Transfer and handling of thin semiconductor materials by a combination of wafer bonding and controlled crack propagation

2001 ◽  
Vol 681 ◽  
Author(s):  
J. Bagdahn ◽  
D. Katzer ◽  
M. Petzold ◽  
M. Wiemer ◽  
M. Alexe ◽  
...  
Keyword(s):  
Bond Strength ◽  
Crack Propagation ◽  
Crack Growth ◽  
Wafer Bonding ◽  
Subcritical Crack Growth ◽  
Appropriate Technology ◽  
Semiconductor Materials ◽  
Bonded Interface ◽  
Thin Semiconductor ◽  
Bulk Semiconductor

ABSTRACTDirect waferbonding is an appropriate technology to join two or more wafers of the same or of different materials. Waferbonding can be used to stiffen thin wafers during fabrication. However, conventional fabrication processes lead to an increase of the bond strength, which inhibits the required de-bonding. The propagation of cracks, which is based on a subcritical crack growth in the bonded interface, was used to cleave the bonded wafers. The subcritical crack growth is limited to the bonded interface, since the adjacent bulk semiconductor materials are inherently resistant to subcritical crack growth. The process allows the separation of Si-Si and Si-GaAs wafers after annealing. Wafer-bonded SOI wafers can also be separated with this technology even if they were annealed at 1100°C. The first examples for wafer stiffening during fabrication and wafer transfer using the developed approach will be presented.

Mechanical Behavior of Alumina Toughened Zirconia Nanocomposites with Different Alumina Additions

2014 ◽  
Vol 96 ◽  
pp. 61-66 ◽  
Author(s):  
Luis Antonio Díaz ◽  
Sergio Rivera ◽  
Adolfo Fernández ◽  
Anna Okunkova ◽  
Yu.G. Vladimirov ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Crack Propagation ◽  
Mechanical Behavior ◽  
Crack Growth ◽  
Disperse Phase ◽  
Subcritical Crack Growth ◽  
The Other ◽  
Structural Components ◽  
Monolithic Ceramics

ZrO2 and Al2O3 are monolithic ceramics used today in a wide variety of structural components. However, both materials present important drawbacks for some specific applications. In the case of Al2O3, its moderate strength (500 MPa) and toughness (4 MPa.√m) makes it unsuitable for high loading conditions. On the other hand, ZrO2 presents higher strength and toughness values (900 MPa and 6 MPa.√m) than Al2O3 but it is a material limited in its long-term behaviour due to its bad response to hydrothermal ageing and a pronounced tendency for subcritical crack growth. Due to this fact, ceramic nanocomposites made of Al2O3 and ZrO2 (ATZ and ZTA) have been developed in the last years in order to overcome the main drawbacks of the monolithic materials as they can combine the properties of both, strong and tough materials, simultaneously, with null ageing and even higher biocompatibility. In this work, several amounts of Al2O3 disperse phase (15, 35 and 50 vol %) were added to one ZrO2 matrix (CeO2 - 10 mol %) in order to see their effect on the mechanical properties, subcritical crack propagation and long-term reliability.

scholarly journals Subcritical crack growth in oxide and non-oxide ceramics using the constant stress rate test

2015 ◽  
Vol 9 (4) ◽  
pp. 187-191 ◽  
Author(s):  
Agnieszka Wojteczko ◽  
Radosław Lach ◽  
Kamil Wojteczko ◽  
Paweł Rutkowski ◽  
Dariusz Zientara ◽  
...  
Keyword(s):  
Fracture Toughness ◽  
Crack Propagation ◽  
Crack Growth ◽  
Subcritical Crack Growth ◽  
Constant Stress ◽  
Stress Rate ◽  
Oxide Ceramics ◽  
Subcritical Crack Propagation ◽  
Growth Phenomenon ◽  
Rate Test

Fracture toughness is one of the most important parameters for ceramics description. In some cases, material failure occurs at lower stresses than described by KIc parameter. In these terms, determination of fracture toughness only, proves to be insufficient. This may be due to environmental factors, such as humidity, which might cause subcritical crack propagation in a material. Therefore, it is very important to estimate crack growth velocities to predict lifetime of ceramics used under specific conditions. Constant Stress Rate Test is an indirect method of subcritical crack growth parameters estimation. Calculations are made by using strength data, thus avoiding crack measurement. The expansion of flaws causes reduction of material strength. If subcritical crack growth phenomenon occurs, critical value of crack lengths increases with decreasing stress rate due to longer time for flaw to grow before the critical crack propagation at KIc takes place. Subcritical crack growth phenomenon is particularly dangerous for oxide ceramics due to chemical interactions occurring as a result of exposure to humidity. This paper presents results of Constant Stress Rate Test performed for alumina, zirconia, silicon carbide and silicon nitride in order to demonstrate the differences in subcritical crack propagation phenomenon course.

Residual Lifetime Determination of Low Temperature Co-Fired Ceramics

2016 ◽  
Vol 713 ◽  
pp. 266-269
Author(s):  
Zdeněk Majer ◽  
Kateřina Štegnerová ◽  
Pavel Hutař ◽  
Martin Pletz ◽  
Raul Bermejo ◽  
...  
Keyword(s):  
Low Temperature ◽  
Residual Stresses ◽  
Crack Propagation ◽  
Crack Growth ◽  
Subcritical Crack Growth ◽  
Particulate Composite ◽  
Ceramic Materials ◽  
Ceramic Composites ◽  
Residual Lifetime ◽  
Density Factor

The effect of subcritical crack growth is nowadays intensively studied mainly in relation to the strength of ceramic materials. The main aim of the contribution is to describe behavior of micro-crack propagating in the Low Temperature Co-fired Ceramics (LTCC) under subcritical crack growth (SCCG) conditions. The micro-crack behavior is significantly influenced by residual stresses developed in the LTCC due to different coefficients of thermal expansion of individual components. Two-dimensional numerical model was developed to simulate micro-crack propagation through the composite. The micro-crack propagation direction was determined using Sih’s criterion based on the strain energy density factor and the micro-crack path was obtained. The residual lifetime of the specific ceramic particulate composite (LTCC) was estimated on the basis of experimental data. The paper contributes to a better understanding of micro-crack propagation in particulate ceramic composites in the field of residual stresses.

Examination of Fracture Interfaces in Silicon Nitride

1975 ◽  
Vol 33 ◽  
pp. 60-61
Author(s):  
Nancy J. Tighe
Keyword(s):  
Silicon Nitride ◽  
Grain Boundary ◽  
Crack Growth ◽  
Subcritical Crack Growth ◽  
Slow Crack Growth ◽  
Ceramic Materials ◽  
Grain Boundary Sliding ◽  
Boundary Phase ◽  
Turbine Engines ◽  
Boundary Sliding

Silicon nitride is one of the ceramic materials being considered for the components in gas turbine engines which will be exposed to temperatures of 1000 to 1400°C. Test specimens from hot-pressed billets exhibit flexural strengths of approximately 50 MN/m2 at 1000°C. However, the strength degrades rapidly to less than 20 MN/m2 at 1400°C. The strength degradition is attributed to subcritical crack growth phenomena evidenced by a stress rate dependence of the flexural strength and the stress intensity factor. This phenomena is termed slow crack growth and is associated with the onset of plastic deformation at the crack tip. Lange attributed the subcritical crack growth tb a glassy silicate grain boundary phase which decreased in viscosity with increased temperature and permitted a form of grain boundary sliding to occur.

Subcritical Crack Growth and Long-Term Strength in Rock and High-Strength and Ultra Low-Permeability Concrete

2009 ◽  
Vol 58 (6) ◽  
pp. 525-532 ◽  
Author(s):  
Yoshitaka NARA ◽  
Masafumi TAKADA ◽  
Daisuke MORI ◽  
Hitoshi OWADA ◽  
Tetsuro YONEDA ◽  
...  
Keyword(s):  
Crack Growth ◽  
Subcritical Crack Growth ◽  
High Strength ◽  
Low Permeability ◽  
Term Strength

scholarly journals Fatigue Crack Growth Analysis with Extended Finite Element for 3D Linear Elastic Material

Metals ◽  
2021 ◽  
Vol 11 (3) ◽  
pp. 397
Author(s):  
Yahya Ali Fageehi
Keyword(s):  
Finite Element ◽  
Fatigue Crack ◽  
Fatigue Life ◽  
Crack Propagation ◽  
Crack Growth ◽  
Mixed Mode ◽  
Propagation Path ◽  
Loading Conditions ◽  
Extended Finite Element ◽  
Linear Elastic

This paper presents computational modeling of a crack growth path under mixed-mode loadings in linear elastic materials and investigates the influence of a hole on both fatigue crack propagation and fatigue life when subjected to constant amplitude loading conditions. Though the crack propagation is inevitable, the simulation specified the crack propagation path such that the critical structure domain was not exceeded. ANSYS Mechanical APDL 19.2 was introduced with the aid of a new feature in ANSYS: Smart Crack growth technology. It predicts the propagation direction and subsequent fatigue life for structural components using the extended finite element method (XFEM). The Paris law model was used to evaluate the mixed-mode fatigue life for both a modified four-point bending beam and a cracked plate with three holes under the linear elastic fracture mechanics (LEFM) assumption. Precise estimates of the stress intensity factors (SIFs), the trajectory of crack growth, and the fatigue life by an incremental crack propagation analysis were recorded. The findings of this analysis are confirmed in published works in terms of crack propagation trajectories under mixed-mode loading conditions.

scholarly journals Dynamic characteristics and fractal representations of crack propagation of rock with different fissures under multiple impact loadings

2021 ◽  
Vol 11 (1) ◽  
Author(s):  
Bing Sun ◽  
Shun Liu ◽  
Sheng Zeng ◽  
Shanyong Wang ◽  
Shaoping Wang
Keyword(s):  
Fractal Dimension ◽  
Crack Propagation ◽  
Crack Growth ◽  
Impact Test ◽  
Fractal Theory ◽  
Dynamic Change ◽  
Fractal Dimensions ◽  
Peak Stress ◽  
Dynamic Mechanical Properties ◽  
Gravitational Potential Energy

AbstractTo investigate the influence of the fissure morphology on the dynamic mechanical properties of the rock and the crack propagation, a drop hammer impact test device was used to conduct impact failure tests on sandstones with different fissure numbers and fissure dips, simultaneously recorded the crack growth after each impact. The box fractal dimension is used to quantitatively analyze the dynamic change in the sandstone cracks and a fractal model of crack growth over time is established based on fractal theory. The results demonstrate that under impact test conditions of the same mass and different heights, the energy absorbed by sandstone accounts for about 26.7% of the gravitational potential energy. But at the same height and different mass, the energy absorbed by the sandstone accounts for about 68.6% of the total energy. As the fissure dip increases and the number of fissures increases, the dynamic peak stress and dynamic elastic modulus of the fractured sandstone gradually decrease. The fractal dimensions of crack evolution tend to increase with time as a whole and assume as a parabolic. Except for one fissure, 60° and 90° specimens, with the extension of time, the increase rate of fractal dimension is decreasing correspondingly.

scholarly journals Fracture in Bulk Amorphous Alloys

1998 ◽  
Vol 554 ◽  
Author(s):  
J. A. Horton ◽  
J. L. Wright ◽  
J. H. Schneibel
Keyword(s):  
Crack Propagation ◽  
Crack Growth ◽  
Shear Bands ◽  
Bulk Amorphous Alloy ◽  
In Situ Tem ◽  
X Ray Diffraction ◽  
Transmission Electron ◽  
Crack Tips ◽  
Temperature Fracture

AbstractThe fracture behavior of a Zr-based bulk amorphous alloy, Zr-10 Al-5 Ti-17.9 Cu-14.6Ni (at.%), was examined by transmission electron microscopy (TEM) and x-ray diffraction forany evidence of crystallization preceding crack propagation. No evidence for crystallizationwas found in shear bands in compression specimens or at the fracture surface in tensile specimens.In- situ TEM deformation experiments were performed to more closely examine actualcrack tip regions. During the in-situ deformation experiment, controlled crack growth occurredto the point where the specimen was approximately 20 μm thick at which point uncontrolledcrack growth occurred. No evidence of any crystallization was found at the crack tips or thecrack flanks. Subsequent scanning microscope examination showed that the uncontrolledcrack growth region exhibited ridges and veins that appeared to have resulted from melting. Performing the deformations, both bulk and in-situ TEM, at liquid nitrogen temperatures (LN2) resulted in an increase in the amount of controlled crack growth. The surface roughness of the bulk regions fractured at LN2 temperatures corresponded with the roughness of the crack propagation observed during the in-situ TEM experiment, suggesting that the smooth-appearing room temperature fracture surfaces may also be a result of localized melting.

Molecular Simulation on Interfacial Structure and Gettering Efficiency of Si (110)/(100) Directly Bonded Hybrid Crystal Orientation Substrates

2009 ◽  
Vol 156-158 ◽  
pp. 199-204
Author(s):  
Hiroaki Kariyazaki ◽  
Tatsuhiko Aoki ◽  
Kouji Izunome ◽  
Koji Sueoka
Keyword(s):  
Molecular Simulation ◽  
Wafer Bonding ◽  
Crystal Orientation ◽  
High Performance ◽  
Cmos Technology ◽  
Experimental Results ◽  
Interfacial Structure ◽  
Atomic Configuration ◽  
Promising Technology ◽  
Bonded Interface

Hybrid crystal orientation technology (HOT) substrates comprised of Si (100) and (110) surface orientation paralleling each <110> direction attract considerable attentions as one of the promising technology for high performance bulk CMOS technology. Although HOT substrates are fabricated by wafer bonding of Si (110) and Si (100) surfaces, it is not clear the atomic configuration of interfacial structure. Furthermore, the possibility for the interface to be an effective gettering source of impurity metals was not well studied. In this paper, we studied the interfacial structure and gettering efficiency of the atomic bonded interface by molecular simulations. The results indicate that the simulated atomic configuration and gettering efficiency of the bonded interface agreed well with the experimental results.

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