Synthesis of Low-Voltage Logic Gates on Surrounding Gate SOI CMOS Nanotransistors

2021 ◽  
Vol 23 (2) ◽  
pp. 75-82
Author(s):  
Masalsky N.V. ◽  

We discuss the issues of synthesis of low-voltage logic gates on cylindrical surrounding gate SOI CMOS nanotransistors in the supply voltage range up to 0.8 V. In this transistor architecture, it becomes possible to more effectively control the charge in its working area, primarily due to its design parameters. It is also characterized by effective suppression of short-channel effects and a low capacitance value. This leads to a decrease in the level of power dissipation in combination with a reduction in the occupied area. TCAD models of n- and p-types nanotransistors have been developed. The anomalous behavior of the dependence of the threshold voltage on the diameter of the working area is revealed, which is associated with the peculiarities of the manifestation of short-channel effects due to the capacitive interaction of the gate-channel regions and drain-source transitions at small gate lengths. They were used to select prototypes of transistors with optimal parameters for the synthesis of complex logic gates with low supply voltage. Using the mathematical core of the HSPICE program, the dynamic characteristics of the developed physical models of the inverter, the inverter chain, and the XOR2 are numerically investigated. At control voltages of 0.8 V and a frequency of 50 GHz, the inverter model predicts a maximum switching delay of 3.3 ps, a limit level of active power of 1.1 mkW, static 0.3 pW, the XOR2 predicts a maximum switching delay of 8.6 ps, a limit level of active power of 4.9 mkW, static 1.5 pW. The minimum of the product "delay * power" of the adder is at a supply voltage of 0.72 V. Its position does not depend on the set of input signals. At the same time, the maximum switching delay is 10.8 ps, the maximum active power level is 3.9 mkW. The totality of the obtained characteristics allows us to consider the analyzed transistor architecture for creating low-power electronic devices.

2006 ◽  
Vol 16 (01) ◽  
pp. 193-219 ◽  
Author(s):  
S. DELEONIBUS ◽  
B. de SALVO ◽  
T. ERNST ◽  
O. FAYNOT ◽  
T. POIROUX ◽  
...  

Innovations in electronics history have been possible because of the strong association of devices and materials research. The demand for low voltage, low power and high performance are the great challenges for engineering of sub 50nm gate length CMOS devices. Functional CMOS devices in the range of 5 nm channel length have been demonstrated. The alternative architectures allowing to increase devices drivability and reduce power are reviewed through the issues to address in gate/channel and substrate, gate dielectric as well as source and drain engineering. HiK gate dielectric and metal gate are among the most strategic options to consider for power consumption and low supply voltage management. It will be very difficult to compete with CMOS logic because of the low series resistance required to obtain high performance. By introducing new materials ( Ge , diamond/graphite Carbon, HiK, …), Si based CMOS will be scaled beyond the ITRS as the future System-on-Chip Platform integrating new disruptive devices. The association of C-diamond with HiK as a combination for new functionalized Buried Insulators, for example, will bring new ways of improving short channel effects and suppress self-heating. That will allow new optimization of Ion-Ioff trade offs. The control of low power dissipation and short channel effects together with high performance will be the major challenges in the future.


Author(s):  
Nandhaiahgari Dinesh Kumar ◽  
Rajendra Prasad Somineni ◽  
CH Raja Kumari

<span>CMOS transistors are most widely used for the design of computerized circuits, when scaling down the nanometer technology these devices faces the short channel effects and causes I-V characteristics to depart from the traditional MOSFETs, So the researchers have developed the other transistors technologies like CNTFET and GNRFET. Carbon nanotube field effect transistor is one of the optimistic technologies and it is a three terminal transistor similar to MOSFET. The semiconducting channel between the two terminals called source and drain comprises of the nano tube which is made of carbon. Graphene nano ribbon filed effect transistor is the most optimistic technology here the semiconducting channel is made of graphene. When contrasted with barrel shaped CNTFETs, GNRFETs can be prepared in situ process, transfer-free and silicon compatible, thus have no passage related and alignment problems as faced in CNTFET devices. This paper presents different 1-bit Full Adder Cells (FACs) like TG MUX-based FAC (TGM), MN MUX-based FAC (MNM), proposed TG Modified MUX-based FAC (TGMM) and another proposed MN Modified MUX-based FAC (MNMM) are designed using different technologies like CNTFET and GNRFET at 16nm technology with supply voltage of 0.85v and simulation is done by using Synopsys HSPICE Tool and the proposed designs are best when compared to the TGM and MNM FACs in terms of Static and Dynamic powers Dissipations and Delay.</span>


2021 ◽  
Vol 13 (4) ◽  
pp. 449-456
Author(s):  
Nikolae V. Masalsky ◽  

The applicability of the architecture of a nanoscale surrounding gate field-effect transistor with a combined cylindrical working area for low-voltage applications is discussed. At the same time, the licensed TCAD Sentaurus instrument and technological modeling system is used as a tool. The transistor architecture under consideration involves combining the working zones of n-channel and p-channel transistors with one common gate. At the same time, the efficiency of suppressing short-channel effects is maintained and a high level of transistor current is provided in the strong inversion mode. Based on this architecture, a TCAD model of the NAND gate has been developed, the design of which contains two independent surrounding gates one combined working area. The use of the proposed gate architecture makes it possible to reduce the number of required transistor structures per gate by three times. This leads to a decrease in the switched capacity and power dissipation. From the simulation results, the gate geometric parameters with a working area length of 25 nm and a diameter of 8.5 nm, which can function at control voltages of 0.5 V in the frequency range up to 20 GHz with high gain, are determined. The switching time delay is 0.81 ps. The TCAD model of a half-adder is developed in the basis 2NAND. According to the simulation results, the efficiency of the prototype, which performs binary code addition operations with a delay of 4.2 ps at a supply voltage of 0.5 V and a frequency of 20 GHz, is shown. The obtained results create a theoretical basis for the synthesis of low-voltage complex functional blocks with high performance and minimal occupied area, which meets modern requirements for digital applications.


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