scholarly journals Experimental investigations on Thermal Performance of Copper with Aluminium Based Finned Heat sinks for Electronics Cooling System

2016 ◽  
Vol 12 (12) ◽  
pp. 4582-4587
Author(s):  
Arulmurugan Loganathan ◽  
Ilangkumaran Mani
Keyword(s):  
Thermal Performance ◽  
Heat Sink ◽  
Cooling System ◽  
Research Work ◽  
Electronics Cooling ◽  
Heat Sinks ◽  
Major Constituent ◽  
Experimental Investigations ◽  
Pure Aluminium ◽  
Fixed Temperature

An Experimental investigation on the thermal performance of copper with aluminium based finned heat sinks for electronics cooling system was studied. The heat sinks have different material proportions containing major constituent of aluminium and minor constituent of copper. Considered with straight finned heat sink for the experiments for its easiness in fabrication and efficient heat transfer properties. The observational results for aluminium with copper alloy are compared with pure aluminium heat sink.  Heat sink geometry, fin pitch and its height were taken from the commercially available heat sinks. In this research work best heat sink geometry is chosen and cooked up with different volume of copper added with aluminium. Selected four different spots of heat sinks and the temperature raising characteristics were measured for natural convection. also the temperature is raised to a fixed temperature and the temperature lowering characteristics were measured in forced convection as the air circulation takes more heat to keep the heat sink temperature within the desired level.

scholarly journals Experimental study on heat transfer performance of variable area straight fin heat sinks with PCM

2021 ◽  
pp. 299-299
Author(s):  
Rajasekaran Madhaiyan ◽  
Kannan Thannir Pandal Palayam Kandasamy ◽  
Kumaragurubaran Balasubramanian ◽  
Mohan Raman
Keyword(s):  
Heat Transfer ◽  
Thermal Performance ◽  
Heat Sink ◽  
Heat Transfer Performance ◽  
Electronics Cooling ◽  
Reynolds Numbers ◽  
Heat Sinks ◽  
Base Temperature ◽  
Pin Fin ◽  
Constant Area

The thermal performance of heat sinks with variable area straight fins with and without PCM is quantitatively explored in this article. The effects of diverse fin geometries (constant area straight fin, variable area straight fin, circular pin fin, hemispherical pin fin, and elliptical pin fin), varying Reynolds numbers, and fin densities on boosting electronics cooling performance were investigated. The goal of this research is to develop the best fin geometry for electronics cooling technologies. This research demonstrates that altering fin density can improve heat sink thermal performance while also reducing heat sink weight. The base temperature of the heat sink is found to be lower in variable area straight fins. In comparison to alternative configurations for heat transfer with PCM, the results show that variable area straight fin heat sinks are the most effective. The thermal resistance of the improved heat sink with variable fin density was reduced by 9%.

scholarly journals Study of Mini Channel Heat Sink with Different Internal Configuration

2020 ◽  
Vol 319 ◽  
pp. 02004
Author(s):  
Muhammad Akif Rahman ◽  
Md Badrath Tamam ◽  
Md Sadman Faruque ◽  
A.K.M. Monjur Morshed
Keyword(s):  
Nusselt Number ◽  
Thermal Performance ◽  
Heat Sink ◽  
Rectangular Channel ◽  
Three Dimensional ◽  
Heat Sinks ◽  
Maximum Temperature ◽  
Rectangular Channels ◽  
Flow Through ◽  
Internal Configuration

In this paper a numerical analysis of three-dimensional laminar flow through rectangular channel heat sinks of different geometric configuration is presented and a comparison of thermal performance among the heat sinks is discussed. Liquid water was used as coolant in the aluminum made heat sink with a glass cover above it. The aspect ratio (section height to width) of rectangular channels of the mini-channel heat sink was 0.33. A heat flux of 20 W/cm2 was continuously applied at the bottom of the channel with different inlet velocity for Reynold’s number ranging from 150 to 1044. Interconnectors and obstacles at different positions and numbers inside the channel were introduced in order to enhance the thermal performance. These modifications cause secondary flow between the parallel channels and the obstacles disrupt the boundary layer formation of the flow inside the channel which leads to the increase in heat transfer rate. Finally, Nusselt number, overall thermal resistance and maximum temperature of the heat sink were calculated to compare the performances of the modified heat sinks with the conventional mini channel heat sink and it was observed that the heat sink with both interconnectors and obstacles enhanced the thermal performance more significantly than other configurations. A maximum of 36% increase in Nusselt number was observed (for Re =1044).

Influence of selected factors on parameters of a cooling system with a Peltier module and forced air flow

2021 ◽  
Vol ahead-of-print (ahead-of-print) ◽  
Author(s):  
Krzysztof Posobkiewicz ◽  
Krzysztof Górecki
Keyword(s):  
Thermal Resistance ◽  
Heat Sink ◽  
Cooling System ◽  
Heat Sinks ◽  
Cooling Power ◽  
Cooling Systems ◽  
Content Type ◽  
Peltier Module ◽  
Peltier Modules ◽  
Forced Air

Purpose The purpose of this study is to investigate the validation of the usefulness of cooling systems containing Peltier modules for cooling power devices based on measurements of the influence of selected factors on the value of thermal resistance of such a cooling system. Design/methodology/approach A cooling system containing a heat-sink, a Peltier module and a fan was built by the authors and the measurements of temperatures and thermal resistance in various supply conditions of the Peltier module and the fan were carried out and discussed. Findings Conclusions from the research carried out answer the question if the use of Peltier modules in active cooling systems provides any benefits comparing with cooling systems containing just passive heat-sinks or conventional active heat-sinks constructed of a heat-sink and a fan. Research limitations/implications The research carried out is the preliminary stage to asses if a compact thermal model of the investigated cooling system can be formulated. Originality/value In the paper, the original results of measurements and calculations of parameters of a cooling system containing a Peltier module and an active heat-sink are presented and discussed. An influence of power dissipated in the components of the cooling system on its efficiency is investigated.

Understanding the Impact of Flow Bypass on the Thermal Performance of Air Cooled Heat Sinks

2014 ◽  
Author(s):  
Krishna Kota ◽  
Mohamed M. Awad
Keyword(s):  
Energy Conservation ◽  
Thermal Resistance ◽  
Thermal Performance ◽  
Heat Sink ◽  
Heat Sinks ◽  
Laminar Regime ◽  
Flow Energy ◽  
Factor Α ◽  
The Impact ◽  
Fundamental Mass

In this effort, theoretical modeling was employed to understand the impact of flow bypass on the thermal performance of air cooled heat sinks. Fundamental mass and flow energy conservation equations across a longitudinal fin heat sink configuration and the bypass region were applied and a generic parameter, referred as the Flow Bypass Factor (α), was identified from the theoretical solution that mathematically captures the effect of flow bypass as a quantifiable parameter on the junction-to-ambient thermal resistance of the heat sink. From the results obtained, it was found that, at least in the laminar regime, the impact of flow bypass on performance can be neglected for cases when the bypass gap is typically less than 5% of the fin height, and is almost linear at high relative bypass gaps (i.e., usually for bypass gaps that are more than 10–15% of the fin height). It was also found that the heat sink thermal resistance is more sensitive to small bypass gaps and the effect of flow bypass decreases with increasing bypass gap.

Thermal performance analysis by different material characteristics of electronics cooling heat sink

2019 ◽  
Vol 33 (1) ◽  
pp. 41-45
Author(s):  
Eui-Hyeok Song ◽  
RIGUANG CHI ◽  
Dae-Gyeom Yu ◽  
Seok-Ho Rhi ◽  
Dong-Ju Lee ◽  
...  
Keyword(s):  
Performance Analysis ◽  
Thermal Performance ◽  
Heat Sink ◽  
Electronics Cooling ◽  
Material Characteristics

Thermal Performance Measurement for Confined Heat Sinks by Using a Modified Transient Liquid Crystal Technique

2003 ◽  
Author(s):  
S. T. Kuo ◽  
M. P. Wang ◽  
M. C. Wu ◽  
Y. H. Hung
Keyword(s):  
Heat Transfer ◽  
Liquid Crystal ◽  
Heat Sink ◽  
Heat Sinks ◽  
Experimental Investigations ◽  
Heat Transfer Characteristics ◽  
Transfer Characteristics ◽  
Flow And Heat Transfer ◽  
Preheating Temperature ◽  
Parametric Studies

A series of experimental investigations with a new modified transient liquid crystal method on the studies related to the fluid flow and heat transfer characteristics in a channel installed with a heat sink have been successfully performed. The parametric studies on the local and average effective heat transfer characteristics for confined heat sinks have been explored. The influencing parameters and conditions include air preheating temperature at channel inlet, flow velocity and heat sink types. Besides, a concept of the amount of enhanced heat transfer (AEHT) is introduced and defined as the ratio of j/f. The j/f ratio is almost independent of Reynolds number for a specific confined heat sink. The j/f ratios are 0.0603 and 0.0124 for fully-confined and unconfined heat sinks, respectively.

Experimental Investigation of a PCM-Based Topology Optimized Heat Sink for Passive Cooling of Electronics

2020 ◽  
Author(s):  
Jin Yao Ho ◽  
Kai Choong Leong
Keyword(s):  
Thermal Performance ◽  
Heat Sink ◽  
Heat Dissipation ◽  
Volume Fraction ◽  
Solid Volume Fraction ◽  
Heat Fluxes ◽  
Heat Sinks ◽  
Base Temperature ◽  
Storage Unit ◽  
Cooling Of Electronics

Abstract A thermal energy storage unit filled with phase change material (PCM) can serve as a heat sink for the cooling of electronics with intermittent or periodic heat dissipation rates. The use of thermal conductive structures (TCS) is an effective method of improving the thermal performance of a PCM-based heat sink. In this paper, topology optimization is explored to develop a new class of TCS with a tree-like structure to enhance the thermal performance of a trapezoidal heat sink. The topology-optimized heat sink was then fabricated by Selective Laser Melting (SLM) using an aluminum alloy, AlSi10Mg, as the base powder. Experiments were performed to evaluate the thermal performance of the topology-optimized heat sink with the tree-like structure. In addition, a conventional longitudinal-fin heat sink of the same solid volume fraction (φ = 16.2%) and a heat sink without enhanced structure were also fabricated and experimentally investigated for comparison. Rubitherm RT-35HC paraffin wax was used as the PCM. Three different heat fluxes of 4.00 kW/m2, 5.08 kW/m2 and 7.24 kW/m2 were applied at the base of each specimen by a silicone rubber heater. The structure wall and the PCM temperatures were measured over time. Our results show that, for all heat rates tested, the topology-optimized heat sink was able to maintain a lower base temperature as compared to the fin-structure and the plain heat sinks. A thermal enhancement ratio (ε) is defined to evaluate the performance of the heat sinks with and without the use of PCM. From the experimental results, the highest ε value of 8.6 was achieved by the topology-optimized heat sink. These results indicate the better performance of the topology-optimized heat sink in dissipating heat as compared to the other specimens.

Experimental Validation and Design Simulations of a Passive Two-Phase Cooling System for Datacenters

2020 ◽  
Author(s):  
Jackson B. Marcinichen ◽  
John R. Thome ◽  
Raffaele L. Amalfi ◽  
Filippo Cataldo
Keyword(s):  
Thermal Performance ◽  
Experimental Validation ◽  
Cooling System ◽  
Electronics Cooling ◽  
Operating Conditions ◽  
Two Phase ◽  
Data Set ◽  
Pressure Drops ◽  
Wide Range ◽  
Important Challenge

Abstract Thermosyphon cooling systems represent the future of datacenter cooling, and electronics cooling in general, as they provide high thermal performance, reliability and energy efficiency, as well as capture the heat at high temperatures suitable for many heat reuse applications. On the other hand, the design of passive two-phase thermosyphons is extremely challenging because of the complex physics involved in the boiling and condensation processes; in particular, the most important challenge is to accurately predict the flow rate in the thermosyphon and thus the thermal performance. This paper presents an experimental validation to assess the predictive capabilities of JJ Cooling Innovation’s thermosyphon simulator against one independent data set that includes a wide range of operating conditions and system sizes, i.e. thermosyphon data for server-level cooling gathered at Nokia Bell Labs. Comparison between test data and simulated results show good agreement, confirming that the simulator accurately predicts heat transfer performance and pressure drops in each individual component of a thermosyphon cooling system (cold plate, riser, evaporator, downcomer (with no fitting parameters), and eventually a liquid accumulator) coupled with operational characteristics and flow regimes. In addition, the simulator is able to design a single loop thermosyphon (e.g. for cooling a single server’s processor), as shown in this study, but also able to model more complex cooling architectures, where many thermosyphons at server-level and rack-level have to operate in parallel (e.g. for cooling an entire server rack). This task will be performed as future work.

CFD Analysis of Flow and Heat Transfer in a Novel Heat Sink for Electronic Devices

2010 ◽  
Author(s):  
Bladimir Ramos-Alvarado ◽  
Peiwen Li ◽  
Hong Liu ◽  
Abel Hernandez-Guerrero
Keyword(s):  
Heat Transfer ◽  
Power Consumption ◽  
Heat Sink ◽  
Electronics Cooling ◽  
Flow Channel ◽  
Heat Sinks ◽  
Temperature Fields ◽  
Pumping Power ◽  
Pressure Losses ◽  
Channel Configuration

Novel flow channel configurations in heat sinks for electronics cooling were proposed in this paper. Computational analyses were carried out to better understand the heat transfer performance, the uniformity of temperature fields of the heat sinking surface, as well as the pressure losses and pumping power in the operation of heat sinks. Comparison of the overall performance regarding to temperature uniformity on the heat sink surface and pumping power consumption was made for heat sinks having novel flow channel configurations and having traditional flow channel configurations. It has been found that the novel flow channel configuration dramatically reduces the pressure loss in the flow field. Giving the same pumping power consumption of an electronics cooling process, the temperature difference on surface of the heat sink which has novel flow channel configuration can be much lower than that of the heat sinks which have traditional flow channel configurations.

Performance Assessment of Single and Multiple Jet Impingement Configurations in a Refrigeration-Based Compact Heat Sink for Electronics Cooling

2017 ◽  
Vol 139 (3) ◽  
Author(s):  
Pablo A. de Oliveira ◽  
Jader R. Barbosa
Keyword(s):  
Heat Transfer ◽  
Heat Sink ◽  
Cooling System ◽  
Electronics Cooling ◽  
Jet Impingement ◽  
Small Scale ◽  
Two Phase ◽  
R 134A ◽  
Steady State Heat Transfer ◽  
Vapor Compression Cooling

The performance of a novel impinging two-phase jet heat sink operating with single and multiple jets is presented and the influence of the following parameters is quantified: (i) thermal load applied on the heat sink and (ii) geometrical arrangement of the orifices (jets). The heat sink is part of a vapor compression cooling system equipped with an R-134a small-scale oil-free linear motor compressor. The evaporator and the expansion device are integrated into a single cooling unit. The expansion device can be a single orifice or an array of orifices responsible for the generation of two-phase jet(s) impinging on a surface where a concentrated heat load is applied. The analysis is based on the thermodynamic performance and steady-state heat transfer parameters associated with the impinging jet(s) for single and multiple orifice tests. The two-phase jet heat sink was capable of dissipating cooling loads of up to 160 W and 200 W from a 6.36 cm2 surface for single and multiple orifice configurations, respectively. For these cases, the temperature of the impingement surface was kept below 40 °C and the average heat transfer coefficient reached values between 14,000 and 16,000 W/(m2 K).

Sign in / Sign up

Export Citation Format

Share Document