The Adsorption Behaviors of Citric Acid on Abrasive Particles in Cu CMP Slurry

2005 ◽  
Vol 867 ◽  
Author(s):  
Young-Jae Kang ◽  
Yi-Koan Hong ◽  
Jae-Hoon Song ◽  
In-Kwon Kim ◽  
Jin-Goo Park
Keyword(s):  
Citric Acid ◽  
Friction Force ◽  
Adhesion Force ◽  
Removal Rate ◽  
Friction Forces ◽  
Abrasive Particles ◽  
Ph Values ◽  
Adsorption Behaviors ◽  
Cu Cmp ◽  
Citrate Ions

AbstractThe interaction between Cu surface and abrasive particles in slurry solution was characterized. The adsorption behavior of the citrate ions was dependent on the pH of the slurry and the concentration of the citric acid. The adsorption of citrate ions generated a highly negative charge on the alumina surface and shifted isoelectric point (IEP) to lower pH values. The Cu removal rate of alumina slurry was higher than that of colloidal silica based slurry in the investigated pH ranges. Although lower friction forces of Cu were observed in alumina based slurry of pH 4, 6 and 8, a higher friction force was observed at pH 2. This high friction force was attributed to the positive zeta potential and greater adhesion force of particle. It indicates that the magnitudes of particle adhesions on Cu surfaces in slurries can be directly related to the frictional behavior during CMP process.

Frictional behavior and particle adhesion of abrasive particles during Cu CMP

2005 ◽  
Vol 867 ◽  
Author(s):  
Yi-Koan Hong ◽  
Ja-Hyung Han ◽  
Jae-Hoon Song ◽  
Jin-Goo Park
Keyword(s):  
Citric Acid ◽  
Adhesion Force ◽  
Particle Adhesion ◽  
Friction Behavior ◽  
Abrasive Particles ◽  
Frictional Behavior ◽  
Cu Cmp ◽  
Particle Adhesion Force ◽  
Wafer Surfaces ◽  
Citrate Ions

AbstractThe friction behavior and adhesion of abrasive particles were experimentally investigated during Cu CMP process. The highest particle adhesion force was measured in alumina slurry without citric acid. However, the alumina slurry with addition of citric acid had the lowest particle adhesion due to the adsorption of citrate ions on the alumina surfaces. While citrate ions could be easily adsorbed on alumina particles, silica particle showed the least effect on adsorption in citric acid solutions. The magnitude of adsorptions of citrate ions on the particle surfaces had significant effect on frictional behavior as well as adhesion force. Higher particle adhesion force resulted in higher friction, particle contamination and scratches in CMP process. It indicates that the magnitudes of particle adhesions on wafer surfaces in slurries can be directly related to the frictional behavior during CMP process.

Effect of Corrosion Inhibitor (BTA) in Citric Acid based Slurry on Cu CMP

2005 ◽  
Vol 867 ◽  
Author(s):  
In-Kwon Kim ◽  
Young-Jae Kang ◽  
Yi-Koan Hong ◽  
Jin-Goo Park
Keyword(s):  
Etch Rate ◽  
Removal Rate ◽  
Passivation Layer ◽  
Chemical Dissolution ◽  
H2o2 Concentration ◽  
Removal Rates ◽  
Abrasive Particles ◽  
Mechanical Abrasion ◽  
Abrasion Rate ◽  
Cu Cmp

AbstractIn this study, the effect of BTA on polishing behavior was investigated as functions of H2O2, slurry pH and abrasive particles. The addition of BTA effectively prevented Cu from etching by forming the passivation layer of Cu-BTA regardless of pH and H2O2 concentration in slurry. A thinner passivation layer was grown on Cu in BTA added slurry solutions with a higher contact angle of 60°. The dynamic etch rate, the removal rate with abrasive free slurry, also decreased when BTA was added in slurry at pH 2, 4 and 6. The removal rate of Cu was strongly dependent on types of abrasive particles in slurry. The larger hardness of slurry abrasive particles, the higher removal rates of Cu. The reduction of removal rates in BTA added slurry was determined by the competition between chemical dissolution rate and mechanical abrasion rate.

Modified Abrasives based on fumed SiO2 and Al2O3 for the Cu CMP Process

2004 ◽  
Vol 816 ◽  
Author(s):  
D. Zeidler ◽  
J.W. Bartha ◽  
W.L ortz ◽  
R. Brandes
Keyword(s):  
Surface Quality ◽  
High Selectivity ◽  
Removal Rate ◽  
New Method ◽  
Copper Removal ◽  
Complexing Agent ◽  
Abrasive Particles ◽  
Cu Cmp ◽  
Low Rate ◽  
Fumed Sio2

AbstractNew abrasive particles based on SiO2 and Al2O3 were produced with different coating and doping. Seven specifically designed particles were dispersed to prepare slurries for Cu CMP. Glycin was used as complexing agent and hydrogenperoxid as oxidizer. The experimentally obtained removal rate, selectivity, surface quality and planarisation ability, demonstrate a significant impact of the different abrasives tested. SiO2 particles covered with Al2O3 increased the removal rate for Cu. In comparison to this behavior, a low rate for TaN proved a high selectivity copper removal required by the Cu CMP process. A new method for the planarisation length monitoring (step polish response) shows also significant differences in planarisation length (PL) by the polish of copper with slurries composed of these new particles.

Interaction between abrasive particles and film surfaces in low down force Cu CMP

2004 ◽  
Vol 816 ◽  
Author(s):  
Yuchun Wang ◽  
Isaac Zomora ◽  
Joe Hawkins ◽  
Renjie Zhou ◽  
Fred Sun ◽  
...  
Keyword(s):  
Surface Finish ◽  
Removal Rate ◽  
Film Formation ◽  
Abrasive Particles ◽  
High Removal Rate ◽  
Performance Results ◽  
Cu Cmp ◽  
Copper Passivation

A robust copper slurry should have high removal rate, efficient planarization, optimal over polishing window and fast clearing without corrosion. These requirements were addressed in the choice of abrasive particles, film formation for copper passivation, selectivity of copper to barrier, and interactions between particles and film surfaces. The performance results of low dishing erosion and surface finish are discussed with the proposed mechanism.

The Friction Forces Between Si Tip and Multilayer Graphene

2012 ◽  
Author(s):  
Yan Zhang ◽  
Yingying Wang ◽  
Yunfei Chen ◽  
Yujuan Wang
Keyword(s):  
Friction Force ◽  
Graphene Layer ◽  
Adhesion Force ◽  
Normal Load ◽  
Multilayer Graphene ◽  
Friction Forces ◽  
Layer Number ◽  
Si Substrates ◽  
Atomic Force ◽  
Natural Oxide

Mechanical peeling method is used to prepare multilayer graphene on silicon wafer with natural oxide, and the layer number of graphene is determined through atomic force microsopy (AFM) topography image and optical image. The friction force between Silicon tip and multilayer graphene and SiO2/Si substrates is measured with AFM. It is found that the friction force is reduced with the increase of the graphene layer number and approaches the value between the Si tip and graphite. Through comparing the tip sliding on graphene with different layers, the deformation of graphene is believed to be the main reason causing the decrease of the friction force with the layer number. When the normal load is much larger than the adhesion force, friction force increases with normal load linearly. However, while normal load closes to the adhesion force, friction force is independent of the normal load.

scholarly journals When and how self-cleaning of superhydrophobic surfaces works

2020 ◽  
Vol 6 (3) ◽  
pp. eaaw9727 ◽  
Author(s):  
Florian Geyer ◽  
Maria D’Acunzi ◽  
Azadeh Sharifi-Aghili ◽  
Alexander Saal ◽  
Nan Gao ◽  
...  
Keyword(s):  
Friction Force ◽  
Rational Design ◽  
Adhesion Force ◽  
Superhydrophobic Surfaces ◽  
Contaminant Removal ◽  
Time Resolved ◽  
Friction Forces ◽  
Particle Level ◽  
Self Cleaning ◽  
Micrometer Scale

Despite the enormous interest in superhydrophobicity for self-cleaning, a clear picture of contaminant removal is missing, in particular, on a single-particle level. Here, we monitor the removal of individual contaminant particles on the micrometer scale by confocal microscopy. We correlate this space- and time-resolved information with measurements of the friction force. The balance of capillary and adhesion force between the drop and the contamination on the substrate determines the friction force of drops during self-cleaning. These friction forces are in the range of micro-Newtons. We show that hydrophilic and hydrophobic particles hardly influence superhydrophobicity provided that the particle size exceeds the pore size or the thickness of the contamination falls below the height of the protrusions. These detailed insights into self-cleaning allow the rational design of superhydrophobic surfaces that resist contamination as demonstrated by outdoor environmental (>200 days) and industrial standardized contamination experiments.

scholarly journals Influence of Nanoscale Textured Surfaces and Subsurface Defects on Friction Behaviors by Molecular Dynamics Simulation

Nanomaterials ◽  
2019 ◽  
Vol 9 (11) ◽  
pp. 1617 ◽  
Author(s):  
Ruiting Tong ◽  
Zefen Quan ◽  
Yangdong Zhao ◽  
Bin Han ◽  
Geng Liu
Keyword(s):  
Molecular Dynamics ◽  
Molecular Dynamics Simulation ◽  
Friction Force ◽  
Copper Substrate ◽  
Dynamics Simulation ◽  
Textured Surfaces ◽  
Friction Forces ◽  
Subsurface Structures ◽  
Texture Orientation ◽  
Subsurface Defects

In nanomaterials, the surface or the subsurface structures influence the friction behaviors greatly. In this work, nanoscale friction behaviors between a rigid cylinder tip and a single crystal copper substrate are studied by molecular dynamics simulation. Nanoscale textured surfaces are modeled on the surface of the substrate to represent the surface structures, and the spacings between textures are seen as defects on the surface. Nano-defects are prepared at the subsurface of the substrate. The effects of depth, orientation, width and shape of textured surfaces on the average friction forces are investigated, and the influence of subsurface defects in the substrate is also studied. Compared with the smooth surface, textured surfaces can improve friction behaviors effectively. The textured surfaces with a greater depth or smaller width lead to lower friction forces. The surface with 45° texture orientation produces the lowest average friction force among all the orientations. The influence of the shape is slight, and the v-shape shows a lower average friction force. Besides, the subsurface defects in the substrate make the sliding process unstable and the influence of subsurface defects on friction forces is sensitive to their positions.

Development of a New Plate Polishing Technique with an Instantaneous Tiny-Grinding Wheel Cluster Based on Magnetorheological Effect

2008 ◽  
Vol 53-54 ◽  
pp. 155-160 ◽  
Author(s):  
Qiu Sheng Yan ◽  
Ai Jun Tang ◽  
Jia Bin Lu ◽  
Wei Qiang Gao
Keyword(s):  
Surface Roughness ◽  
Material Removal Rate ◽  
Material Removal ◽  
Removal Rate ◽  
Grinding Wheel ◽  
Abrasive Particles ◽  
Magnetorheological Effect ◽  
Material Removal Model ◽  
Mr Effect ◽  
Removal Model

A new plate polishing technique with an instantaneous tiny-grinding wheel cluster based on the magnetorheological (MR) effect is presented in this paper, and some experiments were conducted to prove its effectiveness and applicability. Under certain experimental condition, the material removal rate was improved by a factor of 20.84% as compared with the conventional polishing methods with dissociative abrasive particles, while the surface roughness of the workpiece was not obviously increased. Furthermore, the composite of the MR fluid was optimized to obtain the best polishing performance. On the basis of the experimental results, the material removal model of the new plate polishing technique was presented.

Synthesis of Palladium Icosahedra with Twinned Structure by Blocking Oxidative Etching with Citric Acid or Citrate Ions

2007 ◽  
Vol 119 (5) ◽  
pp. 804-808 ◽  
Author(s):  
Yujie Xiong ◽  
Joseph M. McLellan ◽  
Yadong Yin ◽  
Younan Xia
Keyword(s):  
Citric Acid ◽  
Oxidative Etching ◽  
Citrate Ions

Study of Friction Coefficient and Friction Force on Magnetic Abrasive Finishing

2011 ◽  
Vol 675-677 ◽  
pp. 663-666
Author(s):  
Yan Chen ◽  
Akira Shimamoto ◽  
X. Gao ◽  
M.M. Zhang
Keyword(s):  
Friction Coefficient ◽  
Friction Force ◽  
Magnetic Particles ◽  
Good Effect ◽  
Magnetic Abrasive Finishing ◽  
Abrasive Particles ◽  
Abrasive Finishing ◽  
Alumina Particles ◽  
The Cost ◽  
Grinding Efficiency

In order to enhance grinding efficiency of the magnetic abrasive finishing (MAF) method, we usually use the sinter method or the cementation method to mix the magnetic particles and abrasive particles together. However, the cost is high, and the variety is incomplete. Therefore, with the ferromagnetism to iron particles, the alumina particles and the lipin three kind of material simple mixture participate in the magnetic abrasive finishing which directly polishes, already obtained the good effect through the experiment. This paper analyses and explains the characteristic of the friction coefficient and the friction force on magnetic abrasive finishing according as account and experiment data.

Sign in / Sign up

Export Citation Format

Share Document