Defects in Superconductor thin Films

1994 ◽  
Vol 357 ◽  
Author(s):  
A. S. Nandedkar ◽  
L. Ganapathi

AbstractComputer aided simulations were used to investigate various grain boundary configurations in superconducting (YBa2Cu3O7) thin films. Four angles for tilt grain boundaries were simulated (12.45°, 53.5°, 66.4°, and 74.6°). Energies of unrelaxed configurations were calculated.

2004 ◽  
Vol 821 ◽  
Author(s):  
Markus J. Buehler ◽  
Alexander Hartmaier ◽  
Huajian Gao

AbstractIn a recent study of diffusional creep in polycrystalline thin films deposited on substrates, we have discovered a new class of defects called the grain boundary diffusion wedges (Gao et al., Acta Mat. 47, pp. 2865-2878, 1999). These diffusion wedges are formed by stress driven mass transport between the free surface of the film and the grain boundaries during the process of substrate-constrained grain boundary diffusion. The mathematical modeling involves solution of integro-differential equations representing a strong coupling between elasticity and diffusion. The solution can be decomposed into diffusional eigenmodes reminiscent of crack-like opening displacement along the grain boundary which leads to a singular stress field at the root of the grain boundary. We find that the theoretical analysis successfully explains the difference between the mechanical behaviors of passivated and unpassivated copper films during thermal cycling on a silicon substrate. An important implication of our theoretical analysis is that dislocations with Burgers vector parallel to the interface can be nucleated at the root of the grain boundary. This is a new dislocation mechanism in thin films which contrasts to the well known Mathews-Freund-Nix mechanism of threading dislocation propagation. Recent TEM experiments at the Max Planck Institute for Metals Research have shown that, while threading dislocations dominate in passivated metal films, parallel glide dislocations begin to dominate in unpassivated copper films with thickness below 400 nm. This is consistent with our theoretical predictions. We have developed large scale molecular dynamics simulations of grain boundary diffusion wedges to clarify the nucleation mechanisms of parallel glide in thin films. Such atomic scale simulations of thin film diffusion not only show results which are consistent with both continuum theoretical and experimental studies, but also revealed the atomic processes of dislocation nucleation, climb, glide and storage in grain boundaries. The study should have far reaching implications for modeling deformation and diffusion in micro- and nanostructured materials.


Author(s):  
Ken Suzuki ◽  
Yiqing Fan ◽  
Yifan Luo

Abstract Electroplated copper thin films often contain porous grain boundaries and the volume ratio of porous grain boundaries in the copper thin films is much larger than that in bulk copper. Thus, the lifetime of the interconnection components fabricated by electroplating is strongly dominated by the strength of grain boundaries because final fracture caused by the acceleration of atomic diffusion during electromigration (EM) occurs at grain boundaries in polycrystalline interconnections. It is important, therefore, to quantitatively evaluate the grain boundary strength of electroplated copper films for estimating the lifetime of the interconnection in order to assure the product reliability. In this study, relationship between the strength and crystallinity of electroplated copper thin films was investigated experimentally and theoretically. In order to investigate the relationship between the strength and grain boundary quality, molecular dynamics (MD) simulations were applied to analyze the deformation behavior of a bicrystal sample and its strength. The variation of the strength and deformation property were attributed to the higher defect density around grain boundaries.


2015 ◽  
Vol 21 (4) ◽  
pp. 927-935 ◽  
Author(s):  
Matthew M. Nowell ◽  
Michael A. Scarpulla ◽  
Naba R. Paudel ◽  
Kristopher A. Wieland ◽  
Alvin D. Compaan ◽  
...  

AbstractThe performance of polycrystalline CdTe photovoltaic thin films is expected to depend on the grain boundary density and corresponding grain size of the film microstructure. However, the electrical performance of grain boundaries within these films is not well understood, and can be beneficial, harmful, or neutral in terms of film performance. Electron backscatter diffraction has been used to characterize the grain size, grain boundary structure, and crystallographic texture of sputtered CdTe at varying deposition pressures before and after CdCl2 treatment in order to correlate performance with microstructure. Weak fiber textures were observed in the as-deposited films, with (111) textures present at lower deposition pressures and (110) textures observed at higher deposition pressures. The CdCl2-treated samples exhibited significant grain recrystallization with a high fraction of twin boundaries. Good correlation of solar cell efficiency was observed with twin-corrected grain size while poor correlation was found if the twin boundaries were considered as grain boundaries in the grain size determination. This implies that the twin boundaries are neutral with respect to recombination and carrier transport.


1993 ◽  
Vol 309 ◽  
Author(s):  
D. R. Frear ◽  
J. R. Michael ◽  
A. D. Romig

AbstractThe microstructural evolution of unpatterned Al-2wt.%Cu thin films has been examined to elucidate the mechanism by which copper improves electromigration resistance. After annealing at 425°C and cooling to room temperature at a rate of approximately 1°C/min., the microstructure of the Al-Cu films consisted of 1 μm aluminum grains with θ-phase Al2Cu precipitates at grain boundaries and triple points. The grain size and precipitation distribution did not change with subsequent isothermal heat treatments in the temperature range of 200° to 400°C. Al-Cu thin films annealed at 400°C, a temperature just below the Al/Al+θ solvus, exhibited microstructures in which the aluminum grain boundaries were depleted in copper except for the presence of the pre-existing large, widely dispersed AI2Cu precipitates. Al-Cu thin films annealed at 200° to 300°C were enriched with copper at the aluminum grain boundaries. The large, widely dispersed Al2Cu precipitates remained after the lower temperature anneals. From these results, it is proposed that the presence of copper in aluminum thin films improves electromigration resistance due to the precipitation of a thin film of Al2Cu, or a substoichiometric precursor, along the grain boundaries. The grain boundary phase retards grain boundary diffusion in the thin films, thereby reducing total mass transport and improving electromigration resistance.


1981 ◽  
Vol 10 ◽  
Author(s):  
D. R. Campbell ◽  
S. Mader ◽  
W. K. Chu

ABSTRACTResistivity and grain size measurements on thin films of co-sputtered WSi2 show that the resistivity in this material is dominated by grain boundary scattering. The reflection coefficient for the transport of charge carriers through the grain boundaries was determined to be approximately 0.9.


1997 ◽  
Vol 495 ◽  
Author(s):  
Alan R. Krauss ◽  
Dieter M. Gruen ◽  
Daniel Zhou ◽  
Thomas G. Mccauley ◽  
Lu Chang Qin ◽  
...  

ABSTRACTNanocrystalline diamond thin films have been produced by microwave plasma-enhanced chemical vapor deposition (MPECVD) using C60/Ar/H2 or CH4/Ar/H2 plasmas. Films grown with H2 concentration ≤ 20% are nanocrystalline, with atomically abrupt grain boundaries and without observable graphitic or amorphous carbon phases. The growth and morphology of these films are controlled via a high nucleation rate resulting from low hydrogen concentration in the plasma. Initial growth is in the form of diamond, which is the thermodynamic equilibrium phase for grains < 5 nm in diameter. Once formed, the diamond phase persists for grains up to at least 15–20 nm in diameter. The renucleation rate in the near-absence of atomic hydrogen is very high (∼1010 cm2sec−1), limiting the average grain size to a nearly constant value as the film thickness increases, although the average grain size increases as hydrogen is added to the plasma. For hydrogen concentrations less than ∼20%, the growth species is believed to be the carbon dimer, C2, rather than the CH3* growth species associated with diamond film growth at higher hydrogen concentrations. For very thin films grown from the C60 precursor, the threshold field (2 to ∼60 volts/micron) for cold cathode electron emission depends on the electrical conductivity and on the surface topography, which in turn depends on the hydrogen concentration in the plasma. A model of electron emission, based on quantum well effects at the grain boundaries is presented. This model predicts promotion of the electrons at the grain boundary to the conduction band of diamond for a grain boundary width ∼3–4 Å, a value within the range observed by TEM.


1996 ◽  
Vol 436 ◽  
Author(s):  
W. Vollmann ◽  
H.-U. Sonntag

AbstractThe electrical properties of vacuum sublimed thin films of TTF-TCNQ and its derivatives mainly are determined by electron barriers at grain boundaries. The electrical conductivity is thermal activated and exhibits a significant dependence on a force acting perpenticularly to the film plane. The sample resistance R decreases continiously with increasing force F. TCNQ thin films on steel show a similar R-F relation. The effect has been observed already at forces of 1 N, but also up to about 60 kN. An explanation of these phenomena is given by a grain boundary limited hopping mechanism with pressure dependent potential barrier width and height. Morphology investigations by SEM support the model.


1999 ◽  
Vol 596 ◽  
Author(s):  
Jang-Sik Lee ◽  
Eung-Chul Park ◽  
Jung-Ho Park ◽  
Byung-Il Lee ◽  
Seung-Ki Joo

AbstractThe effects of grain boundaries on the characteristics of the PZT thin films using single-grained PZT array by selective nucleation and growth method were investigated by locating the upper Pt electrode of 8 μm× 8 μm sized square directly on the single grains, 1 grain boundary and 4 grain boundaries in a controlled manner. It turned out that when there was no grain boundary, the best ferroelectric and electrical performance were obtained as expected. However, serious degradation was observed in polarization, leakage current, breakdown field and fatigue characteristics when grain boundary was contained in the area measured. This is the first qualitative investigation about the effects of the grain boundaries on the ferroelectric and electrical performance of the PZT thin films. It was found that degradation of the PZT thin films was accelerated with increasing the length of the grain boundaries within the top electrode and the main source of degradation in PZT thin films is grain boundary.


1992 ◽  
Vol 275 ◽  
Author(s):  
H. B. Lu ◽  
S. L. Tu ◽  
J. J. Wang ◽  
J. Lin ◽  
T. W. Huang ◽  
...  

ABSTRACTThe characteristics of YBa2Cu3O7−x (YBCO) thin films by laser ablation on MgO bicrystals have been investigated. The bicrystals were fabricated by hot pressing two single crystals with the configuration of [001] tilt boundaries. The YBCO films were epitaxial grown with C-axis normal to the both adjacent grains of bicrystals. The FWHM about (005) reflection was 0.4–0.5 degree, indicating the high degree of the oriention for the film with small mosaic spread. Our preliminary study showed that the typical value of Jc on either side of the bicrystal boundary was 0.4–10×106 A/cm2 at 15K, while that across the 10° tilt boundaries was 0.3–9×105 A/cm2 at 15K. These results implied that the artificial grain boundaries effectively weakened the supercurrent, and therefore, the weak-link properties of artificial boundaries were more easily controllable than those of naturally occuring grain boundaries.


1994 ◽  
Vol 9 (6) ◽  
pp. 1484-1498 ◽  
Author(s):  
H. Hu ◽  
S.B. Krupanidhi

Room-temperature current-voltage dependence of ultrafine-grained ferroelectric Pb(Zr, Ti)O3 thin films has been investigated. Both strong varistor type behavior and space charge limited conduction (SCLC) were observed. Differences in the current-voltage characteristics are attributed to differences in the nature of the grain boundaries resulting from variations in processing conditions. The strong varistor type behavior is believed to be due to the presence of highly resistive grain boundaries and thus may be termed grain boundary limited conduction (GBLC). A double-depletion-layer barrier model is used to describe the origin of high resistivity of the grain boundaries. It is suggested that the barrier height varies significantly with the applied field due to the nonlinear ferroelectric polarization, and that the barrier is overcome by tunneling at sufficiently high fields. In some other cases, the resistivity of the grain boundaries is comparable to that of the grains, and therefore the intrinsically heterogeneous films degenerate into quasi-homogeneous media, to which the SCLC theory is applicable. As such, a unified grain boundary modeling reconciles different types of conduction mechanisms in the ultrafine-grained ferroelectric thin films. This grain boundary modeling also well accounts for some other dc-related phenomena observed, including abnormal current-voltage dependencies, remanent polarization effect, electrode interface effect, and unusual charging and discharging transients. In addition, many other electrical properties of the ferroelectric films may be better understood by taking the effect of grain boundaries into account.


Sign in / Sign up

Export Citation Format

Share Document