Effect of Corrosion Inhibitor (BTA) in Citric Acid based Slurry on Cu CMP

2005 ◽  
Vol 867 ◽  
Author(s):  
In-Kwon Kim ◽  
Young-Jae Kang ◽  
Yi-Koan Hong ◽  
Jin-Goo Park
Keyword(s):  
Etch Rate ◽  
Removal Rate ◽  
Passivation Layer ◽  
Chemical Dissolution ◽  
H2o2 Concentration ◽  
Removal Rates ◽  
Abrasive Particles ◽  
Mechanical Abrasion ◽  
Abrasion Rate ◽  
Cu Cmp

AbstractIn this study, the effect of BTA on polishing behavior was investigated as functions of H2O2, slurry pH and abrasive particles. The addition of BTA effectively prevented Cu from etching by forming the passivation layer of Cu-BTA regardless of pH and H2O2 concentration in slurry. A thinner passivation layer was grown on Cu in BTA added slurry solutions with a higher contact angle of 60°. The dynamic etch rate, the removal rate with abrasive free slurry, also decreased when BTA was added in slurry at pH 2, 4 and 6. The removal rate of Cu was strongly dependent on types of abrasive particles in slurry. The larger hardness of slurry abrasive particles, the higher removal rates of Cu. The reduction of removal rates in BTA added slurry was determined by the competition between chemical dissolution rate and mechanical abrasion rate.

Modified Abrasives based on fumed SiO2 and Al2O3 for the Cu CMP Process

2004 ◽  
Vol 816 ◽  
Author(s):  
D. Zeidler ◽  
J.W. Bartha ◽  
W.L ortz ◽  
R. Brandes
Keyword(s):  
Surface Quality ◽  
High Selectivity ◽  
Removal Rate ◽  
New Method ◽  
Copper Removal ◽  
Complexing Agent ◽  
Abrasive Particles ◽  
Cu Cmp ◽  
Low Rate ◽  
Fumed Sio2

AbstractNew abrasive particles based on SiO2 and Al2O3 were produced with different coating and doping. Seven specifically designed particles were dispersed to prepare slurries for Cu CMP. Glycin was used as complexing agent and hydrogenperoxid as oxidizer. The experimentally obtained removal rate, selectivity, surface quality and planarisation ability, demonstrate a significant impact of the different abrasives tested. SiO2 particles covered with Al2O3 increased the removal rate for Cu. In comparison to this behavior, a low rate for TaN proved a high selectivity copper removal required by the Cu CMP process. A new method for the planarisation length monitoring (step polish response) shows also significant differences in planarisation length (PL) by the polish of copper with slurries composed of these new particles.

Interaction between abrasive particles and film surfaces in low down force Cu CMP

2004 ◽  
Vol 816 ◽  
Author(s):  
Yuchun Wang ◽  
Isaac Zomora ◽  
Joe Hawkins ◽  
Renjie Zhou ◽  
Fred Sun ◽  
...  
Keyword(s):  
Surface Finish ◽  
Removal Rate ◽  
Film Formation ◽  
Abrasive Particles ◽  
High Removal Rate ◽  
Performance Results ◽  
Cu Cmp ◽  
Copper Passivation

A robust copper slurry should have high removal rate, efficient planarization, optimal over polishing window and fast clearing without corrosion. These requirements were addressed in the choice of abrasive particles, film formation for copper passivation, selectivity of copper to barrier, and interactions between particles and film surfaces. The performance results of low dishing erosion and surface finish are discussed with the proposed mechanism.

The Adsorption Behaviors of Citric Acid on Abrasive Particles in Cu CMP Slurry

2005 ◽  
Vol 867 ◽  
Author(s):  
Young-Jae Kang ◽  
Yi-Koan Hong ◽  
Jae-Hoon Song ◽  
In-Kwon Kim ◽  
Jin-Goo Park
Keyword(s):  
Citric Acid ◽  
Friction Force ◽  
Adhesion Force ◽  
Removal Rate ◽  
Friction Forces ◽  
Abrasive Particles ◽  
Ph Values ◽  
Adsorption Behaviors ◽  
Cu Cmp ◽  
Citrate Ions

AbstractThe interaction between Cu surface and abrasive particles in slurry solution was characterized. The adsorption behavior of the citrate ions was dependent on the pH of the slurry and the concentration of the citric acid. The adsorption of citrate ions generated a highly negative charge on the alumina surface and shifted isoelectric point (IEP) to lower pH values. The Cu removal rate of alumina slurry was higher than that of colloidal silica based slurry in the investigated pH ranges. Although lower friction forces of Cu were observed in alumina based slurry of pH 4, 6 and 8, a higher friction force was observed at pH 2. This high friction force was attributed to the positive zeta potential and greater adhesion force of particle. It indicates that the magnitudes of particle adhesions on Cu surfaces in slurries can be directly related to the frictional behavior during CMP process.

Copper CMP for Dual Damascene Technology: Some Considerations on the Mechanism of Cu Removal

2001 ◽  
Vol 671 ◽  
Author(s):  
David Wei ◽  
Yehiel Gotkis ◽  
Hugh Li ◽  
Stephen Jew ◽  
Joseph Li ◽  
...  
Keyword(s):  
Oxygen Atom ◽  
Removal Rate ◽  
Wafer Surface ◽  
H2o2 Concentration ◽  
Passivation Film ◽  
Mechanical Removal ◽  
Slurry System ◽  
High Removal Rate ◽  
Cu Cmp ◽  
Passivating Oxide

ABSTRACTIt was found in a Cu-CMP process using EP-C 5001 slurry and IC 1000 pad that Cu removal rate, being extremely low without H2O2 in the slurry, increases up to a maximum with the addition of H2O2, and then decreases again. Analysis of polarization curves and Eh-pH diagrams shows that without H2O2 Cu has the lowest electric potential, as a result, the highest thermodynamic stability in the Cu/slurry system. Addition of H2O2 shifts the potential up and induces the formation of Cu2O, resulting in a high removal rate. At high H2O2 concentration, a CuO passivation film is formed. In this case, only mechanical removal of the passivating oxide film allows the process to proceed. It is speculated that the moving pad surface adheres the oxidized species via the formation of hydrogen bonds with oxygen atoms of copper oxide molecules, thus detaching them from the wafer surface. Each oxygen atom is capable of pulling out two Cu atoms if Cu2O is formed on the surface and only one Cu atom if CuO is formed. This would explain why the removal rate is high at low H2O2 concentration and low at high H2O2 concentration.

Analysis of the Tribological Mechanisms Arising in the Chemical Mechanical Polishing of Copper-Film Wafers

2004 ◽  
Vol 126 (1) ◽  
pp. 185-199 ◽  
Author(s):  
Jen Fin Lin ◽  
Junne Dar Chern ◽  
Yang Hui Chang ◽  
Ping Lin Kuo ◽  
Ming Shih Tsai
Keyword(s):  
Removal Rate ◽  
Chemical Mechanical Planarization ◽  
Abrasive Particle ◽  
Copper Film ◽  
Operating Conditions ◽  
Passivation Layer ◽  
Real Contact Area ◽  
Removal Rates ◽  
Elastic And Plastic Deformations ◽  
Composite Hardness

In the chemical mechanical planarization of a copper-film silicon wafer, the average Reynolds equation with flow factors has also been developed for a cylindrical coordinate system to study the mixed lubrication. The pad’s elastic deformations are considered in the evaluation of the contact pressure arising at the interface of a pad’s asperity and the wafer. The normal force acting on the wafer by an abrasive particle is thus obtained in order to calculate the elastic and plastic deformations of the copper film with a thin passivation layer. A theoretical abrasive wear model is developed to evaluate the removal rate of the copper film. The increase in the real contact area of an abrasive, due to the frictional force produced at the interface by adhesive wear, is also taken into account. A nano tester was applied to measure the composite hardness and Young’s modulus of the copper-film wafer with a passivation layer. These two material properties are of importance in the calculation of wafer’s theoretical removal rate. Experimental results for the removal rates of the copper film are exhibited to compare with that predicted by the present theoretical model. Fairly good agreement exists in the trends of the removal rates varying in the radial direction and the mean removal rates evaluated at different operating conditions.

Analysis of organic removal rates in the aerated submerged fixed film process

1998 ◽  
Vol 38 (8-9) ◽  
pp. 213-221 ◽  
Author(s):  
Mohamed F. Hamoda ◽  
Ibrahim A. Al-Ghusain
Keyword(s):  
Pilot Plant ◽  
Removal Rate ◽  
Domestic Wastewater ◽  
Removal Rates ◽  
Hydraulic Loading ◽  
Organic Removal ◽  
Wide Range ◽  
Fixed Film ◽  
Cod Removal Rate ◽  
And Performance

Performance data from a pilot-plant employing the four-stage aerated submerged fixed film (ASFF) process treating domestic wastewater were analyzed to examine the organic removal rates. The process has shown high BOD removal efficiencies (> 90%) over a wide range of hydraulic loading rates (0.04 to 0.68 m3/m2·d). It could also cope with high hydraulic and organic loadings with minimal loss in efficiency due to the large amount of immobilized biomass attained. The organic (BOD and COD) removal rate was influenced by the hydraulic loadings applied, but organic removal rates of up to 104 kg BOD/ m2·d were obtained at a hydraulic loading rate of 0.68 m3/m2·d. A Semi-empirical model for the bio-oxidation of organics in the ASFF process has been formulated and rate constants were calculated based on statistical analysis of pilot-plant data. The relationships obtained are very useful for analyzing the design and performance of the ASFF process and a variety of attached growth processes.

The comparison of trichloroethylene removal rates by methane- and aromatic-utilizing microorganisms

1998 ◽  
Vol 38 (7) ◽  
pp. 19-24 ◽  
Author(s):  
C.-J. Lu ◽  
C. M. Lee ◽  
M.-S. Chung
Keyword(s):  
Cell Concentration ◽  
Removal Rate ◽  
Carbon Sources ◽  
Batch Reactors ◽  
Initial Cell Concentration ◽  
Removal Rates ◽  
Initial Cell ◽  
Toluene Concentration ◽  
Cell Source ◽  
Removal Efficiencies

The comparison of TCE cometabolic removal by methane, toluene, and phenol utilizers was conducted with a series of batch reactors. Methane, toluene, or phenol enriched microorganisms were used as cell source. The initial cell concentration was about 107 cfu/mL. Methane, toluene, and phenol could be readily biodegraded resulting in the cometabolic removal of TCE. Among the three primary carbon sources studied, the presence of phenol provided the best cometabolic removal of TCE. When the concentration of carbon source was 3 mg-C/L, the initial TCE removal rates initiated by methane, toluene, and phenol utilizers were 1.5, 30, and 100 μg/L-hr, respectively. During the incubation period of 80 hours, TCE removal efficiencies were 26% and 96% with the presence of methane and toluene, respectively. However, it was 100% within 20 hours with the presence of phenol. For phenol utilizers, the initial TCE removal rates were about the same, when the phenol concentrations were 1.35, 2.7, and 4.5 mg/L. However, TCE removal was not proportional to the concentrations of phenol. TCE removal was hindered when the phenol concentration was higher than 4.5 mg/L because of the rapid depletion of dissolved oxygen. The presence of toluene also initiated cometabolic removal of TCE. The presence of toluene at 3 and 5 mg/L resulted in similar TCE removal. The initial TCE removal rate was about 95 μg/L-hr at toluene concentrations of 3 and 5 mg/L compared to 20 μg/L-hr at toluene concentration of 1 mg/L.

Relations between carbon removal rates, biofilm size and density of a novel anaerobic reactor: the inverse turbulent bed

2000 ◽  
Vol 41 (4-5) ◽  
pp. 253-260 ◽  
Author(s):  
P. Buffière ◽  
R. Moletta
Keyword(s):  
Removal Rate ◽  
Removal Rates ◽  
Carbon Removal ◽  
Biofilm Growth ◽  
Loading Rates ◽  
Biomass Activity ◽  
High Turbulence ◽  
The One ◽  
High Level ◽  
Very High

An anaerobic inverse turbulent bed, in which the biogas only ensures fluidisation of floating carrier particles, was investigated for carbon removal kinetics and for biofilm growth and detachment. The range of operation of the reactor was kept within 5 and 30 kgCOD· m−3· d−1, with Hydraulic Retention Times between 0.28 and 1 day. The carbon removal efficiency remained between 70 and 85%. Biofilm size were rather low (between 5 and 30 μm) while biofilm density reached very high values (over 80 kgVS· m−3). The biofilm size and density varied with increasing carbon removal rates with opposite trends; as biofilm size increases, its density decreases. On the one hand, biomass activity within the reactor was kept at a high level, (between 0.23 and 0.75 kgTOC· kgVS· d−1, i.e. between 0.6 and 1.85 kgCOD·kgVS · d−1).This result indicates that high turbulence and shear may favour growth of thin, dense and active biofilms. It is thus an interesting tool for biomass control. On the other hand, volatile solid detachment increases quasi linearly with carbon removal rate and the total amount of solid in the reactor levels off at high OLR. This means that detachment could be a limit of the process at higher organic loading rates.

scholarly journals Enhanced Wastewater Treatment by Immobilized Enzymes

2021 ◽  
Author(s):  
Jakub Zdarta ◽  
Katarzyna Jankowska ◽  
Karolina Bachosz ◽  
Oliwia Degórska ◽  
Karolina Kaźmierczak ◽  
...  
Keyword(s):  
Wastewater Treatment ◽  
Process Optimization ◽  
Organic Pollutants ◽  
Large Scale ◽  
Removal Rate ◽  
Immobilized Enzymes ◽  
Future Research ◽  
Process Conditions ◽  
Removal Rates ◽  
Catalytic Cycles

Abstract Purpose of Review In the presented review, we have summarized recent achievements on the use of immobilized oxidoreductases for biodegradation of hazardous organic pollutants including mainly dyes, pharmaceuticals, phenols, and bisphenols. In order to facilitate process optimization and achievement of high removal rates, effect of various process conditions on biodegradation has been highlighted and discussed. Recent Findings Current reports clearly show that immobilized oxidoreductases are capable of efficient conversion of organic pollutants, usually reaching over 90% of removal rate. Further, immobilized enzymes showed great recyclability potential, allowing their reuse in numerous of catalytic cycles. Summary Collected data clearly indicates immobilized oxidoreductases as an efficient biocatalytic tools for removal of hazardous phenolic compounds, making them a promising option for future water purification. Data shows, however, that both immobilization and biodegradation conditions affect conversion efficiency; therefore, process optimization is required to achieve high removal rates. Nevertheless, we have demonstrated future trends and highlighted several issues that have to be solved in the near-future research, to facilitate large-scale application of the immobilized oxidoreductases in wastewater treatment.

Lubricant Removal, Degradation, and Recovery on Particulate Magnetic Recording Media

1992 ◽  
Vol 114 (1) ◽  
pp. 61-67 ◽  
Author(s):  
V. J. Novotny ◽  
T. E. Karis ◽  
N. W. Johnson
Keyword(s):  
Bulk Viscosity ◽  
Magnetic Recording ◽  
Photoelectron Spectroscopy ◽  
Removal Rate ◽  
Lateral Diffusion ◽  
Recording Media ◽  
Magnetic Recording Media ◽  
Removal Rates ◽  
Linear Chains ◽  
Mechanical Durability

Lubrication of particulate magnetic recording media improves their mechanical durability in sliding and flying by several orders of magnitude compared with unlubricated media. Lubricant removal, degradation, and recovery were studied using microslit scanning Fourier transform infrared spectroscopy and microspot scanning X-ray photoelectron spectroscopy. These techniques measure the total and surface lubricant amounts in the porous film, respectively. Lubricant dynamics were compared for two physisorbed polyperfluoroalkylether lubricants of similar molecular weight but different molecular structure—Y with a CF3 side group and Z with linear chains. The bulk viscosity of Y was about ten times higher than the viscosity of Z. In sliding, the lubricant removal rate of Y was significantly higher than that of Z while in flying the removal rates were reversed. Removal rates in sliding were orders of magnitude higher than those in flying. Effective lateral diffusion coefficients estimated from the rate of lubricant reflow back to the depleted tracks were close to inversely proportional to the bulk viscosity. During sliding and flying both lubricants degraded as evidenced by chemically altered lubricant detected on the surfaces after dissolution of undegraded lubricant.

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