Spin-On-Glass (SOG) Contamination Causing Single Via Failure

1997 ◽  
Author(s):  
P. Isakanian ◽  
S. Hunjan
Keyword(s):  
Failure Analysis ◽  
Local Area Networks ◽  
Local Area ◽  
Analysis Procedure ◽  
Assembly Process ◽  
Careful Observation ◽  
Failure Location ◽  
Lengthy Analysis

Abstract Several device failures were experienced after they went through the board assembly process. The failure caused severe transmit pulse attenuation from circuit block called AUI (Attachment Unit Interface). The AUI serves as a medium independent communication port in Local Area Networks. After careful observation and a series of Failure Analysis processes, the malfunction, which caused severe transmit pulse attenuation was attributed to a defective metal 1 to metal 2 via. The via in question is a tie between a pair of cascoded PMOS transistors in the analog section of the chip. These transistors serve as the main biasing leg for the AUI current sink. Since the via in question was bake recoverable at temperatures as low as 175°C for 20 minutes but would show the same failure signature when operated under temperature, the exact failure location was difficult to pinpoint. After a lengthy analysis procedure, the malfunction was attributed to contamination due to Spin On Glass (SOG) outgassing.

Link-Level Simulator for Wireless local Area Network

2018 ◽  
Vol 6 (7) ◽  
pp. 314
Author(s):  
Chaithra. H. U ◽  
Vani H.R
Keyword(s):  
Wireless Local Area Network ◽  
Local Area Network ◽  
Local Area Networks ◽  
Local Area ◽  
Long Term Evolution ◽  
Wireless Local Area Networks ◽  
Area Network ◽  
Network Simulator ◽  
Term Evolution

Now a days in Wireless Local Area Networks (WLANs) used in different fields because its well-suited simulator and higher flexibility. The concept of WLAN  with  advanced 5th Generation technologies, related to a Internet-of-Thing (IOT). In this project, representing the Network Simulator (NS-2) used linked-level simulators for Wireless Local Area Networks and still utilized IEEE 802.11g/n/ac with advanced IEEE 802.11ah/af technology. Realization of the whole Wireless Local Area Networking linked-level simulators inspired by the recognized Vienna Long Term Evolution- simulators. As a outcome, this is achieved to link together that simulator to detailed performances of Wireless Local Area Networking with Long Term Evolution, operated in the similar RF bands. From the advanced 5th Generation support cellular networking, such explore is main because different coexistences scenario can arise linking wireless communicating system to the ISM and UHF bands.

Módulo de Capacitación Básica en Redes LAN para la Fundación Universidad Autónoma de Colombia

2013 ◽  
Vol 9 (16) ◽  
pp. 33-43
Author(s):  
Álvaro Javier Carrillo Hernández ◽  
Joan Katherine Zorovich Gutiérrez ◽  
Javier Enrique Arévalo Peña
Keyword(s):  
Local Area Networks ◽  
Local Area

Este articulo presenta el proceso de desarrollo de un módulo de capacitación en redes de área local (LAN: Local Area Networks), cuyos contenidos son de fácil entendimiento, que es posible tomarlo en un periodo muy corto de tiempo, que no depende directamente de un tutor para poderse realizar y que además tiene incluido un desarrollo práctico para la utilización del Laboratorio de Telemática de Fundación Universidad Autónoma de Colombia. Para poderlo realizar fue necesaria una indagación previa acerca del aprendizaje, la selección un plan temático, realizar la correspondiente recopilación bibliográfica para la creación de un marco teórico que fuese acorde con la teoría del aprendizaje y crear unas prácticas de laboratorio adecuadas que reforzaran el conocimiento adquirido. Como resultado se obtuvo un software didáctico que contiene todo el marco teórico distribuido en temáticas y prácticas de laboratorio que conjugan la parte teórica con la parte práctica.

Localization of a Complex Failure by Combining ATPG and Customer-Oriented Application Testing

2013 ◽  
Author(s):  
Kai Wang ◽  
Rhys Weaver ◽  
David Johnson
Keyword(s):  
Failure Analysis ◽  
Semiconductor Device ◽  
Digital Design ◽  
Radio Communication ◽  
Communication Failure ◽  
Systemic Analysis ◽  
Rf Communication ◽  
System On A Chip ◽  
Electrical Diagnostics ◽  
Failure Location

Abstract A systemic analysis was chosen to evaluate a real case Bluetooth (BT) radio failure in the aspects of RF communication, digital design, firmware, application software, semiconductor device physics and processing, and failure analysis. This paper explores the range of testing, including customer application testing, required to confirm and localize a BT RF communication failure. It shows that the radio communication failure was not, as expected, caused by faulty radio hardware; it was rather linked to problematic encryption hardware at the assistance of the Synergy BT to mobile application. The paper also explores that the digital fault can only be detected by the timing sensitive transition fault scan patterns and how to obtain the physical failure location. Thus, the combination of ATPG and application testing provides a consistency between electrical diagnostics which yields a higher success rate at subsequent physical failure analysis of complex modern RF System on a Chip.

Intermittent Failures in High Pin Count Packaging

2006 ◽  
Author(s):  
Ramesh Varma ◽  
Richard Brooks ◽  
Ronald Twist ◽  
James Arnold ◽  
Cleston Messick
Keyword(s):  
Failure Analysis ◽  
Shape Analysis ◽  
State Of The Art ◽  
Process Variation ◽  
High Reliability ◽  
Temperature Cycling ◽  
Assembly Process ◽  
System Failures ◽  
Industrial Grade ◽  
Corrective Actions

Abstract In a prequalification effort to evaluate the assembly process for the industrial grade high pin count devices for use in a high reliability application, one device exhibited characteristics that, without corrective actions and/or extensive screening, may lead to intermittent system failures and unacceptable reliability. Five methodologies confirmed this conclusion: (1) low post-decapsulation wire pull results; (2) bond shape analysis showed process variation; (3) Failure Analysis (FA) using state of the art equipment determined the root causes and verified the low wire pull results; (4) temperature cycling parts while monitoring, showed intermittent failures, and (5) parts tested from other vendors using the same techniques passed all limits.

Pseudo-Dynamic Fault Isolation Technique Using Backside Emission Microscopy – Case Study, Where All Other Methods Fail

2002 ◽  
Author(s):  
Yoav Weizman ◽  
Ezra Baruch ◽  
Michael Zimin
Keyword(s):  
Failure Analysis ◽  
Process Variations ◽  
Fault Isolation ◽  
Operating Conditions ◽  
Detection Sensitivity ◽  
Isolation Technique ◽  
Root Cause ◽  
Emission Microscopy ◽  
Failure Location ◽  
Noisy Background

Abstract Emission microscopy is usually implemented for static operating conditions of the DUT. Under dynamic operation it is nearly impossible to identify a failure out of the noisy background. In this paper we describe a simple technique that could be used in cases where the temporal location of the failure was identified however the physical location is not known or partially known. The technique was originally introduced to investigate IDDq failures (1) in order to investigate timing related issues with automated tester equipment. Ishii et al (2) improved the technique and coupled an emission microscope to the tester for functional failure analysis of DRAMs and logic LSIs. Using consecutive step-by-step tester halting coupled to a sensitive emission microscope, one is able detect the failure while it occurs. We will describe a failure analysis case in which marginal design and process variations combined to create contention at certain logic states. Since the failure occurred arbitrarily, the use of the traditional LVP, that requires a stable failure, misled the analysts. Furthermore, even if we used advanced tools as PICA, which was actually designed to locate such failures, we believe that there would have been little chance of observing the failure since the failure appeared only below 1.3V where the PICA tool has diminished photon detection sensitivity. For this case the step-by-step halting technique helped to isolate the failure location after a short round of measurements. With the use of logic simulations, the root cause of the failure was clear once the failing gate was known.

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