scholarly journals Projeto experimental de uma placa de condicionamento de sinal para um sensor de corrente diferencial tipo Bobina de Rogowski

ForScience ◽  
2020 ◽  
Vol 8 (2) ◽  
pp. e00797
Author(s):  
Débora Debiaze de Paula ◽  
Andreyna Sárila Ramos Ferreira ◽  
Paulo Jefferson Dias de Oliveira Evald ◽  
Cláudio Dornelles Mello Júnior ◽  
Rodrigo Zelir Azzolin
Keyword(s):  
Printed Circuit Boards ◽  
Rogowski Coil ◽  
Current Measurement ◽  
Measured Quantity ◽  
Circuit Boards ◽  
Signal Conditioning ◽  
Coil Current ◽  
Experimental Project ◽  
And Control ◽  
Physical Quantities

Realizar a medição de grandezas físicas, tais como corrente e tensão, com precisão é de fundamental importância na área da instrumentação para automação, visto que tais medições geralmente realimentam controladores em malha fechada. De modo geral, os sinais aquisitados são de baixa intensidade. Assim, é indispensável o uso de placas de condicionamento de sinal para converter a grandeza medida em uma forma adequada aos sistemas de processamento de dados e controle. Dessa forma, a principal contribuição deste trabalho é apresentar uma metodologia para elaboração de um sistema de condicionamento de sinais para leitura de corrente, por meio de um sensor do tipo Bobina de Rogowski. Assim, espera-se que, como resultado deste trabalho, qualquer pessoa consiga reproduzir o sistema de medição bem como as placas de circuito impresso apresentadas neste documento para a correta medição de corrente. Além disso, também são apresentados, de forma didática, os passos matemáticos que atendam as especificações do projeto de instrumentação proposto. Palavras-chave: Condicionamento de sinal. Bobina de Rogowski. Medição de corrente. Instrumentação.   Experimental project of a signal conditioning plate for a Rogowski coil differential current sensor Abstract Measurement of physical quantities, such as current and voltage, with precision is of fundamental importance in the area of instrumentation for automation, since such measurements generally feedback closed loop controllers. In general, the signals acquired have low intensity. Thus, it is essential to use signal conditioning plates to convert the measured quantity into a form suitable for data processing and control systems. Thus, the main contribution of this work is to present a methodology for the elaboration of a signal conditioning system for current reading, in a didactic way. It is expected that, as a result of this work, anyone can reproduce the measurement system, as well as the printed circuit boards presented in this document for correct current measurement. In addition, the mathematical steps that meet the specifications of the proposed instrumentation project are also presented in a didactic way. Keywords: Signal conditioning. Rogowski coil. Current measurement. Instrumentation.

scholarly journals Rogowski Coil for Current Measurement in a Cryogenic Environment

2015 ◽  
Vol 15 (2) ◽  
pp. 77-84 ◽  
Author(s):  
Tao Ma ◽  
Shaotao Dai ◽  
Jingye Zhang ◽  
Lianqi Zhao
Keyword(s):  
Output Voltage ◽  
Rogowski Coil ◽  
Measurement Precision ◽  
Current Measurement ◽  
Current Sensor ◽  
Coil Current ◽  
Large Bandwidth ◽  
Current Sharing ◽  
Primary Current ◽  
Better Than

Abstract A Rogowski coil based sensor for current measurement in a cryogenic environment and results of its application for paralleled high temperature superconducting (HTS) coil current sharing are presented. The current sensor consists of a Rogowski coil and an integrator, where the coil output voltage is proportional to the derivative of primary current and the integrator transfers the differentiation to normal state. The Rogowski coil has promising applicability at cryogenic circumstance because its body is made of low temperature materials. The integrator ensures a large bandwidth with feasible magnitude, which is vital for dynamic current measurement during the quench of the HTS coil. The proposed current sensor is used for current sharing measurement of two paralleled Bi2223 HTS coils, and the experimental results show that the measurement precision is better than 0.5%.

Surface Contamination Measurement and Control by Nondestructive Techniques

1985 ◽  
Vol 28 (6) ◽  
pp. 30-32
Author(s):  
Arvind Arora
Keyword(s):  
Electron Emission ◽  
Printed Circuit Boards ◽  
Thickness Measurement ◽  
Circuit Boards ◽  
Limited Data ◽  
Disk Lubricant ◽  
Wafer Processing ◽  
A New Technique ◽  
And Control ◽  
Measurement And Control

This paper presents a new technique to measure thin layer contamination on the surface of a material. The technique uses low wavelength ultraviolet irradiation to generate optically stimulated electron emission, also known as photo electron emission, which can be used to evaluate surface cleanliness or surface chemical state. Limited data is presented to show application of this technique to wafer processing, disk lubricant thickness measurement and quality control of printed circuit boards.

Application of High Temperature Electronics Packaging Technology to Signal Conditioning and Processing Circuits

2010 ◽  
Vol 2010 (HITEC) ◽  
pp. 000089-000096 ◽  
Author(s):  
S T Riches ◽  
K Cannon ◽  
C Johnston ◽  
M Sousa ◽  
P Grant ◽  
...  
Keyword(s):  
High Temperature ◽  
Printed Circuit Boards ◽  
High Pressures ◽  
Electronic Materials ◽  
Silicon On Insulator ◽  
Research Centre ◽  
Circuit Boards ◽  
Signal Conditioning ◽  
Metal Substrates ◽  
High Temperature Electronics

The requirement to install electronic power and control systems in high temperature environments has posed a challenge to the traditional limit of 125°C for high temperature exposure of electronics systems. The leap in operating temperature to above 200°C in combination with high pressures, vibrations and potentially corrosive environments means that different semiconductors, passives, circuit boards and assembly processes will be needed to fulfil the target performance specifications. Bare die mounted onto ceramic and insulated metal substrates can withstand higher temperatures than soldered surface mount devices on printed circuit boards. The results of the evaluation of electronic interconnect and substrate materials that have been submitted to temperatures of 250°C for up to 2000 hours will be presented, including details on novel adhesive formulations and high temperature insulated metal substrates. The materials and processes developed have been applied to the manufacture of high temperature circuits representative of analogue signal conditioning and processing, using silicon on insulator devices and passive components mounted into HTCC packages and onto thick film on ceramic substrates. Results of the characterisation of these devices and circuits at temperatures of 250°C for up to 2000 hours will be presented. This work forms part of the UPTEMP project has been set-up with support from UK Technology Strategy Board and the EPSRC, which started in March 2007 with 3 years duration. The project brings together a consortium of end-users (Sondex Wireline and Vibro-Meter UK), electronic module manufacturers (GE Aviation Systems Newmarket) and material suppliers (Gwent Electronic Materials and Thermastrate Ltd) with Oxford University-Materials Department, the leading UK high temperature electronics research centre.

scholarly journals PCB-Embedded Spiral Pattern Pick-Up Coil Current Sensor for WBG Devices

Energies ◽  
2020 ◽  
Vol 13 (21) ◽  
pp. 5747
Author(s):  
Hwa-Rang Cha ◽  
Kyeong-Mo Kim ◽  
Min-Soo Song ◽  
Rae-Young Kim
Keyword(s):  
Semiconductor Device ◽  
Current Transformer ◽  
Rogowski Coil ◽  
Current Measurement ◽  
Circuit Board ◽  
Current Sensor ◽  
Spiral Pattern ◽  
Measurement Sensitivity ◽  
Coil Current ◽  
Parasitic Inductance

This paper proposes a current sensor for wide bandgap (WBG) devices. The current of a power semiconductor device is mainly measured using a Rogowski coil, an active current transformer, and a coaxial shunt resistor. The Rogowski coil and active current transformer are not suitable for the current measurement of surface mount WBG devices due to their operating principle. The coaxial shunt resistor causes parasitic inductance. Since WBG devices are more sensitive to parasitic inductance than silicon devices, parasitic inductance may affect circuit operation. To overcome these problems, this paper proposes a printed circuit board (PCB)-embedded spiral pattern pick-up coil current measurement for WBG devices. The proposed pick-up coil has high mutual inductance compared to the conventional pick-up coil, so the measurement sensitivity is high. In addition, there is no need for additional processing outside the PCB. Experimental results using a double pulse tester circuit are provided to verify the performance of the proposed current sensor.

A Low Cost Signal Conditioning Module for Mechanical Measurements

2006 ◽  
Author(s):  
David H. Myszka ◽  
Mark A. Patterson ◽  
James E. Globig
Keyword(s):  
Printed Circuit Boards ◽  
Low Voltage ◽  
Low Cost ◽  
Circuit Board ◽  
Circuit Boards ◽  
Signal Conditioning ◽  
Engineering Technology ◽  
Computer Data ◽  
Mechanical Measurements ◽  
And Performance

Mechanical and electronic engineering technology faculty members at the University of Dayton have collaborated on the design of a signal conditioning circuit board for a mechanical measurements laboratory. This board includes amplification and filters necessary to interface a low voltage output from analog sensors with a computer data acquisition system. Printed circuit boards were produced, with easy to understand connections. Multiple units were assembled at a cost of under $20 per board. The price of other commercially available signal conditioning modules is 10 to 20 times that amount. This paper will present the details of the design and performance assessment of the signal conditioning module.

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