Effect of silver and indium addition on mechanical properties and indentation creep behavior of rapidly solidified Bi–Sn based lead-free solder alloys
2013 ◽
Vol 560
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pp. 86-95
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2005 ◽
Vol 16
(4)
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pp. 187-191
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2010 ◽
Vol 2010
(1)
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pp. 000314-000318
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2017 ◽
Vol 266
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pp. 196-200
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2013 ◽
Vol 572
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pp. 97-106
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2013 ◽
Vol 562
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pp. 194-204
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2018 ◽
Vol 24
(1)
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pp. 27-36
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2014 ◽
Vol 582
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pp. 229-235
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