Metrology Issues in Cu-Low-K Chemical Mechanical Planarization

2002 ◽  
Vol 750 ◽  
Author(s):  
Parshuram B. Zantye ◽  
Arun K. Sikder ◽  
Swetha Thagella ◽  
Nivedita Gulati ◽  
Ashok Kumar
Keyword(s):  
Tribological Properties ◽  
Surface Characterization ◽  
Chemical Mechanical Planarization ◽  
Dielectric Materials ◽  
Successful Implementation ◽  
Post Process ◽  
Damascene Process ◽  
Reduced Modulus ◽  
Materials Used ◽  
Cu Cmp

ABSTRACTUltra low-k materials used in Cu damascene process are inherently soft and weak in nature; hence the evaluation of tribological properties of these materials is an issue of paramount importance in the field of semiconductor fabrication. Chemical Mechanical Polishing (CMP) of these films is a major challenge due to their reduced modulus and cohesive strength. The objective of this research is to develop a strong understanding of the tribological properties of Cu ultra low-k dielectric materials for successful implementation in the semiconductor devices. The Cu ultra low-k systems are polished at different conditions of load and platen rotation and their polishing behavior is compared with the standard Cu-SiO2 system. The polishing behavior of Cu and the barrier Ta material is studied in order to effectively detect the end point of the Cu CMP process. Delamination studies, post process surface characterization using scanning electron microscopy and the reliability issues of these materials also come within the scope of this study.

Effect of Tribological Properties of Undoped and Florine-Doped Silicon Di-Oxide Fims on Chemical Mechanical Planarization Process

2001 ◽  
Vol 697 ◽  
Author(s):  
A.K. Sikder ◽  
S. Thagella ◽  
U.C. Bandugilla ◽  
Ashok Kumar
Keyword(s):  
Tribological Properties ◽  
Chemical Mechanical Planarization ◽  
Critical Role ◽  
Successful Implementation ◽  
Emission Signal ◽  
Doped Silicon ◽  
The Coefficient Of Friction ◽  
Planarization Process ◽  
Silica Slurry ◽  
Physical Phenomena

AbstractChemical mechanical planarization (CMP) occurs at an atomic level at the slurry/wafer interface and hence slurries and the interaction of the films and polishing pads play a critical role in the successful implementation of this process. Understanding the tribological properties of a dielectric layer in the CMP process is critical for successful evaluation and implementation of the materials. In this paper, we present the effect of tribological properties of undoped and florine doped silicon dioxide films on their CMP process. A micro-CMP tester was used to study the fundamental aspects of CMP process. We have studied the CMP process of oxides on polyurethane pads (IC1000-B4/SubaIV) with colloidal silica slurry at different conditions. The coefficient of friction (COF) and acoustic emission signal was monitored during process. The COF was measured during the process and was found to varies differently for different samples and with down force and platen roatation. The effects of machine's parameters on the polishing performance and correlation of physical phenomena with the process has been discussed.

Technique of surface control with the Electrolyzed D.I.water for post CMP cleaning

2000 ◽  
Vol 613 ◽  
Author(s):  
Mitsuhiko Shirakashi ◽  
Kenya Itoh ◽  
Ichiro Katakabe ◽  
Masayuki Kamezawa ◽  
Sachiko Kihara ◽  
...  
Keyword(s):  
Chemical Mechanical Planarization ◽  
Surface Condition ◽  
Dielectric Materials ◽  
Barrier Materials ◽  
Surface Control ◽  
Metal Materials ◽  
Cu Cmp

ABSTRACTChemical mechanical planarization (CMP) has been widely used for planarization of ILD, STI, plug and wiring processes. Wafer has several surfaces of materials, such as wiring materials, barrier materials, dielectric materials etc., that must be cleaned at the same time. In post metal CMP cleaning processes, in addition to cleaning several surfaces, it is very important that the oxidization level of metal materials, such as wiring, is held and controlled to maintain its resistance. Especially copper, that is began to use for wiring, is very easy to be oxidized. We have confirmed that the Electrolyzed D.I.water is effective in post Cu CMP cleaning for controlling the surface condition of Cu during cleaning and leaving a robust surface after CMP. We describe the Electrolyzed D.I.water system and present some result of analysis of Cu surface by treated with the Electrolyzed D.I.water.

Surface flashover of dielectric materials used in pulsed power research

2007 ◽  
Author(s):  
M.P. Wilson ◽  
R.A. Fouracre ◽  
M.J. Given ◽  
S.J. MacGregor ◽  
I.V. Timoshkin ◽  
...  
Keyword(s):  
Dielectric Materials ◽  
Pulsed Power ◽  
Surface Flashover ◽  
Materials Used

scholarly journals Analysis and Comparative Assessment of Basic Tribological Properties of Selected Polymer Composites

Materials ◽  
2019 ◽  
Vol 13 (1) ◽  
pp. 75 ◽  
Author(s):  
Jerzy Jozwik ◽  
Krzysztof Dziedzic ◽  
Marcin Barszcz ◽  
Mykhaylo Pashechko
Keyword(s):  
Polymer Composites ◽  
Friction Force ◽  
Tribological Properties ◽  
Friction Pair ◽  
Computer Software ◽  
Operating Conditions ◽  
The Coefficient Of Friction ◽  
Cast Polyamide ◽  
Friction Path ◽  
Materials Used

Phenomena occurring in the contact area between two mating bodies are characterised by high complexity and variability. Comparisons are usually made between parameters such as the coefficient of friction, friction force, wear and temperature in relation to time and friction path. Their correct measurement enables the proper evaluation of tribological properties of materials used in the friction pair. This paper concerns the measurements of basic tribological parameters in the friction of selected polymer composites. Knowing the tribological properties of these composite materials, it will be possible to create proper operating conditions for kinematic friction pairs. This study investigated the coefficients of friction, friction force and temperatures of six polymer composites: cast polyamide PA6 G with oil, PA6 G with MoS2, polyoxymethylene POM with aluminium, polyethylene terephthalate PET with polytetrafluoroethylene PTFE, PTFE with bronze, and PTFE with graphite. The friction surface was also examined using an optical system and computer software for 3D measurements. As a result, PA6-G with oil was found to be the best choice as a composite material for thin sliding coatings.

scholarly journals Breathable Materials for Triboelectric Effect-Based Wearable Electronics

2018 ◽  
Vol 8 (12) ◽  
pp. 2485 ◽  
Author(s):  
Congju Li ◽  
Ran Cao ◽  
Xiuling Zhang
Keyword(s):  
Recent Progress ◽  
Dielectric Materials ◽  
Wearable Devices ◽  
Wearable Electronics ◽  
Practical Application ◽  
Metal Mesh ◽  
Frictional Materials ◽  
Nanofiber Membranes ◽  
Materials Used ◽  
Triboelectric Effect

Wearable electronics are believed to be the future of the next-generation electric devices. However, the comfort of current wearable devices is greatly limited due to the use of airtight materials, which may even lead to inflammation of the skin. Therefore, breathable, skin-friendly materials, are highly desired for wearable devices. Here, the recent progress of the breathable materials used to fabricate skin-friendly electronics is reviewed by taking triboelectric effect-based wearable electronics as a typical example. Fibers, yarns, textiles, and nanofiber membranes are the most popular dielectric materials that serve as frictional materials. Metal mesh, silver yarn, and conductive networks made up of nanomaterial are preferred as air-permissive electrodes. The breathable materials for skin-friendly wearable electronics summarized in this review provide valuable references for future fabrication of humanized wearable devices and hold great significance for the practical application of wearable devices.

scholarly journals Mechanical Properties of Graphene Oxide–Copper Composites

2016 ◽  
Vol 61 (2) ◽  
pp. 863-868 ◽  
Author(s):  
P. Duda ◽  
R. Muzyka ◽  
Z. Robak ◽  
S. Kaptacz
Keyword(s):  
Graphene Oxide ◽  
Tribological Properties ◽  
Low Voltage ◽  
Electrical Equipment ◽  
Oxide Content ◽  
Large Current ◽  
Current Densities ◽  
Materials Used ◽  
System Disk ◽  
Positive Effect

Abstract Due to their characteristics, sintered Cu-C composites are materials used in electrical equipment. These characteristics include high electrical conductivity, thermal conductivity and excellent resistance to abrasion. Currently, graphite nanopowder is used successfully as a carbon material. Metal-graphite, which is created on its basis, exists in different proportions of graphite to metal. A larger graphite content has a positive effect on smaller wear of commutators and rings. In contrast, a material with a higher copper content is used at high current densities. An example of such machines is a DC motor starter characterized by low voltage and large current. Tribological properties of Cu-C composites depend on the form of carbon they include. Owing to the capability to manufacture graphene, it has become possible to produce composites with its content. The present study tested the effect of a graphene oxide content on tribological properties in contact with steel. Tests were conducted on a ball-on-disk apparatus in conditions of dry friction. Microscopic observation was performed on the Hitachi SU70 field emission electron microscope. EDS analyses were performed using the Thermo Scientific X-ray Microanalysis system. Disk wear and surface geometrical structure parameters (SGP) of the samples after tribological tests were determined on the basis of measurements made on the Talysurf 3D contact profilometer from Taylor Hobson.

LOW LOSS DIELECTRIC MATERIALS FOR HIGH FREQUENCY APPLICATIONS

2009 ◽  
Vol 23 (17) ◽  
pp. 3649-3654 ◽  
Author(s):  
MOHAN V. JACOB
Keyword(s):  
High Frequency ◽  
Room Temperature ◽  
Low Cost ◽  
Dielectric Materials ◽  
Dielectric Constants ◽  
Transmission Losses ◽  
Low Loss ◽  
Microwave Characterization ◽  
Materials Used ◽  
Low Temperature Electronics

The microwave properties of some of the low cost materials which can be used in high frequency applications with low transmission losses are investigated in this paper. One of the most accurate microwave characterization techniques, Split Post Dielectric Resonator technique (SPDR) is used for the experimental investigation. The dielectric constants of the 3 materials scrutinized at room temperature and at 10K are 3.65, 2.42, 3.61 and 3.58, 2.48, 3.59 respectively. The corresponding loss tangent values are 0.00370, 0.0015, 0.0042 and 0.0025, 0.0009, 0.0025. The high frequency transmission losses are comparable with many of the conventional materials used in low temperature electronics and hence these materials could be implemented in such applications.

ESTIMATION OF TRIBOLOGICAL PROPERTIES OF SELECTED PLASTICS MATERIALS MANUFACTURED BY EXTRUSION AND 3D PRINTING

Tribologia ◽  
2021 ◽  
Vol 294 (6) ◽  
pp. 7-12
Author(s):  
Henryk Bąkowski ◽  
Zbigniew Krzysiak
Keyword(s):  
Wear Resistance ◽  
3D Printing ◽  
Aluminium Alloy ◽  
Tribological Properties ◽  
Dry Friction ◽  
Tribological Characteristics ◽  
3D Printer ◽  
Reciprocating Motion ◽  
Block System ◽  
Materials Used

The following work presents the results of research about the assessment of tribological properties of plastics used as components in modes of transport. For this purpose, the wear resistance of materials used in 3D printing (PA6CF and ABS), and extrusion moulding (PA) were tested. The tribological research was carried out with the use of the T-05 tester in the roller-block system. The samples in the form of cuboids with a concave rounding of one wall were made on a 3D printer using the FDM method. The counter-sample was a ring made of aluminium alloy subjected to anodizing. The research was carried out under a variable loads, in reciprocating motion, under dry friction conditions. After that the tribological characteristics were assessed. The research and analysis of the results confirmed the possibility of using selected plastics in modes of transport.

scholarly journals Reducing the Susceptibility of Lumped-Element KIDs to Two-Level System Effects

2020 ◽  
Vol 200 (5-6) ◽  
pp. 239-246
Author(s):  
A. L. Hornsby ◽  
P. S. Barry ◽  
S. M. Doyle ◽  
Q. Y. Tang ◽  
E. Shirokoff
Keyword(s):  
Dielectric Materials ◽  
Kinetic Inductance Detectors ◽  
Kinetic Inductance ◽  
Noise Power ◽  
Microwave Background ◽  
Superconducting Resonators ◽  
Lumped Element ◽  
Noise Power Spectral Density ◽  
Power Spectral ◽  
Materials Used

Abstract Arrays of lumped-element kinetic inductance detectors (LEKIDs) optically coupled through an antenna-coupled transmission line are a promising candidate for future cosmic microwave background experiments. However, the dielectric materials used for the microstrip architecture are known to degrade the performance of superconducting resonators. In this paper, we investigate the feasibility of microstrip coupling to a LEKID, focusing on a systematic study of the effect of depositing amorphous silicon nitride on a LEKID. The discrete and spatially separated inductive and capacitive regions of the LEKID allow us to vary the degree of dielectric coverage and determine the limitations of the microstrip coupling architecture. We show that by careful removal of dielectric from regions of high electric field in the capacitor, there is minimal degradation in dielectric loss tangent of a partially covered lumped-element resonator. We present the effects on the resonant frequency and noise power spectral density and, using the dark responsivity, provide an estimate for the resulting detector sensitivity.

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