Bacteria as a Particle Source in Wafer Processing Equipment

1986 ◽  
Vol 29 (3) ◽  
pp. 32-34
Author(s):  
Wayne Harned

Contamination control in integrated circuit wafer processing has become a major concern within the last two to three years. The surface particle counters and liquid particle counters have identified many particle sources within wafer processing equipment. One of these sources which is often overlooked is bacteria from the deionized water which is utilized in various etch, clean, rinser/dryers, scrubbers, and positive photoresist develop systems. Bacteria as live or dead microorganisms or as fragments of these microorganisms are a particle source and are a source of low level metals contamination. Bacteria in equipment is overlooked by many integrated circuit manufacturers and was not addressed by equipment manufacturers until recently. In many cases, integrated circuit manufacturers monitor only final rinse tanks or quick dumps for bacteria level and do not sample the bacteria level from all sources of equipment. By testing for bacteria level at every source of water that comes in contact with the waters, one finds many areas of stagnant water where the bacteria counts are too-numerous-to-count (TNTC). The causes for these high bacteria counts are dead legs (plumbing within equipment which has stagnant water flow), water velocities too low, inadequately sized plumbing, and materials used in the plumbing of the equipment. The solutions to these problems must be addressed by equipment users and manufacturers modifying existing equipment and designing new equipment with bacteria control as a primary concern.

Author(s):  
Nicholas Randall ◽  
Rahul Premachandran Nair

Abstract With the growing complexity of integrated circuits (IC) comes the issue of quality control during the manufacturing process. In order to avoid late realization of design flaws which could be very expensive, the characterization of the mechanical properties of the IC components needs to be carried out in a more efficient and standardized manner. The effects of changes in the manufacturing process and materials used on the functioning and reliability of the final device also need to be addressed. Initial work on accurately determining several key mechanical properties of bonding pads, solder bumps and coatings using a combination of different methods and equipment has been summarized.


2000 ◽  
Vol 612 ◽  
Author(s):  
G. S. Shekhawat ◽  
O.V. Kolosov ◽  
G.A.D. Briggs ◽  
E. O. Shaffer ◽  
S. Martin ◽  
...  

AbstractA new characterization tool based on ultrasonic force microscopy (UFM) has been developed to image the nanometer scale mechanical properties of aluminum/low-k polymer damascence integrated circuit (IC) test structures. Aluminum and polymer regions are differentiated on the basis of elastic modulus with a spatial resolution ≤ 10 nm. This technique reveals a reactive-ion etch (RIE)-induced hardening of the low-k polymer that is manifested in the final IC test structure by a region of increased hardness at the aluminum/polymer interface. The ability to characterize nanometer scale mechanical properties of materials used for IC back-end-of-line (BEOL) manufacture offers new opportunities for metrological reliability evaluation of low-k integration processes.


2018 ◽  
Vol 7 (2.8) ◽  
pp. 340
Author(s):  
Vimlesh Singh ◽  
Priyanka Bansal ◽  
P K.Singhal

This paper presents an extensive survey of electromagnetic materials used for antenna fabrication, which find application in Civilian life as well as defense life. When a densely packed microwave integrated circuit is designed, it requires protection from higher power transient because of specific polarization and frequency response. To meet specification of such kind of microwave circuits it is desired to exploit properties of fabricating materials, which are not found in nature but can be prepared with specific proportion of chemical element combination. This study provides in-depth responses of materials toward electromagnetic wave's characteristics such as dielectric, flexible electronics, electrical and thermal properties, which have vast potential in communication engineering.


2014 ◽  
Vol 2014 (1) ◽  
pp. 000295-000300
Author(s):  
Derek Andrews ◽  
Levi Hill ◽  
Hassan Masood ◽  
Durgasamanth Pidikiti ◽  
Qutaiba Khalid ◽  
...  

An integrated circuit wafer lot having some wafers with discolored bond pads and other wafers with normal bond pads was identified, and wafers with discolored pads were scrapped. The reason for scrap is the expectation of poor bondability or unreliable wirebonds on discolored pads. The cause of discoloration was unknown. We took the opportunity to run a bonding experiment and analysis as a student project, comparing a good wafer with one having the discolored bond pads. Unprobed die from each wafer were wirebonded for mechanical integrity analysis of the bonds. Bonding recipe designed experiments included different ultrasonic generator (USG) current settings within the bonding process window, two bonding forces, and two temperatures, all thermosonic binding 25um gold (Au) wire on AlCu pad metal of 0.7um thickness. 2% non-stick-on pads (NSOP) was found at a higher ultrasonic power settings on the discolored pads, indicating that the discolored pads can indeed be problematic in wirebonding. Analysis of wire pull test and bond shear test results indicate slightly less performance of bonds on the discolored pads. Chemical and physical analysis of the discolored pads reveals the nature of the unknown cause and leads to a hypothesis about what went wrong during the wafer processing.


MRS Bulletin ◽  
2000 ◽  
Vol 25 (6) ◽  
pp. 28-32 ◽  
Author(s):  
R. Falster ◽  
V. V. Voronkov

Silicon produced for the microelectronics industry is far and away the purest and most perfect crystalline material manufactured today. It is fabricated routinely and in very large volumes. Many of the advances in integrated-circuit (IC) manufacturing achieved in recent years would not have been possible without parallel advances in silicon-crystal quality and defect engineering. Transition-metal contamination is a case in point. Essentially all practical problems (minority carrier lifetime, metal precipitation, stacking faults, etc.) associated with metal contaminants have largely been solved through advances in crystal purity.


2014 ◽  
Vol 568-570 ◽  
pp. 1455-1458
Author(s):  
Chen Xi Wang ◽  
Ming Zhe Liu ◽  
Ai Dong Xu

With the development of semiconductor industry, different types of wafer processing are increasing. According to the different wafer processing models, the need of data display and process is different. In this paper, a customizable software platform is described for the manufacturing equipment of semiconductor integrated circuit (IC equipment). The C# control technology has been used to build the IC equipment customizable control system interface. The development method of customizable control technology based on C# can realize the control of the reuse and codes sharing, in order to improve programming efficiency, avoid the development of two times, cost saving and be easy to debug.


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