Effects of Process Parameters on the Adhesion of Copper Film on Polyethylene Tetrephthalate(Pet) Substrate Prepared by ECRMOCVD Coupled with a Periodic DC Bias
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Dc Bias
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ABSTRACTCharacteristics of Cu/C:H films on the PET substrate prepared by ECR-MOCVD coupled with a DC bias under Cu(hfac)2-Ar-H2 was investigated with special attention to process parameters. Our results showed that the Cu/C:H film has strongly adhere with the polymer substrate by chemical bonding and exhibited wide range of electrical conductivity that could be controlled by process parameters. The increase in H2/Ar ratio, microwave power and negative DC bias voltage brought on the higher pulling strength between Cu/C:H films and PET substrate. The effects of surface pretreatments of polymer substrate on pulling strength were insignificant in the range of our experimental range.
2019 ◽
Vol 45
(9)
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pp. 11989-12000
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