Simulation-based Analysis of Ultra Thin-body Double Gate Ferroelectric TFET for an Enhanced Electric Performance
Abstract The Ultrathin body double gate FE layer TFET(UTB-DG-FE-TFET) is proposed and investigated in this work. Electrical performance parameters such as surface potential ψ(x), electrical field, drain current, sub-threshold swing, threshold voltage, and I on /I off ratio are further analyzed using simulation-based analysis. Integration of Si: HFO 2 ferroelectric layer on top and bottom surfaces make the structure that provides negative capacitance, higher on current, enormous surface potential, peak electric field, and improvement in SS with degradation in off Current. The suggested design is evaluated in comparison with FE-TFET and standard TFET devices. Finally, the impact of device geometry variants like ferroelectric layer thickness (t fe ), intrinsic channel thickness t si , interfacial layer types, interfacial layer thickness (t ox ) and channel length L c on transfer characteristics are investigated through 2D TCAD Sentaurus Simulator for a clear validation of its optimization. The recommended work demonstrates that it is a suitable device enabling superior performance and helpful in ultra-low-power applications.