Dislocations and Internal Stresses in Thin Films: A Discrete-Continuum Simulation

1999 ◽  
Vol 578 ◽  
Author(s):  
C. Lemarchand ◽  
B. Devincre ◽  
L.P. Kubin ◽  
J.L. Chaboche

The plasticity of thin films and layers is of considerable technological interest. For instance, the relaxation of internal stresses in semiconducting epitaxial layers has been the object of many studies [1, 2]. This relaxation is usually treated via the concept of critical thickness, the latter being defined as the maximum layer thickness below which dislocations cannot spontaneously move and relax the internal stresses. The various internal stresses present in epitaxial layers (e.g. the misfit and elastic incompatibility stresses at the film/substrate interface and the image force in a free-standing film) can be computed within a continuum frame. However, the way they influence the motion of a dislocation has not yet been computed, even in a approximate manner. An useful approximation that allows treating the boundary condition at the surface of a free-standing film consists of making use of the concept of image dislocation. Then, the critical stress for moving a dislocation in a free-standing film is the same as that of a capped layer of thickness twice that of the film. To date, models and dislocation dynamics (DD) simulations are available that involve several levels of approximation for the treatment of the dislocation/interface and dislocation/surface interactions [3–7]. For reasons that are not clearly understood, however, these models predict critical thicknesses that are systematically larger than the expected ones. The comparison with experiment is, in addition, made difficult because stresses have to be artificially introduced to replace the internal stresses and approximations have to be done to treat the image stresses. In the present work it is shown that it is now possible to fully account for the contribution of the various sources of internal stresses to the critical stress for the motion of a threading dislocation. This is performed numerically with the help of a hybrid code that combines a DD code for the treatment of the dislocation dynamics and a Finite Element (FE) code for the treatment of the boundary conditions. In what follows, several applications of this discrete-continuum model (DCM) to the study of dislocation motion in epitaxial layers are presented. The motion of a dislocation in a thin film is considered, including the image force and successively adding a misfit stress and an elastic incompatibility stress at the film/substrate interface.

2005 ◽  
Vol 875 ◽  
Author(s):  
E.H. Tan ◽  
L.Z. Sun

AbstractBased on the physical background, a new dislocation dynamics model fully incorporating the interaction among differential dislocation segments is developed to simulate 3D dislocation motion in crystals. As the numerical simulation results demonstrate, this new model completely solves the long-standing problem that simulation results are heavily dependent on dislocation-segment lengths in the classical dislocation dynamics theory. The proposed model is applied to simulate the effect of dislocations on the mechanical performance of thin films. The interactions among the dislocation loops, free surface and interfaces are rigorously computed by a decomposition method. This framework can be used to simulate how a surface loop evolves into two threading dislocations and to determine the critical thickness of thin films. Furthermore, the relationship between the film thickness and yield strength is established and compared with the conventional Hall-Petch relation.


1993 ◽  
Vol 318 ◽  
Author(s):  
D. Lubben ◽  
F. A. Modine

ABSTRACTThe ionic conductivity of LiI thin films grown on sapphire(0001) substrates has been studied in situ during deposition as a function of film thickness and deposition conditions. LiI films were produced at room temperature by sublimation in an ultra-high-vacuum system. The conductivity of the Lil parallel to the film/substrate interface was determined from frequency-dependent impedance measurements as a function of film thickness using Au interdigital electrodes deposited on the sapphire surface. The measurements show a conduction of ∼5 times the bulk value at the interface which gradually decreases as the film thickness is increased beyond 100 nm. This interfacial enhancement is not stable but anneals out with a characteristic log of time dependence. Fully annealed films have an activation energy for conduction (σT) of ∼0.47 ± .03 eV, consistent with bulk measurements. The observed annealing behavior can be fit with a model based on dislocation motion which implies that the increase in conduction near the interface is not due to the formation of a space-charge layer as previously reported but to defects generated during the growth process. This explanation is consistent with the behavior exhibited by CaF2 films grown under similar conditions.


2016 ◽  
Vol 725 ◽  
pp. 189-194
Author(s):  
Ying Ying Cai ◽  
Jia Pei Guo ◽  
Yi Ping Chen

At the microscopic scale fast neutron irradiation brings about a high density of small point defect clusters in the form of dislocation loops and voids. And such radiation damage is of primary importance for materials used in nuclear energy production. In the present investigation emphasis is placed on the understanding of the mechanisms involved in the evolution of prismatic dislocation loops by glide in the presence of external free surfaces and those of the voids and in the interaction between dislocation loops and voids within irradiated thin films, so as to simulate in situ Transmission Electron Microscopy (TEM) images of dislocations, which is an indispensable tool for extracting information on radiation damage. By employing 3D dislocation dynamics based on isotropic elacticity and principle of superposition, the calculation results show that the image force is determined by the distance of the dislocation loop from the external and void surfaces and scales with the film thickness; the dislocation glide force is determined by the image stress as well as the loop–loop interaction stress which is in turn governed by the loop spacing. It is also shown that the presence of voids in the thin films has a strong influence on the behaviours of prismatic dislocations.


2020 ◽  
Vol 8 (26) ◽  
pp. 8804-8813 ◽  
Author(s):  
Md Saifuddin ◽  
Mala Mukhopadhyay ◽  
Arindam Biswas ◽  
Lara Gigli ◽  
Jasper R. Plaisier ◽  
...  

In solution-aged thin films, edge-on oriented ordering of nanofibers, along the z-direction, extends by thermal annealing, while near the film–substrate interface, it improves by combined solvent vapor and thermal annealing


2001 ◽  
Vol 16 (11) ◽  
pp. 3073-3083 ◽  
Author(s):  
Y. Xin ◽  
K. Han ◽  
N. Mateeva ◽  
H. Garmestani ◽  
P. N. Kalu ◽  
...  

The microstructure of La1–xAx(A = Ca or Sr)MnO3–δ thin films grown by liquid-delivery metalorganic chemical vapor deposition on (001) MgO and (110)pseudo-cubic LaAlO3 were studied by transmission electron microscopy. The La1–xCaxMnO3–δ thin film on large lattice mismatched MgO exhibited very defective microstructures and consisted of two typical regions. The first region was close to the film–substrate interface and had an epitaxial relationship to the substrate with many differently oriented domains nucleated on the substrate surface. The second region consisted of columnar grains with some degree of texture. In contrast, the smaller lattice-mismatched La1–xSrxMnO3–δ/(110)pseudo-cubic LaAlO3 film had good crystalline quality with highly oriented columnar grains but exhibited complicated dislocation structures. Apart from the misfit dislocations formed at the film–substrate interface, two types of anomalous dislocations with limited contribution to relieving misfit stresses were also observed. One type of dislocation had extra planes in the film and some climbed into the substrate. These dislocations were considered to form from dislocation loops during nucleation of the film. The other type of dislocations had extra planes parallel to the film–substrate interface and glided into the substrate side resulting in a 2° tilt of the film with respect to the substrate. The complicated dislocation configurations present in the sample were related to the complex strain field in the film. The relative strains along the interface measured in the film were heterogeneous. The variations of the strains in the film were related to the local Curie temperature changes and second-order phase transitions of the film.


2005 ◽  
Vol 237-240 ◽  
pp. 524-530
Author(s):  
Eugen Rabkin ◽  
Leonid Klinger

We considered the flattening of perturbed surface of a thin stress-free polycrystalline film with columnar microstructure deposited on rigid substrate. We show that the mass transport along the film/substrate interface and along the grain boundaries significantly contributes to the overall rate of surface flattening of the film. The diffusion along the film/substrate interface and along the grain boundaries is driven by the capillary stresses in the film. Using the approximation of small surface slopes, we calculated the distribution of capillary stresses in the film, and derived an explicit expression for the temporal behavior of the film topography. The initial distribution of the capillary stresses rapidly relaxes to the steady-state one that does not allow the accumulation of bending strain in the film. For the films with passivated or contaminated surfaces exhibiting reduced surface diffusivity the interfacial and grain boundary diffusion play a leading role in kinetics of surface flattening. The flattening process can be accelerated in this case by several orders of magnitude. The results of our work can be helpful in design of thin films and coatings with enhanced selfhealing capabilities.


2003 ◽  
Vol 779 ◽  
Author(s):  
Lucia Nicola ◽  
Erik Van der Giessen ◽  
Alan Needleman

AbstractThermal stress evolution in polycrystalline thin films is analyzed using discrete dislocation plasticity. Stress develops in the film during cooling from a stress-free configuration due to the difference in thermal expansion coefficient between the film and its substrate. A plane strain formulation with only edge dislocations is used and each grain of the polycrystal has a specified set of slip systems. The film–substrate interface and the grain boundaries are impenetrable for the dislocations. Results are presented for two film thicknesses, with higher hardening seen for the thinner films.


2016 ◽  
Vol 18 (15) ◽  
pp. 10486-10491 ◽  
Author(s):  
Edmund M. Mills ◽  
Matthias Kleine-Boymann ◽  
Juergen Janek ◽  
Hao Yang ◽  
Nigel D. Browning ◽  
...  

The grain boundary resistance of nano-columnar yttria-stabilized zirconia thin films is almost completely eliminated near the film–substrate interface through substrate induced magnesium doping.


2014 ◽  
Vol 996 ◽  
pp. 930-935
Author(s):  
Romain Cauchois ◽  
András Borbély ◽  
Patrice Gergaud ◽  
Mohamed Saadaoui ◽  
Karim Inal

Colloidal suspensions of nanoparticles are increasingly employed in the fabrication process of electronic devices using inkjet-printing technology and a consecutive thermal treatment. The evolution of internal stresses during the conversion of silver nanoparticle-based ink into a metallic thin-film by a thermal sintering process has been investigated by in-situ XRD using the sin2ψ method. Despite the CTE mismatch at the film/substrate interface, the residual stress in silver films (below 70 MPa) remains lower than in conventional PVD thin-films, as a result of the remaining porosity. A Warren-Averbach analysis further showed that the crystallite growth is associated with a minimization of the twin fault density and the elastic microstrain energy above 150°C. A stabilization of the microstructure and internal stress is observed above 300°C. Inkjet-printing technology thus appears as a good alternative to conventional metallization techniques and offers significant opportunities asset for interconnect and electronic packaging.


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