Effect of Rare Earths Addition on Mechanical Properties and Wetting Behavior of Sn-2.5Ag-0.7Cu Lead-Free Solder

2012 ◽  
Vol 490-495 ◽  
pp. 3119-3123 ◽  
Author(s):  
Jie Yang ◽  
Ping Sheng Shu ◽  
Xiao Le Feng ◽  
Xiu Yun Hao ◽  
Yu Peng Wang
Keyword(s):  
Mechanical Properties ◽  
Tensile Strength ◽  
Rare Earths ◽  
Lead Free ◽  
Lead Free Solder ◽  
Wetting Behavior ◽  
Performance Decline ◽  
Optimal Values ◽  
Free Solder ◽  
Wetting Force

In the present study, the Effect of rare earths on mechanical properties and wetting behavior of Sn-2.5Ag-0.7Cu solder were investigated. Results indicate that the addition of trace rare earths can improve the properties of Sn-Ag-Cu lead-free solder. The elongation and tensile strength and wetting force of solder can reach the optimal values when rare addition is 0.1wt.%. But excessive rare earths can lead to performance decline. The properties change of the Sn-2.5Ag-0.7Cu solder are attributed to the change of the microstructure caused by trace rare earths additions.

Effect of Pr on Wettability and Mechanical Property of Sn-0.3Ag-0.7Cu Lead-Free Solder

2015 ◽  
Vol 1120-1121 ◽  
pp. 456-461
Author(s):  
Xiao Le Feng ◽  
Jie Yang
Keyword(s):  
Mechanical Properties ◽  
Mechanical Property ◽  
Shear Stress ◽  
Mass Fraction ◽  
Lead Free ◽  
Lead Free Solder ◽  
Snagcu Solder ◽  
Wetting Time ◽  
Free Solder ◽  
Wetting Force

The wettability of Sn-0.3Ag-0.7Cu-xPr solders on Cu substrate was determined by the wetting balance method， and the mechanical properties of Sn-0.3Ag-0.7Cu-xPr joints were investigated. The result showed that the wetting force of Sn-0.3Ag-0.7Cu-xPr is increased and the wetting time is decreased with the Pr content addition. Good wettability of Sn-Ag-Cu-Pr is obtained with around 0·05%-0·1% (mass fraction) Pr. When measured at 260°C， the wetting force of of SnAgCu solder was increased by 5.0% with 0.1%Pr and the wetting time of SnAgCu solder was descreased by 16.9%.The mechanical properties of soldered joints are enhanced with the addition of Pr， and the soldered joints possess the peak values of shear stress when the Pr addition is about 0.05% in Sn-Ag-Cu-Pr solder joint.

scholarly journals Microstructure and mechanical properties of Sn-9Zn-xAl and Sn-9Zn-xCu lead-free solder alloys

2020 ◽  
Vol 38 (1) ◽  
pp. 34-40
Author(s):  
B. Yavuzer ◽  
D. Özyürek ◽  
T. Tunçay
Keyword(s):  
Mechanical Properties ◽  
Tensile Strength ◽  
Eutectic Alloy ◽  
Investment Casting ◽  
The Other ◽  
Lead Free ◽  
Lead Free Solder ◽  
Solder Alloys ◽  
Casting Method ◽  
Free Solder

AbstractThis study investigates microstructures and mechanical properties of the alloys obtained by adding Cu (0.7 % and 0.9 %) and Al (0.7 % and 0.9 %) to lead-free Sn-9Zn eutectic soldering alloy produced by investment casting method. The results show that Cu5Zn8 phase has formed in the structure of Cu added alloys and the Al2O3 phase has formed due to addition of Al. It was found that small and round-shaped Al2O3 phase increased the tensile strength of the new alloy compared to the eutectic alloy. In addition, it was observed that the microhardness of Cu added alloys was lower than that of Sn-9Zn eutectic alloy, but the microhardness of alloys containing Al was higher compared to the other eutectic Sn-9Zn alloy.

Effect of aluminum content on structure, transport and mechanical properties of Sn-Zn eutectic lead free solder alloy rapidly solidified from melt.

2015 ◽  
Vol 10 (1) ◽  
pp. 2641-2648
Author(s):  
Rizk Mostafa Shalaby ◽  
Mohamed Munther ◽  
Abu-Bakr Al-Bidawi ◽  
Mustafa Kamal
Keyword(s):  
Mechanical Properties ◽  
Melting Point ◽  
Lead Free ◽  
Al Alloy ◽  
Lead Free Solder ◽  
Pronounced Increase ◽  
Mass Unit ◽  
Size Refinement ◽  
Free Solder ◽  
Lead Free Solders

The greatest advantage of Sn-Zn eutectic is its low melting point (198 oC) which is close to the melting point. of Sn-Pb eutectic solder (183 oC), as well as its low price per mass unit compared with Sn-Ag and Sn-Ag-Cu solders. In this paper, the effect of 0.0, 1.0, 2.0, 3.0, 4.0, and 5.0 wt. % Al as ternary additions on melting temperature, microstructure, microhardness and mechanical properties of the Sn-9Zn lead-free solders were investigated. It is shown that the alloying additions of Al at 4 wt. % to the Sn-Zn binary system lead to lower of the melting point to 195.72 ˚C.  From x-ray diffraction analysis, an aluminium phase, designated α-Al is detected for 4 and 5 wt. % Al compositions. The formation of an aluminium phase causes a pronounced increase in the electrical resistivity and microhardness. The ternary Sn-9Zn-2 wt.%Al exhibits micro hardness superior to Sn-9Zn binary alloy. The better Vickers hardness and melting points of the ternary alloy is attributed to solid solution effect, grain size refinement and precipitation of Al and Zn in the Sn matrix.  The Sn-9%Zn-4%Al alloy is a lead-free solder designed for possible drop-in replacement of Pb-Sn solders.  

Nanoindentation Characterization of Lead-free Solders and Intermetallic Compounds under Thermal Aging

2010 ◽  
Vol 2010 (1) ◽  
pp. 000314-000318
Author(s):  
Tong Jiang ◽  
Fubin Song ◽  
Chaoran Yang ◽  
S. W. Ricky Lee
Keyword(s):  
Mechanical Properties ◽  
Thermal Aging ◽  
Solder Joints ◽  
Lead Free ◽  
Small Range ◽  
Lead Free Solder ◽  
Solder Alloys ◽  
Aging Test ◽  
Free Solder ◽  
Lead Free Solders

The enforcement of environmental legislation is pushing electronic products to take lead-free solder alloys as the substitute of traditional lead-tin solder alloys. Applications of such alloys require a better understanding of their mechanical behaviors. The mechanical properties of the lead-free solders and IMC layers are affected by the thermal aging. The lead-free solder joints on the pads subject to thermal aging test lead to IMC growth and cause corresponding reliability concerns. In this paper, the mechanical properties of the lead-free solders and IMCs were characterized by nanoindentation. Both the Sn-rich phase and Ag3Sn + β-Sn phase in the lead-free solder joint exhibit strain rate depended and aging soften effect. When lead-free solder joints were subject to thermal aging, Young's modulus of the (Cu, Ni)6Sn5 IMC and Cu6Sn5 IMC changed in very small range. While the hardness value decreased with the increasing of the thermal aging time.

Effects of Graphene Nanosheets on the Wettability and Mechanical Properties of Sn-0.3Ag-0.7Cu Lead-Free Solder

2020 ◽  
Vol 49 (12) ◽  
pp. 7394-7399
Author(s):  
Limeng Yin ◽  
Zhongwen Zhang ◽  
Zilong Su ◽  
Cunguo Zuo ◽  
Zongxiang Yao ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Graphene Nanosheets ◽  
Lead Free ◽  
Lead Free Solder ◽  
Free Solder

Wetting and interface microstructure between Sn–Zn binary alloys and Cu

1998 ◽  
Vol 13 (10) ◽  
pp. 2859-2865 ◽  
Author(s):  
Katsuaki Suganuma ◽  
Koichi Niihara ◽  
Takeshi Shoutoku ◽  
Yoshikazu Nakamura
Keyword(s):  
Tensile Strength ◽  
Binary Alloys ◽  
Lead Free ◽  
Lead Free Solder ◽  
Interface Microstructure ◽  
Free Solder ◽  
Rigid Interface ◽  
Liquidus Temperatures

Sn–Zn binary alloys have been examined as a lead-free solder. Zn distributes in a Sn matrix as platelets. The hypoeutectic alloys show two endothermic peaks in DTA, which correspond to the eutectic and the liquidus temperatures. Three reaction layers are formed at the Sn–Zn/Cu interface without containing Sn: the thick γ–Cu5Zn8 adjacent to the solder, the thin β′–CuZn in the middle, and the thinnest layer adjacent to Cu. Although many nonwetting regions and voids are formed at the interface because of poor wetting, soldering at 290 °C can form a rigid interface, and tensile strength reaches about 40 MPa.

Effect of Cooling Rate on the Microstructural and Mechanical Properties of Sn-0.3Ag-0.7Cu-0.05Ni Solder Alloy

2017 ◽  
Vol 751 ◽  
pp. 9-13
Author(s):  
Kogaew Inkong ◽  
Phairote Sungkhaphaitoon
Keyword(s):  
Mechanical Properties ◽  
Cooling Rate ◽  
Solder Alloy ◽  
Testing Machine ◽  
Optical Microscope ◽  
Lead Free ◽  
Lead Free Solder ◽  
Cooling Systems ◽  
Lead Free Solder Alloy ◽  
Free Solder

The effect of cooling rate on the microstructural and mechanical properties of Sn-0.3Ag-0.7Cu-0.05Ni lead-free solder alloy was studied. The microstructure of specimens was characterized by using an optical microscope (OM) and an energy dispersive X-ray spectroscopy (EDX). The mechanical properties were performed by using a universal testing machine (UTM). The results showed that the cooling rate of water-cooled specimens was about 2.37 °C/s and the cooling rate of mold-cooled specimens was about 0.05 °C/s. To compare the different cooling rates, it was found that the grain size of water-cooled specimens was finer than that of the mold-cooled specimens, this resulted in an increment of mechanical properties of solder alloy. A higher tensile strength (33.10 MPa) and a higher elongation (34%) were observed when water-cooled and mold-cooled systems were used, respectively. The microstructure of Sn-0.3Ag-0.7Cu-0.05Ni lead-free solder alloy solidified by both cooling systems exhibited three phases: β-Sn, Ag3Sn and (Cu,Ni)6Sn5 IMCs.

Effects of Current Stressing and Isothermal Aging on the Tensile Strength of Microscale Lead-Free Solder Joints with Different Joint Volumes

2013 ◽  
Vol 634-638 ◽  
pp. 2800-2803 ◽  
Author(s):  
Li Meng Yin ◽  
Yan Fei Geng ◽  
Zhang Liang Xu ◽  
Song Wei
Keyword(s):  
Tensile Strength ◽  
Current Density ◽  
Isothermal Aging ◽  
Solder Joints ◽  
High Current Density ◽  
Copper Wire ◽  
Lead Free ◽  
Lead Free Solder ◽  
Current Stressing ◽  
Free Solder

Adopting an accurate micro-tensile method based on dynamic mechanical analyzer (DMA) instrument, the tensile strength of three kinds of copper-wire/solder/copper-wire sandwich structured microscale lead-free solder joints that underwent current stressing with a direct current density of 1.0×104 A/cm2 and loading time of 48 hours were investigated, and compared with those solder joints isothermal aged at 100 0C for 48 hours and as-reflowed condition. These three kinds of microscale columnar solder joints have different volumes, i.e., a same diameter of 300 μm but different heights of 100 μm, 200 μm and 300 μm. Experimental results show that both current stressing and isothermal aging degrades the tensile strength of microscale solder joints, and the solder joint with smaller volume obtains higher tensile strength under same test condition. In addition, current stressing induces obvious electromigration (EM) issue under high current density of 1.0×104 A/cm2, resulting in the decreasing of tensile strength and different fracture position, mode and surface morphology of microscale solder joints. The degree of strength degradation increases with the increasing of joint height when keep joint diameter constant, this is mainly due to that electromigration leads to voids form and grow at the interface of cathode, and solder joints with larger volume may contains more soldering defects as well.

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