Effect of Ni in new skutterudite compounds CaxCo4Sb12

2003 ◽  
Vol 793 ◽  
Author(s):  
Matthieu Puyet ◽  
Bertrand Lenoir ◽  
Anne Dauscher ◽  
Hubert Scherrer ◽  
Moukrane Dehmas ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Electrical Resistivity ◽  
Thermal Properties ◽  
Beneficial Effect ◽  
Transport Properties ◽  
Figure Of Merit ◽  
Positive Influence ◽  
Temperature Range ◽  
Dimensionless Figure Of Merit ◽  
Ni Substitution

ABSTRACTThe transport properties of the partially filled CaxCo4-yNiySb12 skutterudite compounds have been investigated in the 300 – 800 K temperature range. We underline the positive influence of the Ni substitution on the electrical resistivity and thermopower while the thermal properties – thermal conductivity – remains almost unaffected. These results suggest again a beneficial effect of Ni atoms on the dimensionless figure of merit in CoSb3 based compounds.

Effects of Nb doping on thermoelectric properties of Zn4Sb3 at high temperatures

2009 ◽  
Vol 24 (2) ◽  
pp. 430-435 ◽  
Author(s):  
D. Li ◽  
H.H. Hng ◽  
J. Ma ◽  
X.Y. Qin
Keyword(s):  
Thermal Conductivity ◽  
Electrical Resistivity ◽  
High Temperatures ◽  
Thermoelectric Properties ◽  
Figure Of Merit ◽  
Thermoelectric Performance ◽  
Temperature Range ◽  
A Value ◽  
Nb Doping ◽  
Thermal Conductivities

The thermoelectric properties of Nb-doped Zn4Sb3 compounds, (Zn1–xNbx)4Sb3 (x = 0, 0.005, and 0.01), were investigated at temperatures ranging from 300 to 685 K. The results showed that by substituting Zn with Nb, the thermal conductivities of all the Nb-doped compounds were lower than that of the pristine β-Zn4Sb3. Among the compounds studied, the lightly substituted (Zn0.995Nb0.005)4Sb3 compound exhibited the best thermoelectric performance due to the improvement in both its electrical resistivity and thermal conductivity. Its figure of merit, ZT, was greater than the undoped Zn4Sb3 compound for the temperature range investigated. In particular, the ZT of (Zn0.995Nb0.005)4Sb3 reached a value of 1.1 at 680 K, which was 69% greater than that of the undoped Zn4Sb3 obtained in this study.

Thermoelectric Properties of Semiconducting Intermetallic Compounds: FeGa3and RuGa3

2003 ◽  
Vol 793 ◽  
Author(s):  
Y. Amagai ◽  
A. Yamamoto ◽  
C. H. Lee ◽  
H. Takazawa ◽  
T. Noguchi ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Electrical Resistivity ◽  
High Temperature ◽  
Seebeck Coefficient ◽  
Transport Properties ◽  
Figure Of Merit ◽  
Room Temperature ◽  
Thermoelectric Figure Of Merit ◽  
Thermoelectric Figure ◽  
High Seebeck Coefficient

ABSTRACTWe report transport properties of polycrystalline TMGa3(TM = Fe and Ru) compounds in the temperature range 313K<T<973K. These compounds exhibit semiconductorlike behavior with relatively high Seebeck coefficient, electrical resistivity, and Hall carrier concentrations at room temperature in the range of 1017- 1018cm−3. Seebeck coefficient measurements reveal that FeGa3isn-type material, while the Seebeck coefficient of RuGa3changes signs rapidly from large positive values to large negative values around 450K. The thermal conductivity of these compounds is estimated to be 3.5Wm−1K−1at room temperature and decreased to 2.5Wm−1K−1for FeGa3and 2.0Wm−1K−1for RuGa3at high temperature. The resulting thermoelectric figure of merit,ZT, at 945K for RuGa3reaches 0.18.

Thermoelectric properties of hole-doped Yb1-xPbxBaCo4O7+δ ceramics

2015 ◽  
Vol 29 (14) ◽  
pp. 1550082 ◽  
Author(s):  
Yubo Chen ◽  
Runxiang Ma ◽  
Kunlun Wang ◽  
Feng Gao ◽  
Xing Hu ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Electrical Resistivity ◽  
Solid State ◽  
Figure Of Merit ◽  
Solid State Reaction Method ◽  
Doping Content ◽  
Reaction Method ◽  
Dimensionless Figure Of Merit ◽  
Ceramic Samples ◽  
Pb Doping

The effects of Pb doping on the thermoelectric (TE) properties of Yb 1-x Pb x BaCo4O7+δ (x = 0, 0.02, 0.04, 0.06, 0.08 and 0.1) ceramic samples prepared by the solid-state reaction method were investigated from 383 K to 973 K. The results showed that with increase of the Pb content, the electrical resistivity decreased remarkably, meanwhile the Seebeck coefficient decreased slightly, resulting in an enhancement of the power factor (PF). The effect of Pb doping on the thermal conductivity was insignificant. According to the PF and the dimensionless figure of merit (ZT) value, the optimum Pb doping content was x = 0.08. The ZT value reached 0.12 at 973 K, being 69.5% higher than that of the sample without Pb doping.

Thermoelectric Properties of La-doped BaSi2 and (Ba,Sr)Si2 Solid Solutions

2007 ◽  
Vol 1044 ◽  
Author(s):  
Kohsuke Hashimoto ◽  
Ken Kurosaki ◽  
Hiroaki Muta ◽  
Shinsuke Yamanaka
Keyword(s):  
Thermal Conductivity ◽  
Solid Solution ◽  
Electrical Resistivity ◽  
Thermoelectric Properties ◽  
Figure Of Merit ◽  
Room Temperature ◽  
Dimensionless Figure Of Merit ◽  
Plasma Sintering ◽  
Spark Plasma ◽  
La Doped

AbstractWe studied the thermoelectric properties of BaSi2 and SrSi2. The polycrystalline samples were prepared by spark plasma sintering (SPS). The electrical resistivity (ρ), Seebeck coefficient (S), and thermal conductivity (κ) were measured above room temperature. The maximum values of the dimensionless figure of merit (ZT) were 0.01 at 954 K for BaSi2 and 0.09 at 417 K for SrSi2. We tried to enhance the ZT values of BaSi2 and SrSi2 by prepareing and characterizing La-doped BaSi2 and (Ba,Sr)Si2 solid solution.

Thermoelectric properties of the Al-TM-Si (TM = Mn, Re) 1/1-cubic approximant

2003 ◽  
Vol 805 ◽  
Author(s):  
Tsunehiro Takeuchi ◽  
Toshio Otagiri ◽  
Hiroki Sakagami ◽  
Uichiro Mizutani
Keyword(s):  
Thermal Conductivity ◽  
Electrical Resistivity ◽  
Thermoelectric Power ◽  
Thermoelectric Properties ◽  
Figure Of Merit ◽  
Room Temperature ◽  
Low Thermal Conductivity ◽  
Dimensionless Figure Of Merit

ABSTRACTThe electrical resistivity, thermoelectric power, and thermal conductivity were investigated for the Al71.6-xMn 17.4Six and Al71.6-xRe 17.4Six (7 ≤ x ≤ 12) 1/1-cubic approximants. A large thermoelectric power ranging from -40 to 90 μV/K and a low thermal conductivity less than 3 W/K·cm were observed at room temperatures. The electrical resistivity at room temperature for these approximants was kept below 4,000 μΩcm, that is much smaller than that in the corresponding quasicrystals. As a result of the large thermoelectric power, the low thermal conductivity, and the low electrical resistivity, large dimensionless figure of merit ZT = 0.10 (n-type) and 0.07 (p-type) were achieved for the Al71.6Re17.4Si11 and Al71.6Mn17.4Si11 at room temperature, respectively.

The thermoelectric properties of CoSb3 compound doped with Te and Sn synthesized at different pressure

2017 ◽  
Vol 31 (28) ◽  
pp. 1750261 ◽  
Author(s):  
Yiping Jiang ◽  
Xiaopeng Jia ◽  
Hongan Ma
Keyword(s):  
Thermal Conductivity ◽  
High Pressure ◽  
Electrical Resistivity ◽  
High Temperature ◽  
Seebeck Coefficient ◽  
Thermoelectric Properties ◽  
Figure Of Merit ◽  
Raw Materials ◽  
Absolute Value ◽  
Dimensionless Figure Of Merit

The skutterudite CoSb[Formula: see text]Te[Formula: see text]Sn[Formula: see text] compound was synthesized successfully by high pressure and high temperature (HPHT) method using Co, Sb, Te and Sn powder as raw materials. The effects of pressure on its structure and the thermoelectric properties are investigated systematically from 300 K to 800 K. The electrical resistivity and the absolute value of the Seebeck coefficient for the sample increases with rising synthetic pressure. The thermal conductivity of the sample decreases with synthetic pressure and temperature rising in the range of 300–800 K. In this study, the maximum dimensionless figure of merit (ZT) value of 1.17 has been achieved at 793 K, 3 GPa for this thermoelectric material.

FEM Analysis on Thermoelectric Properties of Metal/TiO2–x Composites with Random Distribution of Metal Powder

2013 ◽  
Vol 750 ◽  
pp. 130-133
Author(s):  
Katsuhiro Sagara ◽  
Yun Lu ◽  
Dao Cheng Luan
Keyword(s):  
Thermal Conductivity ◽  
Electrical Resistivity ◽  
Seebeck Coefficient ◽  
Thermoelectric Properties ◽  
Power Factor ◽  
Figure Of Merit ◽  
Random Distribution ◽  
The Other ◽  
Dimensionless Figure Of Merit ◽  
Wide Range

Analysis model of finite element method with a random distribution for thermoelectric composites was built. Thermoelectric properties including electrical resistivity, Seebeck coefficient and thermal conductivity of M/TiO2–x (M = Cu, Ni, 304 stainless steel (304SS)) thermoelectric composites were investigated by the proposed model. Cu/TiO2–x composite showed a large decrease in electrical resistivity while 304SS/TiO2–x composite thermal conductivity was slightly increased. Calculated dimensionless figure-of-merit, ZT of Ni/TiO2–x composite was higher than those of TiO2–x and the other composites in a wide range of metal volume fractions because Ni has large absolute values of Seebeck coefficient, power factor and dimensionless figure-of-merit compared to the other two metals. It was found that power factor and dimensionless figure-of-merit of thermoelectric composites depended on the balance among electrical resistivity, thermal conductivity and Seebeck coefficient. The results revealed that it is important for M/TiO2–x composites to choose suitable addition metal with high power factor and dimensionless figure-of-merit.

Effect of High Temperature Annealing on the Thermoelectric Properties of GaP Doped SiGe

1987 ◽  
Vol 97 ◽  
Author(s):  
Jan W. Vandersande ◽  
Charles Wood ◽  
Susan Draper
Keyword(s):  
Thermal Conductivity ◽  
Electrical Resistivity ◽  
Power Factor ◽  
Silicon Germanium ◽  
Figure Of Merit ◽  
Annealing Temperature ◽  
High Temperature Annealing ◽  
Rich Phase ◽  
Temperature Range ◽  
Thermoelectric Energy

ABSTRACTSilicon-germanium alloys doped with GaP are used for thermoelectric energy conversion in the temperature range 300°C - 1000°C. The conversion efficiency depends on Z - S2/ρΛ, a material's parameter (the figure of merit), where S is the Seebeck coefficient, ρ is the electrical resistivity and Λ is the thermal conductivity. The annealing of several samples in the temperature range of 1100°C - 1300°C resulted in the power factor P (=S2/ρ) increasing with increased annealing temperature. This increase in P was due to a decrease in ρ which was not completely offset by a drop in S2 suggesting that other changes besides that in the carrier concentration took place. SEM and EDX analysis of the samples indicated the formation of a Ca- P-Ge rich phase as a result of the annealing. It is speculated that this phase is associated with the improved properties. Several reasons which could account for the improvement in the Power factor of annealed GaP doped SiGe are given.

Reduced Thermal Conductivity in ZrNiSn-Based Heusler Alloys

2015 ◽  
Vol 737 ◽  
pp. 110-113
Author(s):  
Hong Yue Wei ◽  
De Xuan Huo ◽  
Wei Feng Yang ◽  
Jin Wei Li ◽  
Yin Jing Zhang
Keyword(s):  
Thermal Conductivity ◽  
Electrical Resistivity ◽  
Figure Of Merit ◽  
Heusler Alloys ◽  
Drastic Reduction ◽  
Arc Melting ◽  
Dimensionless Figure Of Merit ◽  
Plasma Sintering ◽  
Spark Plasma ◽  
Dual Site

Dual-site doped half-Heusler ZrNiSn alloys were prepared by arc melting. In order to diminish thermal conductivity of the alloys, as-casted ingots were sintered again by spark plasma sintering (SPS) technique after pulverizing and milling for several different periods of time. The electrical resistivity, thermoelectric powers and thermal conductivity of the sintered samples were measured from 4 to 350 K. A drastic reduction of thermal conductivity was obtained. The thermal conductivity decreased from about 17 to 1.5 W/K m and from 8.8 to 6.3 W/K m at 30 and 350 K, respectively. The dimensionless figure of merit of the half-Heusler alloys increased about 10%

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