperature up to 600°C. The results of the in-situ TEM investigations provide insight into the microstructural evolution which occurs during the stress measurements. Grain growth occurred continuously throughout the first heating cycle in both cases. The evolution of dislocation structure observed in TEM supports an explanation of the stress evolution in both capped and uncapped films in terms of dislocation effects.

Influence of a Capping Layer on the Mechanical Properties of Copper Films

1994 ◽  
Vol 356 ◽  
Author(s):  
R.-M. Keller ◽  
S. Bader ◽  
R. P. Vinci ◽  
E. Arzt
Keyword(s):  
Mechanical Properties ◽  
Film Thickness ◽  
Grain Growth ◽  
Low Temperatures ◽  
Bauschinger Effect ◽  
Diffusional Creep ◽  
Copper Films ◽  
Cu Films ◽  
Heating And Cooling ◽  
Cooling Stress

AbstractThe substrate curvature technique was employed to study the mechanical properties of 0.6 μm and 1.0 μm Cu films capped with a 50 nm thick Si3N4 layer and to compare them with the mechanical properties of uncapped Cu films. The microstructures of these films were also investigated. Grain growth, diffusional creep and dislocation processes are impeded by the cap layer. This is evident in the form of high stresses at high temperatures on heating and at low temperatures on cooling. At intermediate temperatures on heating and cooling, stress plateaus a relatively low stresses exist. This can be explained by the so-called Bauschinger effect. A film thickness dependence of the stresses in the film could not be observed for capped Cu films.

Microstructural Evolution of Ion Bombarded Copper Thin Films

1999 ◽  
Vol 585 ◽  
Author(s):  
T. Wagner ◽  
D. Müller
Keyword(s):  
Grain Size ◽  
Ion Bombardment ◽  
Low Energy ◽  
Copper Films ◽  
Cu Films ◽  
Grain Sizes ◽  
Argon Ion Bombardment ◽  
Argon Ions ◽  
Argon Ion ◽  
Deposited Films

AbstractThe effect of low-energy ion bombardment on the microstructure of copper films will be described. The copper films have been deposited on SiNx-coated, oxidized Si wafers by magnetron sputtering with a simultaneous bombardment of low-energy argon ions (60 eV). The films were annealed at 450°C in HV. The ion bombardment leads to a stronger and sharper {111} texture of the as-deposited films. After annealing, the ion-bombarded films had a significantly smaller grain size than films produced without ion bombardment. The experimental results will be discussed relating the textures of the as-deposited films with the grain sizes obtained after annealing. Details will be given describing how the microstructure of Cu films can be tailored using low-energy argon ion bombardment.

Phenomena Associated with Oxygen in Titanium

1967 ◽  
Vol 25 ◽  
pp. 310-311
Author(s):  
E. U. Lee ◽  
P. A. Garner ◽  
J. S. Owens
Keyword(s):  
Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
Electron Microscope ◽  
Microstructural Changes ◽  
Electrolytic Polishing ◽  
Interstitial Impurities ◽  
Thin Foils ◽  
Transmission Electron ◽  
Iodide Titanium ◽  
Alpha Titanium

Evidence for ordering (1-6) of interstitial impurities (O and C) has been obtained in b.c.c. metals, such as niobium and tantalum. In this paper we report the atomic and microstructural changes in an oxygenated c.p.h. metal (alpha titanium) as observed by transmission electron microscopy and diffraction.Oxygen was introduced into zone-refined iodide titanium sheets of 0.005 in. thickness in an atmosphere of oxygen and argon at 650°C, homogenized at 800°C and furnace-cooled in argon. Subsequently, thin foils were prepared by electrolytic polishing and examined in a JEM-7 electron microscope, operated at 100 KV.

Investigation of ultra-thin films of YBa2Cu3O7−δ grown on MgO

1990 ◽  
Vol 48 (4) ◽  
pp. 6-7
Author(s):  
S.K. Streiffer ◽  
C.B. Eom ◽  
J.C. Bravman ◽  
T.H. Geballet
Keyword(s):  
Thin Films ◽  
Room Temperature ◽  
Deposition Process ◽  
Nucleation And Growth ◽  
Multilayer Structures ◽  
Rf Power ◽  
Oxygen Loss ◽  
Transmission Electron ◽  
Single Target ◽  
Mtorr Argon

The study of very thin (<15 nm) YBa2Cu3O7−δ (YBCO) films is necessary both for investigating the nucleation and growth of films of this material and for achieving a better understanding of multilayer structures incorporating such thin YBCO regions. We have used transmission electron microscopy to examine ultra-thin films grown on MgO substrates by single-target, off-axis magnetron sputtering; details of the deposition process have been reported elsewhere. Briefly, polished MgO substrates were attached to a block placed at 90° to the sputtering target and heated to 650 °C. The sputtering was performed in 10 mtorr oxygen and 40 mtorr argon with an rf power of 125 watts. After deposition, the chamber was vented to 500 torr oxygen and allowed to cool to room temperature. Because of YBCO’s susceptibility to environmental degradation and oxygen loss, the technique of Xi, et al. was followed and a protective overlayer of amorphous YBCO was deposited on the just-grown films.

Effect of Thermal Stress on Anisotropic Grain Growth in Nano-Twinned and Un-Twinned Copper Films

2020 ◽  
Author(s):  
I-Hsin Tseng ◽  
Yun-Ting Hsu ◽  
Jihperng Leu ◽  
K. N. Tu ◽  
Chih Chen
Keyword(s):  
Thermal Stress ◽  
Grain Growth ◽  
Copper Films

The Effect of Grain Size on Superplastic Deformation of Ti-6Al-4V Alloy

2007 ◽  
Vol 551-552 ◽  
pp. 387-392 ◽  
Author(s):  
Wen Juan Zhao ◽  
Hua Ding ◽  
D. Song ◽  
F.R. Cao ◽  
Hong Liang Hou
Keyword(s):  
Grain Size ◽  
Grain Growth ◽  
Superplastic Deformation ◽  
Initial Strain Rate ◽  
Deformation Mode ◽  
Tensile Tests ◽  
Optical Microscope ◽  
Coarse Grained ◽  
Transmission Electron ◽  
Grain Growth Model

In this study, superplastic tensile tests were carried out for Ti-6Al-4V alloy using different initial grain sizes (2.6 μm, 6.5μm and 16.2 μm) at a temperature of 920°C with an initial strain rate of 1×10-3 s-1. To get an insight into the effect of grain size on the superplastic deformation mechanisms, the microstructures of deformed alloy were investigated by using an optical microscope and transmission electron microscope (TEM). The results indicate that there is dramatic difference in the superplastic deformation mode of fine and coarse grained Ti-6Al-4V alloy. Meanwhile, grain growth induced by superplastic deformation has also been clearly observed during deformation process, and the grain growth model including the static and strain induced part during superplastic deformation was utilized to analyze the data of Ti-6Al-4V alloy.

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