Microstructure and mechanical properties of Sn-9Zn-xAl and Sn-9Zn-xCu lead-free solder alloys

AbstractThis study investigates microstructures and mechanical properties of the alloys obtained by adding Cu (0.7 % and 0.9 %) and Al (0.7 % and 0.9 %) to lead-free Sn-9Zn eutectic soldering alloy produced by investment casting method. The results show that Cu5Zn8 phase has formed in the structure of Cu added alloys and the Al2O3 phase has formed due to addition of Al. It was found that small and round-shaped Al2O3 phase increased the tensile strength of the new alloy compared to the eutectic alloy. In addition, it was observed that the microhardness of Cu added alloys was lower than that of Sn-9Zn eutectic alloy, but the microhardness of alloys containing Al was higher compared to the other eutectic Sn-9Zn alloy.

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Nanoindentation Characterization of Lead-free Solders and Intermetallic Compounds under Thermal Aging

International Symposium on Microelectronics ◽

10.4071/isom-2010-tp4-paper5 ◽

2010 ◽

Vol 2010 (1) ◽

pp. 000314-000318

Author(s):

Tong Jiang ◽

Fubin Song ◽

Chaoran Yang ◽

S. W. Ricky Lee

Keyword(s):

Mechanical Properties ◽

Thermal Aging ◽

Solder Joints ◽

Lead Free ◽

Small Range ◽

Lead Free Solder ◽

Solder Alloys ◽

Aging Test ◽

Free Solder ◽

Lead Free Solders

The enforcement of environmental legislation is pushing electronic products to take lead-free solder alloys as the substitute of traditional lead-tin solder alloys. Applications of such alloys require a better understanding of their mechanical behaviors. The mechanical properties of the lead-free solders and IMC layers are affected by the thermal aging. The lead-free solder joints on the pads subject to thermal aging test lead to IMC growth and cause corresponding reliability concerns. In this paper, the mechanical properties of the lead-free solders and IMCs were characterized by nanoindentation. Both the Sn-rich phase and Ag3Sn + β-Sn phase in the lead-free solder joint exhibit strain rate depended and aging soften effect. When lead-free solder joints were subject to thermal aging, Young's modulus of the (Cu, Ni)6Sn5 IMC and Cu6Sn5 IMC changed in very small range. While the hardness value decreased with the increasing of the thermal aging time.

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Influence of Indium and Antimony Additions on Mechanical Properties and Microstructure of Sn-3.0Ag-0.5Cu Lead Free Solder Alloys

Solid State Phenomena ◽

10.4028/www.scientific.net/ssp.266.196 ◽

2017 ◽

Vol 266 ◽

pp. 196-200 ◽

Cited By ~ 2

Author(s):

Suchart Chantaramanee ◽

Phairote Sungkhaphaitoon ◽

Thawatchai Plookphol

Keyword(s):

Mechanical Properties ◽

Grain Size ◽

Vickers Microhardness ◽

Lead Free ◽

Mechanical And Thermal Properties ◽

Lead Free Solder ◽

Solder Alloys ◽

Sac305 Solder ◽

Percent Elongation ◽

Free Solder

In this research, we investigated the influence of indium and antimony additions on the microstructure, mechanical and thermal properties of Sn-3.0Ag-0.5Cu lead free solder alloys. The results revealed that the addition of 0.5 wt.%InSb into SAC305 solder alloys resulted to a reduced melting temperature by 3.8 °C and IMCs phases formed new Ag3(Sn,In) and SnSb in the Sn-rich matrix with a decreased grain size of 28%. These phases improved the mechanical properties of solder alloys. In addition, the mechanical properties of SAC305 solder alloys increased by adding 0.5 wt.%InSb, resulting in an increase of ultimate tensile strength of 24%, but the percent elongation decreased to 45.8%. Furthermore, the Vickers microhardness slightly increased of the SAC305 solder alloys.

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Microstructure and mechanical properties of Sn–Bi, Sn–Ag and Sn–Zn lead-free solder alloys

Journal of Alloys and Compounds ◽

10.1016/j.jallcom.2013.03.234 ◽

2013 ◽

Vol 572 ◽

pp. 97-106 ◽

Cited By ~ 117

Author(s):

Wislei R. Osório ◽

Leandro C. Peixoto ◽

Leonardo R. Garcia ◽

Nathalie Mangelinck-Noël ◽

Amauri Garcia

Keyword(s):

Mechanical Properties ◽

Lead Free ◽

Lead Free Solder ◽

Solder Alloys ◽

Microstructure And Mechanical Properties ◽

Free Solder

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Evaluation of Microstructures and Mechanical Properties of Sn-10Sb-Ni Lead-Free Solder Alloys with Small Amount of Ni Using Miniature Size Specimens

Metals ◽

10.3390/met9121348 ◽

2019 ◽

Vol 9 (12) ◽

pp. 1348

Author(s):

Tatsuya Kobayashi ◽

Ikuo Shohji

Keyword(s):

Mechanical Properties ◽

Lead Free ◽

Fatigue Properties ◽

Strength Increase ◽

Lead Free Solder ◽

Solder Alloys ◽

Power Module ◽

Power Semiconductors ◽

Ni Content ◽

Free Solder

Sn-Sb-Ni solder alloy is expected to be used as a die-attach material for a next-generation power semiconductors in power module. The aim of this paper is to investigate the effects of the Ni content on microstructures, tensile, and fatigue properties of Sn-10Sb-xNi (x = 0.05, 0.10, 0.25, 0.50) (mass%) lead-free solder alloys using miniature size specimens. The Sn-10Sb-Ni solder alloys have the microstructure in which Sb-Sn and Ni-Sb compounds are dispersed in the β-Sn matrix. As the Sb and Ni content increases, Sb-Sn and Ni-Sb compounds are coarsened, respectively. The effect of the Ni content on tensile properties of the alloy is slight at 25 °C. At 150 °C and 200 °C, 0.1% proof stress and tensile strength increase gradually with the Ni content increases, and saturate at the Ni amount over 0.25 mass%. According to the fatigue test at 200 °C, the fatigue properties of Sn-10Sb-Ni with 0.10–0.25 mass% Ni are better than that of the Sn-10Sb. From the experimental results, Sn-10Sb-Ni with 0.10–0.25 mass% Ni have superior mechanical properties.

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Effect of Rare Earths Addition on Mechanical Properties and Wetting Behavior of Sn-2.5Ag-0.7Cu Lead-Free Solder

Advanced Materials Research ◽

10.4028/www.scientific.net/amr.490-495.3119 ◽

2012 ◽

Vol 490-495 ◽

pp. 3119-3123 ◽

Cited By ~ 1

Author(s):

Jie Yang ◽

Ping Sheng Shu ◽

Xiao Le Feng ◽

Xiu Yun Hao ◽

Yu Peng Wang

Keyword(s):

Mechanical Properties ◽

Tensile Strength ◽

Rare Earths ◽

Lead Free ◽

Lead Free Solder ◽

Wetting Behavior ◽

Performance Decline ◽

Optimal Values ◽

Free Solder ◽

Wetting Force

In the present study, the Effect of rare earths on mechanical properties and wetting behavior of Sn-2.5Ag-0.7Cu solder were investigated. Results indicate that the addition of trace rare earths can improve the properties of Sn-Ag-Cu lead-free solder. The elongation and tensile strength and wetting force of solder can reach the optimal values when rare addition is 0.1wt.%. But excessive rare earths can lead to performance decline. The properties change of the Sn-2.5Ag-0.7Cu solder are attributed to the change of the microstructure caused by trace rare earths additions.

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Mechanical properties of Sn–Ag lead-free solder alloys based on the dendritic array and Ag3Sn morphology

Journal of Alloys and Compounds ◽

10.1016/j.jallcom.2013.02.050 ◽

2013 ◽

Vol 562 ◽

pp. 194-204 ◽

Cited By ~ 58

Author(s):

Wislei R. Osório ◽

Daniel R. Leiva ◽

Leandro C. Peixoto ◽

Leonardo R. Garcia ◽

Amauri Garcia

Keyword(s):

Mechanical Properties ◽

Lead Free ◽

Lead Free Solder ◽

Solder Alloys ◽

Dendritic Array ◽

Free Solder

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Microstructural investigations and mechanical properties of pure lead-free (Sn–3.0Ag–0.5Cu and Sn–4.0Ag–0.5Cu) solder alloy

Metallurgical and Materials Engineering ◽

10.30544/344 ◽

2018 ◽

Vol 24 (1) ◽

pp. 27-36 ◽

Cited By ~ 3

Author(s):

Manoj Kumar Pal ◽

Gréta Gergely ◽

Dániel Koncz Horváth ◽

Zoltán Gácsi

Keyword(s):

Mechanical Properties ◽

Hardness Test ◽

Tensile Tests ◽

Optical Microscope ◽

Lead Free ◽

Lead Free Solder ◽

Solder Alloys ◽

Microstructural Investigation ◽

Pure Lead ◽

Free Solder

The Lead-free solders (SAC) with low Ag content have been identified as crucial solder to replace the traditional Sn–Pb solder. The main discussion was presented in two major area of microstructural investigation and mechanical properties of SAC305 and SAC405. Composition and microstructure of SAC solder alloys were investigated by an optical microscope and SEM (Scanning Electron Microscopy). Mechanical properties such as tensile tests and hardness test of the lead-free solder alloys have been tested in this research. Different Ag content and constant Cu content of lead-free solder has been considered in this investigation and compare the mechanical properties of SAC305 and SAC405 solders. From this investigation, tensile strength and hardness have been increased with increased of Ag content.

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