Missing Metal Pillar Failure Analysis-A Plug Technology Issue

2002 ◽  
Author(s):  
Dat Nguyen ◽  
Tim Campbell ◽  
Steven Whitlock ◽  
Ankineedu Velaga
Keyword(s):  
Failure Analysis ◽  
Chemical Mechanical Polishing ◽  
Significant Contribution ◽  
Process Engineering ◽  
Metal Line ◽  
Cause Analysis ◽  
Yield Analysis ◽  
Root Cause ◽  
Engineering Integration ◽  
Metal Layers

Abstract Smaller technologies and increasing chip functionality has resulted in tightly packed devices and more stacked metal layers. For technologies between 0.25µm and 0.14 µm, stacking packed metal layers required the combination of Tungsten plugs as interconnection and the utilization of Chemical Mechanical Polishing (CMP). “Pillar”, however, is a small metal line, which allows interlevel connections between Tungsten plugs. The size and shape of the pillar can be a yield limiting issue. The process of identification and resolution of the missing metal pillar included yield analysis, electrical and physical failure analysis, root cause analysis and the engineering coordination of photo engineering, etch process engineering, CMP engineering, integration engineering, and inline inspection. Resolving the missing pillar issue has proven to have significant contribution to yield.

Failure Analysis and Process Verification of High-Density Copper ICs Used in Multichip Modules

2017 ◽  
Author(s):  
Jeremy A. Walraven ◽  
Mark W. Jenkins ◽  
Tuyet N. Simmons ◽  
James E. Levy ◽  
Sara E. Jensen ◽  
...  
Keyword(s):  
Integrated Circuits ◽  
Failure Analysis ◽  
Root Cause Analysis ◽  
Multichip Modules ◽  
Cause Analysis ◽  
Process Verification ◽  
Root Cause ◽  
Corrective Actions ◽  
Silicon Vias ◽  
Metal Layers

Abstract Manufacturing of integrated circuits (ICs) using a split foundry process expands design space in IC fabrication by employing unique capabilities of multiple foundries and provides added security for IC designers [1]. Defect localization and root cause analysis is critical to failure identification and implementation of corrective actions. In addition to split-foundry fabrication, the device addressed in this publication is comprised of 8 metal layers, aluminum test pads, and tungsten thru-silicon vias (TSVs) making the circuit area > 68% metal. This manuscript addresses the failure analysis efforts involved in root cause analysis, failure analysis findings, and the corrective actions implemented to eliminate these failure mechanisms from occurring in future product.

Root Cause Analysis for Pin Leakage

2016 ◽  
Author(s):  
Zhigang Song ◽  
Jochonia Nxumalo ◽  
Manuel Villalobos ◽  
Sweta Pendyala
Keyword(s):  
Failure Analysis ◽  
Root Cause Analysis ◽  
Advanced Technology ◽  
Process Step ◽  
Cause Analysis ◽  
Hard Mask ◽  
Technology Node ◽  
Root Cause ◽  
Tools And Techniques

Abstract Pin leakage continues to be on the list of top yield detractors for microelectronics devices. It is simply manifested as elevated current with one pin or several pins during pin continuity test. Although many techniques are capable to globally localize the fault of pin leakage, root cause analysis and identification for it are still very challenging with today’s advanced failure analysis tools and techniques. It is because pin leakage can be caused by any type of defect, at any layer in the device and at any process step. This paper presents a case study to demonstrate how to combine multiple techniques to accurately identify the root cause of a pin leakage issue for a device manufactured using advanced technology node. The root cause was identified as under-etch issue during P+ implantation hard mask opening for ESD protection diode, causing P+ implantation missing, which was responsible for the nearly ohmic type pin leakage.

Strategies to Address Low DPPM Failure Mechanisms on Automotive Grade Wi-Fi Radio Frequency Devices

2015 ◽  
Author(s):  
Kai Wang ◽  
Sadia Lone ◽  
Colin Thomas ◽  
Rhys Weaver
Keyword(s):  
Failure Analysis ◽  
Continuous Improvement ◽  
Failure Mechanisms ◽  
Time Frame ◽  
Cause Analysis ◽  
Automotive Market ◽  
Root Cause ◽  
Rigorous Testing ◽  
Additional Demand

Abstract System suppliers in the automotive market have an expectation that their IC suppliers provide products with low defective parts per million (DPPM) and have methodologies in place to drive towards 0ppm (Zero Parts Per Million). IC suppliers to the automotive market have supply chains and test methodologies in place to achieve such low DPPMs, but the systems suppliers will still require root cause analysis on every failure. The IC supplier is expected to demonstrate a containment, corrective action and continuous improvement in a very tight time frame. This additional demand of automotive customers poses a challenge to the quality of IC devices and the concept of cross departmental failure analysis. In this paper, we look at a complex Wi-Fi design with multiple IEEE specific radios, and how to address the few parts that escape the rigorous testing by IC supplier to improve the quality for the automotive IC.

Magnetic Head Shorting Failure Analysis

2017 ◽  
Author(s):  
Liang Hong ◽  
Jia Li ◽  
Haifeng Wang
Keyword(s):  
Electron Microscopy ◽  
Failure Analysis ◽  
Focused Ion Beam ◽  
Ion Beam ◽  
Tem Analysis ◽  
Resistance Change ◽  
Root Cause ◽  
Transmission Electron ◽  
Root Cause Failure Analysis ◽  
Metal Layers

Abstract This paper provides an innovative root cause failure analysis method that combines multiple failure analysis (FA) techniques to narrow down and expose the shorting location and allow the material analysis of the shorting defect. It begins with a basic electrical testing to narrow down shorting metal layers, then utilizing mechanical lapping to expose over coat layers. This is followed by optical beam induced resistance change imaging to further narrow down the shorting location. Scanning electron microscopy and optical imaging are used together with focused ion beam milling to slice and view through the potential shorting area until the shorting defect is exposed. Finally, transmission electron microscopy (TEM) sample is prepared, and TEM analysis is carried out to pin point the root cause of the shorting. This method has been demonstrated successfully on Western Digital inter-metal layers shorting FA.

Tri-Directional TEM Failure Analysis on Sample Prepared by In-Situ Lift-Out FIB and Flipstage

2014 ◽  
Author(s):  
Jie Zhu ◽  
An Yan Du ◽  
Bing Hai Liu ◽  
Eddie Er ◽  
Si Ping Zhao ◽  
...  
Keyword(s):  
Sample Preparation ◽  
Failure Analysis ◽  
Cross Section ◽  
Root Cause Analysis ◽  
Wafer Surface ◽  
Tem Analysis ◽  
Cause Analysis ◽  
Root Cause

Abstract In this paper, we report an advanced sample preparation methodology using in-situ lift-out FIB and Flipstage for tridirectional TEM failure analysis. A planar-view and two cross-section TEM samples were prepared from the same target. Firstly, a planar-view lamellar parallel to the wafer surface was prepared using in-situ lift-out FIB milling. Upon TEM analysis, the planar sample was further milled in the along-gate and cross-gate directions separately. Eventually, a pillar-like sample containing a single transistor gate was obtained. Using this technique, we are able to analyze the defect from three perpendicular directions and obtain more information on the defect for failure root-cause analysis. A MOSFETs case study is described to demonstrate the procedure and advantages of this technique.

Challenges of System Level Failure Analysis of Electronics in the Automotive Industry

2017 ◽  
Author(s):  
Bence Hevesi
Keyword(s):  
Failure Analysis ◽  
Case Studies ◽  
Automotive Industry ◽  
Root Cause Analysis ◽  
Fault Isolation ◽  
System Level ◽  
Cause Analysis ◽  
Root Cause ◽  
Analysis Workflow

Abstract In this paper, different failure analysis (FA) workflows are showed which combines different FA approaches for fast and efficient fault isolation and root cause analysis in system level products. Two case studies will be presented to show the importance of a well-adjusted failure analysis workflow.

Failures in Soldering

2021 ◽  
pp. 326-337
Author(s):  
Qiming Zhang ◽  
Babak Kondori ◽  
Xing Qiu ◽  
Jeffry C.C. Lo ◽  
S.W. Ricky Lee
Keyword(s):  
Solder Joint ◽  
Failure Analysis ◽  
Manufacturing Process ◽  
Failure Modes ◽  
Solder Joints ◽  
Failure Detection ◽  
Cause Analysis ◽  
Root Cause ◽  
Integration Density ◽  
Root Cause Failure Analysis

Abstract Due to the recent requirement of higher integration density, solder joints are getting smaller in electronic product assemblies, which makes the joints more vulnerable to failure. Thus, the root-cause failure analysis for the solder joints becomes important to prevent failure at the assembly level. This article covers the properties of solder alloys and the corresponding intermetallic compounds. It includes the dominant failure modes introduced during the solder joint manufacturing process and in field-use applications. The corresponding failure mechanism and root-cause analysis are also presented. The article introduces several frequently used methods for solder joint failure detection, prevention, and isolation (identification for the failed location).

Words for the “Whys”

2012 ◽  
Author(s):  
Richard J. Ross
Keyword(s):  
Human Brain ◽  
Failure Analysis ◽  
State Of The Art ◽  
Intellectual Curiosity ◽  
Basic Tool ◽  
Cause Analysis ◽  
Root Cause ◽  
Analysis Process ◽  
Tools And Techniques ◽  
Attention To Detail

Abstract In an era where the complexity and cost of Failure Analysis tools and techniques is rapidly expanding, it is easy sometimes to lose sight of the basic tool and technique required for successful root-cause analysis. That technique is intellectual curiosity and the tool is the human brain. This paper will describe a simple methodology to insure that this tool and technique are properly engaged either concomitant with or in the absence of state-of-the-art instrumentation and computation. Two simple case studies will be used to illustrate where the Failure Analysis process can easily go awry without proper attention to detail, and, conversely, from too much attention to detail.

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