Modified Abrasives based on fumed SiO2 and Al2O3 for the Cu CMP Process

2004 ◽  
Vol 816 ◽  
Author(s):  
D. Zeidler ◽  
J.W. Bartha ◽  
W.L ortz ◽  
R. Brandes
Keyword(s):  
Surface Quality ◽  
High Selectivity ◽  
Removal Rate ◽  
New Method ◽  
Copper Removal ◽  
Complexing Agent ◽  
Abrasive Particles ◽  
Cu Cmp ◽  
Low Rate ◽  
Fumed Sio2

AbstractNew abrasive particles based on SiO2 and Al2O3 were produced with different coating and doping. Seven specifically designed particles were dispersed to prepare slurries for Cu CMP. Glycin was used as complexing agent and hydrogenperoxid as oxidizer. The experimentally obtained removal rate, selectivity, surface quality and planarisation ability, demonstrate a significant impact of the different abrasives tested. SiO2 particles covered with Al2O3 increased the removal rate for Cu. In comparison to this behavior, a low rate for TaN proved a high selectivity copper removal required by the Cu CMP process. A new method for the planarisation length monitoring (step polish response) shows also significant differences in planarisation length (PL) by the polish of copper with slurries composed of these new particles.

Chemical-Mechanical Planarization of Copper: The Effect of Inhibitor and Complexing Agent

2003 ◽  
Vol 767 ◽  
Author(s):  
Ying Luo ◽  
Tianbao Du ◽  
Vimal Desai
Keyword(s):  
Hydrogen Peroxide ◽  
Photoelectron Spectroscopy ◽  
Removal Rate ◽  
Chemical Mechanical Planarization ◽  
Electrochemical Process ◽  
Copper Removal ◽  
Alkaline Condition ◽  
Complexing Agent ◽  
Polarization Studies ◽  
Cu Cmp

AbstractThe present investigation was focused on understanding of the oxidation, dissolution and modification of Cu surface in slurries at various pH using hydrogen peroxide as oxidizer, glycine as complexing agent and 3-amino-triazol (ATA) as inhibitor during Cu-CMP. The electrochemical process involved in the oxidative dissolution of copper was investigated by potentiodynamic polarization studies. Surface modification of copper was investigated using Xray photoelectron spectroscopy to understand the interaction of Cu-H2O2-glycine-ATA during CMP. In the absence of glycine and ATA, the copper removal rate is found to be high in a slurry with 5% H2O2 at pH 2, then it decreases with increasing pH and reaches the minimum at pH 6, it continuously increases at alkaline condition. In the presence of 0.01M glycine, the removal rate of copper decreases in acidic slurries while increases significantly in alkaline slurries. With the further addition of ATA, the copper removal rate was reduced. However, better surface planarity was obtained. The present investigation enhanced understanding of the mechanism of Cu CMP in the presence of oxidizer, complexing agent and inhibitor for formulation of a highly effective CMP-slurry.

Potential-pH Diagrams of Interest to Chemical Mechanical Planarization of Copper Thin Films

2005 ◽  
Vol 867 ◽  
Author(s):  
Serdar Aksu
Keyword(s):  
Performance Metrics ◽  
Ethylenediaminetetraacetic Acid ◽  
Removal Rate ◽  
Chemical Mechanical Planarization ◽  
Copper Removal ◽  
Chemical Components ◽  
Complexing Agents ◽  
Complexing Agent ◽  
Interlayer Dielectric ◽  
Cu Cmp

AbstractChemical mechanical planarization (CMP), which can globally planarize both silicon dioxide (the prevalent interlayer dielectric), and copper films, has become the key process in the damascene method used for producing integrated circuit (IC) devices with multilevel copper interconnects. Cu CMP is typically carried out with slurries containing oxidizing agents, complexing agents, and corrosion inhibitors as the principal chemical components. In such slurries, complexing agents enhance the solubility of copper and increase the dissolution rate of the abraded material in Cu CMP. They also assist achieving high copper removal rates during dynamic polishing conditions. The nature of the complexing agent used, the pH and the redox potential of the slurry system are among the main factors controlling the dissolution and passivation behaviors of copper during CMP. Consequently, these factors are intimately related to the key CMP performance metrics such as removal rate and planarity. In this paper, potentialpH diagrams of copper in aqueous systems containing a number of organic complexing agents including ethylenediaminetetraacetic acid (EDTA), nitrilotriacetic acid (NTA), oxalic acid and malonic acid are presented. The predominance regions of copper complexes under different copper and ligand activities and their implications on copper removal during CMP are discussed.

Effect of Corrosion Inhibitor (BTA) in Citric Acid based Slurry on Cu CMP

2005 ◽  
Vol 867 ◽  
Author(s):  
In-Kwon Kim ◽  
Young-Jae Kang ◽  
Yi-Koan Hong ◽  
Jin-Goo Park
Keyword(s):  
Etch Rate ◽  
Removal Rate ◽  
Passivation Layer ◽  
Chemical Dissolution ◽  
H2o2 Concentration ◽  
Removal Rates ◽  
Abrasive Particles ◽  
Mechanical Abrasion ◽  
Abrasion Rate ◽  
Cu Cmp

AbstractIn this study, the effect of BTA on polishing behavior was investigated as functions of H2O2, slurry pH and abrasive particles. The addition of BTA effectively prevented Cu from etching by forming the passivation layer of Cu-BTA regardless of pH and H2O2 concentration in slurry. A thinner passivation layer was grown on Cu in BTA added slurry solutions with a higher contact angle of 60°. The dynamic etch rate, the removal rate with abrasive free slurry, also decreased when BTA was added in slurry at pH 2, 4 and 6. The removal rate of Cu was strongly dependent on types of abrasive particles in slurry. The larger hardness of slurry abrasive particles, the higher removal rates of Cu. The reduction of removal rates in BTA added slurry was determined by the competition between chemical dissolution rate and mechanical abrasion rate.

Interaction between abrasive particles and film surfaces in low down force Cu CMP

2004 ◽  
Vol 816 ◽  
Author(s):  
Yuchun Wang ◽  
Isaac Zomora ◽  
Joe Hawkins ◽  
Renjie Zhou ◽  
Fred Sun ◽  
...  
Keyword(s):  
Surface Finish ◽  
Removal Rate ◽  
Film Formation ◽  
Abrasive Particles ◽  
High Removal Rate ◽  
Performance Results ◽  
Cu Cmp ◽  
Copper Passivation

A robust copper slurry should have high removal rate, efficient planarization, optimal over polishing window and fast clearing without corrosion. These requirements were addressed in the choice of abrasive particles, film formation for copper passivation, selectivity of copper to barrier, and interactions between particles and film surfaces. The performance results of low dishing erosion and surface finish are discussed with the proposed mechanism.

The Adsorption Behaviors of Citric Acid on Abrasive Particles in Cu CMP Slurry

2005 ◽  
Vol 867 ◽  
Author(s):  
Young-Jae Kang ◽  
Yi-Koan Hong ◽  
Jae-Hoon Song ◽  
In-Kwon Kim ◽  
Jin-Goo Park
Keyword(s):  
Citric Acid ◽  
Friction Force ◽  
Adhesion Force ◽  
Removal Rate ◽  
Friction Forces ◽  
Abrasive Particles ◽  
Ph Values ◽  
Adsorption Behaviors ◽  
Cu Cmp ◽  
Citrate Ions

AbstractThe interaction between Cu surface and abrasive particles in slurry solution was characterized. The adsorption behavior of the citrate ions was dependent on the pH of the slurry and the concentration of the citric acid. The adsorption of citrate ions generated a highly negative charge on the alumina surface and shifted isoelectric point (IEP) to lower pH values. The Cu removal rate of alumina slurry was higher than that of colloidal silica based slurry in the investigated pH ranges. Although lower friction forces of Cu were observed in alumina based slurry of pH 4, 6 and 8, a higher friction force was observed at pH 2. This high friction force was attributed to the positive zeta potential and greater adhesion force of particle. It indicates that the magnitudes of particle adhesions on Cu surfaces in slurries can be directly related to the frictional behavior during CMP process.

Effects of Alkaline Nano-SiO2 Abrasive on Planarization of 300mm Copper Patterned Wafer

2013 ◽  
Vol 634-638 ◽  
pp. 2949-2954
Author(s):  
Xin Liang Tang ◽  
Yu Ling Liu ◽  
Hong Yuan Zhang ◽  
Jie Bao
Keyword(s):  
Removal Rate ◽  
Chemical Mechanical Planarization ◽  
Initial Step ◽  
Step Height ◽  
Copper Removal ◽  
Copper Wafers

Silica abrasive plays an important role in chemical mechanical planarization (CMP) of copper. In this paper, effect of different silica abrasive concentrations on copper removal rate and planarization performance of copper was investigated. The results show that the copper removal rate was increased as the concentration of silica abrasive increase. However, excessive abrasive will lead to a decreased copper removal rate. The initial step height values of the multilayer copper wafers were all about 2500Å, and after being polished for 30s, the remaining values of step height of slurry A, B, C and D were 717 Å, 906 Å, 1222 Å and 1493 Å. It indicates that alkaline copper slurries with different abrasive concentrations all had a good planarization performance on copper patterned wafer CMP. As the abrasive concentration increased, the planarization capability was enhanced.

Development of a New Plate Polishing Technique with an Instantaneous Tiny-Grinding Wheel Cluster Based on Magnetorheological Effect

2008 ◽  
Vol 53-54 ◽  
pp. 155-160 ◽  
Author(s):  
Qiu Sheng Yan ◽  
Ai Jun Tang ◽  
Jia Bin Lu ◽  
Wei Qiang Gao
Keyword(s):  
Surface Roughness ◽  
Material Removal Rate ◽  
Material Removal ◽  
Removal Rate ◽  
Grinding Wheel ◽  
Abrasive Particles ◽  
Magnetorheological Effect ◽  
Material Removal Model ◽  
Mr Effect ◽  
Removal Model

A new plate polishing technique with an instantaneous tiny-grinding wheel cluster based on the magnetorheological (MR) effect is presented in this paper, and some experiments were conducted to prove its effectiveness and applicability. Under certain experimental condition, the material removal rate was improved by a factor of 20.84% as compared with the conventional polishing methods with dissociative abrasive particles, while the surface roughness of the workpiece was not obviously increased. Furthermore, the composite of the MR fluid was optimized to obtain the best polishing performance. On the basis of the experimental results, the material removal model of the new plate polishing technique was presented.

Non-Contact Ultrasonic Abrasive Machining of Wire-Electrical Discharge Machined SUS304 Steel

2017 ◽  
Author(s):  
K. L. Tan ◽  
S. H. Yeo
Keyword(s):  
Material Removal ◽  
Cavitation Erosion ◽  
Removal Rate ◽  
Recast Layer ◽  
Ultrasonic Machining ◽  
Abrasive Machining ◽  
Efficient Removal ◽  
Abrasive Particles ◽  
The Poor ◽  
Lower Material

Non-contact ultrasonic abrasive machining (NUAM) is a variant of ultrasonic machining (USM). In NUAM, material is removed predominantly by cavitation erosion in abrasive slurry. Due to a significantly lower material removal rate than traditional USM, NUAM is investigated for its applicability on surface modification and finishing in this study. Experiments were conducted on SUS304 steel samples machined by wire electrical discharged machining (WEDM). Due to the thermal spark phenomenon during WEDM, a thermal recast layer, of thickness approximately 15 μm, is often left over on the specimen’s surface after the process. The undesired thermal recast layer contributes to the poor surface integrity of specimens. A NUAM system was configured using a 40 kHz ultrasonic system. Ultrasonic vibration amplitude of 70 μm at the horn tip was used to generate cavitation bubbles in the abrasive slurry. NUAM was found to be effective in removing the unstable thermal recast layers by means of cavitation erosion. As a result, the average surface roughness, Ra, of the specimens improved from approximately 2.5 μm to ∼1.7 μm after 20 minutes of processing time. Furthermore, the addition of abrasive particles was observed to aid in more efficient removal of thermal recast layers than a pure cavitation condition.

scholarly journals PENGGUNAAN STEEL GRIT G25 PADA SANDBLASTING BAJA KARBON RENDAH JIS-G3101-SS400

2019 ◽  
Vol 17 (3) ◽  
Author(s):  
Muslimin Muslimin ◽  
Azam Milah Muhamad
Keyword(s):  
Surface Quality ◽  
Coating Thickness ◽  
Construction Material ◽  
Low Carbon Steel ◽  
Process Time ◽  
Material Surface ◽  
Low Carbon ◽  
Abrasive Material ◽  
Abrasive Particles ◽  
Fixed Parameter

ABSTRACTSandblasting is an abrasive particles shooting to material surface for cleaning dust, paint, and rust, along as increasing material surface structure quality for coating, painting and other adhesive process. Al2O3 and steel grit are the most abrasive particles used in this process. Al2O3 is reusable particle inspite of more expensive and producing more dust. On the other hand, steel grit is cheaper and producing less dust. This article focuses on the use of the new and the reused steel grit G25 in sandblasting process of construction material low carbon steel. The objective is to study the effect of the new and reused abrasive material steel grit in sandblasting process on the surface quality. The methods of this experiments are comparing the surface quality of sandblasting process of new and once reused steel grit G25 using the same experimental parameters. Fixed parameter in this experiment is the nozzle pressure, 5 bar, while the independent variables are process distance (15 cm, 25 cm, and 30 cm) and the process time (25 s, 45 s, 120 s). Testing analyses in this experiments are roughness test ASTM D7127-13 and coating thickness test ASTM D-7091. Result of the experiment are coating thickness result are the highest 120 μm and the least 94,14 μm for the new steel grit, while 89,88 μm and 58,58 μm the highest and least for the once used steel grit. Highest roughness result for the new steel grit are 21,4 μm and once used steel grit 17,8 μm, while the least rough are 18,1 μm for the new steel grit and 3, 452 μm for once used steel grit. The once used steel grit G25 still can be accepted as abrasive material in sandblasting process but with less good quality than the new one.Key words :sandblasting, new steel grit G25, new steel grit G25, surface roughness.ABSTRAKSandblasting adalah suatu proses penembakan partikel abrasif ke suatu permukaan untuk membersihkan debu, cat, dan karat, dan membuat tekstur permukaan material agar lapisan pelindung dapat menempel lebih baik. Partikel abrasif yang banyak digunakan dalam proses sandblasting adalah Al2O3 dan steel grit. Partikel Al2O3 memiliki ketahanan abrasive yang tinggi, tetapi harganya lebih mahal dan menghasilkan debu proses lebih banyak. Sedangkan, steel grit harganya lebih murah dan sedikit menghasilkan debu proses. Penelitian ini berfokus pada penggunaan material abrasif steel grit G25 baru dan pemakaian ulang untuk proses sandblasting baja karbon rendah untuk material konstruksi. Tujuan penelitian ini adalah mengkaji pengaruh penggunaan steel grit G25 dan penggunaan ulangnya terhadap kualitas permukaan hasil sandblasting.Metode yang digunakan, yaitu dengan membandingkan hasil proses sandblasting dengan partikel steel grit G25 baru dan partikel steel grit G25 pemakaian ulang (1 kali pemakaian) dalam parameter uji yang sama. Parameter tetap yang digunakan yaitu tekanan nozzle sebesar 5 bar, sedangkan variabel bebasnya yaitu jarak (15 cm, 25 cm, dan 30 cm) dan waktu penembakkan (25 detik, 45 detik, dan 120 detik). Analisis pengujian yang digunakan adalah uji kekasaran ASTM D7127-13 dan uji ketebalan cat ASTM D7091. Nilai ketebalan cat tertinggi steel grit baru 120 μm, steel grit ulang 89,88 μm, dan terendah steel grit baru 94,14 μm, steel grit ulang 58,58 μm. Nilai kekasaran tertinggi steel grit baru 21,4 μm, steel grit ulang 17,8 μm, dan terendah steel grit baru 18,1 μm, steel grit ulang 3,452 μm. Penggunaan steel grit G25 penggunaan baru lebih baik dibandingkan dengan penggunaan ulangnya, dengan hasil pengujian steel grit baru yang lebih tinggi dengan penggunaan ulang.Katakunsi : sandblasting, steel grit G25 baru, Steel grit G25 sekali pakai, kekasaran permukaan.

Sign in / Sign up

Export Citation Format

Share Document