Design of a Dual Latent Heat Sink for Pulsed Electronic Systems

2008 ◽  
Vol 22 (4) ◽  
pp. 572-580 ◽  
Author(s):  
Krishna M. Kota ◽  
Louis C. Chow ◽  
Jianhua Du ◽  
Jayanta S. Kapat ◽  
Quinn Leland ◽  
...  
Keyword(s):  
Latent Heat ◽  
Heat Sink ◽  
Electronic Systems

scholarly journals Cool Steam Method for Desalinating Seawater

Water ◽  
2019 ◽  
Vol 11 (11) ◽  
pp. 2385
Author(s):  
Pedro Arnau ◽  
Naeria Navarro ◽  
Javier Soraluce ◽  
Jose Martínez-Iglesias ◽  
Jorge Illas ◽  
...  
Keyword(s):  
Temperature Gradient ◽  
Heat Source ◽  
Latent Heat ◽  
Heat Sink ◽  
Low Grade ◽  
Heat Sources ◽  
Working Pressure ◽  
Multi Stage ◽  
Heat Of Evaporation ◽  
Low Grade Heat

Cool steam is an innovative distillation technology based on low-temperature thermal distillation (LTTD), which allows obtaining fresh water from non-safe water sources with substantially low energy consumption. LTTD consists of distilling at low temperatures by lowering the working pressure and making the most of low-grade heat sources (either natural or artificial) to evaporate water and then condensate it at a cooler heat sink. To perform the process, an external heat source is needed that provides the latent heat of evaporation and a temperature gradient to maintain the distillation cycle. Depending on the available temperature gradient, several stages can be implemented, leading to a multi-stage device. The cool steam device can thus be single or multi-stage, being raw water fed to every stage from the top and evaporated in contact with the warmer surface within the said stage. Acting as a heat carrier, the water vapor travels to the cooler surface and condensates in contact with it. The latent heat of condensation is then conducted through the conductive wall to the next stage. Net heat flux is then established from the heat source until the heat sink, allowing distilling water inside every parallel stage.

scholarly journals Liquid metal heat sink for laptop computers

2017 ◽  
Author(s):  
◽  
Chengyi Gu
Keyword(s):  
Liquid Metal ◽  
Thermal Management ◽  
Heat Generation ◽  
Heat Sink ◽  
Electronic Systems ◽  
Pump Efficiency ◽  
Liquid Cooling ◽  
Laptop Computer ◽  
Conventional Cooling ◽  
Cooling Loop

With the rapid miniaturization of the electronic systems, heat generation in the components becomes a major concern for thermal management. The high density of heat generation can be a bottleneck to attain higher performance and reliability of computers. Because conventional cooling methods such as finned heat sink are often incapable of providing adequate cooling for sophisticated electronic systems, new systems like heat pipes or liquid cooling systems are being studied. This work focused on the novel design of a liquid metal and heat sink cooling loop targeted for laptop computer thermal management. The liquid metal was driven by an electromechanical pump, offering no moving parts and quiet operation. To better understand the design process, theoretical analysis for fluid flow and heat transfer performance of liquid metal and heat sink are conducted. Furthermore, in order to demonstrate the feasibility of this new concept, a series of experiments on the fabricated module under different heater powers and pump power are performed. A thermal resistance value of 0.53 ?/W was experimentally determined, making the performance similar to competing technologies. Performance was impeded by a low pump efficiency, a known impediment with electromagnetic pumps.

scholarly journals Numerical Analysis of Heat Storage Phenomenon in a Dual Latent Heat Sink

2009 ◽  
Vol 23 (1) ◽  
pp. 148-156 ◽  
Author(s):  
Krishna M. Kota ◽  
Louis C. Chow ◽  
Jianhua Du ◽  
Jayanta S. Kapat ◽  
Quinn H. Leland ◽  
...  
Keyword(s):  
Numerical Analysis ◽  
Latent Heat ◽  
Heat Sink ◽  
Heat Storage

scholarly journals The Effect of Arachidic Acid Mixtures on the Cooling Performance of a Heat Sink

2021 ◽  
Vol 11 (19) ◽  
pp. 9201
Author(s):  
Mohammad Hammoud ◽  
Ibrahim Mjallal ◽  
Hussien Farhat ◽  
Nour Abdallah ◽  
Charbel Habchi ◽  
...  
Keyword(s):  
Latent Heat ◽  
Heat Sink ◽  
Phase Change Materials ◽  
Heat Dissipation ◽  
Electronic Device ◽  
Arachidic Acid ◽  
Heat Of Fusion ◽  
Potassium Oleate ◽  
Sodium Decanoate ◽  
High Latent Heat

The temperature of an electronic device is one of the most important parameters to deal with. Any increase above the temperature limits results in a failure in the device. Thus, to ensure good operation, an electronic device should be cooled. One promising technique is the use of Phase Change Materials (PCMs) for their well-known ability to absorb the heat dissipated by the device, thanks to their high latent heat of fusion. Arachidic acid is a fatty acid that, when mixed with sodium decanoate and potassium oleate salts, can be used as a promising PCM due to its high latent heat. This paper aims to shed light on the use such mixtures of Arachidic acid for cooling in a heat sink. An experimental setup was built for this purpose. The results show that the Arachidic acid mixtures are suitable for applications requiring intermediate heat dissipation.

Mathematical and simulation analysis of natural convection heat transfer for DC–DC converter

2020 ◽  
Vol 234 (20) ◽  
pp. 4136-4146
Author(s):  
Vipan Kumar ◽  
Harry Garg ◽  
Chetandeep Singh ◽  
Sucheta Kandoria ◽  
Vinod Karar
Keyword(s):  
Thermal Management ◽  
Heat Sink ◽  
Heat Dissipation ◽  
Simulation Analysis ◽  
Convection Heat Transfer ◽  
Maximum Temperature ◽  
Electronic Systems ◽  
Optimal Functioning ◽  
Converter Heat ◽  
Safe Operating

Thermal management of electronic systems is the utmost concern to achieve optimum efficiency under space and weight constraints. For the optimal functioning of a system, the heat generated by the electronic components needs to be dissipated efficiently. The passive cooling technique is extensively used in electronic systems, wherein the more contact surface area of a heat source and the surroundings are utilized. This paper focuses on mathematical and simulation analysis for different types of heat sink designs for the 30 W multi-output DC–DC converter. Heat sink with inverted trapezoidal fins has resulted in efficient thermal management of the converter at its safe operating temperature of 398 K. Results show that the maximum temperature attained by the converter was 352 K which was in the safe operating zone of the converter. A comparative study of the effectiveness of heat dissipation with respect to maximum temperature attained has been discussed. Mathematical verification of Rayleigh number for different heat sink designs has also been carried out for its critical value.

Thermal Performance of Two and Three Dimensional Radial Flow Heat Sinks

2009 ◽  
Author(s):  
Ronan Grimes ◽  
Kieran Hanly ◽  
Edmond Walsh
Keyword(s):  
Heat Transfer ◽  
Heat Sink ◽  
Angular Displacement ◽  
Three Dimensional ◽  
Heat Sinks ◽  
Electronic Systems ◽  
Two Dimensional ◽  
Pressure Drops ◽  
Low Profile ◽  
Fin Spacing

Space and power constraints in many contemporary electronic systems place a greater importance than ever on efficient thermal management solutions. This paper investigates the performance and optimisation of air cooled heat sinks suitable for deployment in compact electronic devices. The heat sinks examined have circular footprint, with air flowing from the centre, radially outwards through radially aligned channels. Heat sink height is examined through experiments which were performed on heat sinks with high and low fins, with two and three dimensional flow and heat transfer phenomena respectively. In both cases the effect of angular fin spacing is investigated to determine optimum fin spacing for a range of heat sink pressure drops. Heat transfer correlations from literature which were originally developed for parallel finned heat sinks are compared with the experimental data. The main findings of the paper are that the performance of the high profile two dimensional heat sink is more sensitive to fin angular displacement than low profile three dimensional heat sinks. The parallel fin correlations from literature were found to predict the performance of the three dimensional heat sinks more accurately than the two dimensional heat sinks.

scholarly journals Characterization of a Condenser for a High Performance Multi-Condenser Loop Heat Pipe

2011 ◽  
Author(s):  
Daniel F. Hanks ◽  
Teresa B. Peters ◽  
John G. Brisson ◽  
Evelyn N. Wang
Keyword(s):  
Heat Pipe ◽  
Thermal Management ◽  
Heat Sink ◽  
High Performance ◽  
Electronic Systems ◽  
Loop Heat Pipe ◽  
Particle Sizes ◽  
Vapor Interface ◽  
Liquid Vapor

We experimentally characterized a condenser design for a multi-condenser loop heat pipe (LHP) capable of dissipating 1000 W. The LHP is designed for integration into a high performance air-cooled heat sink to address thermal management challenges in advanced electronic systems. The multi-layer stack of condensers utilizes a sintered wick design to stabilize the liquid-vapor interface and prevent liquid flooding of the lower condenser layers in the presence of a gravitational head. In addition a liquid subcooler is incorporated to suppress vapor flashing in the liquid return line. We fabricated the condensers using photo-chemically etched Monel frames with Monel sintered wicks with particle sizes up to 44 μm. We characterized the performance of the condensers in a custom experimental flow rig that monitors the pressure and temperatures of the vapor and liquid. The condenser dissipated the required heat load with a subcooling of up to 18°C, while maintaining a stable liquid-vapor interface with a capillary pressure of 6.2 kPa. In the future, we will incorporate the condenser into a loop heat pipe for a high performance air-cooled heat sink.

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