Failure Analysis of Electrothermal Actuators Subjected to Electrical Overstress (EOS) and Electrostatic Discharge (ESD)

2004 ◽  
Author(s):  
Jeremy A. Walraven ◽  
Richard Plass ◽  
Michael S. Baker ◽  
Michael J. Shaw
Keyword(s):  
Electric Fields ◽  
Microelectromechanical Systems ◽  
Electrostatic Discharge ◽  
Industrial Applications ◽  
System Level ◽  
Electrothermal Actuators ◽  
Thermal Actuation ◽  
Mems Technology ◽  
Electrical Overstress ◽  
Current Transients

Abstract Microelectromechanical systems (MEMS) that sense, think, and act are enabling technologies currently employed in many industrial applications. To operate these devices, a stimulus is required to produce motion. In MEMS, this stimulus may be thermal actuation using current to produce joule heating, or electrostatic actuation using voltages to create electric fields. To qualify MEMS technology, these devices must undergo repeated characterization and testing and at both the die and system level. Electrical overstress (EOS) and electrostatic discharge (ESD) are two important tests used to assess the robustness of a device to steady state and sharp voltage and current transients. Identifying the failure mechanism and understanding the root causes for failure is paramount to the overall improvement and success of any MEMS based system. In this paper we will focus on the effects of EOS and ESD events on surface micromachined polysilicon based electrothermal actuators fabricated using the SUMMiT V™ process.

EOS (Electrical Overstress) – The Old, Unknown Phenomenon?

2012 ◽  
Author(s):  
Peter Jacob
Keyword(s):  
Electrostatic Discharge ◽  
Failure Mechanisms ◽  
System Level ◽  
Device Failure ◽  
Electrical Overstress ◽  
Dominant Root

Abstract Frequently, Electrical Overstress (EOS) is understood in a similar context like Electrostatic Discharge (ESD). However, when looking deeper, only 3-5% of EOS failure signatures are caused by ESD. The dominant root causes can be found on system level – often inaccessible for the device failure analyst. However, switching procedures and sometimes-hidden inductance loads are the unconsidered and undiscovered problem makers. This paper reviews and highlights these failure mechanisms.

A Methodology for Characterizing System-Level ESD Sensitivity

2004 ◽  
Author(s):  
Marie-Pascale Chagny ◽  
John A. Naoum
Keyword(s):  
Electrostatic Discharge ◽  
Computer Systems ◽  
Electronic Equipment ◽  
Experimental Methodology ◽  
Computer Users ◽  
System Level ◽  
Permanent Damage ◽  
Design Improvement ◽  
Desktop Computers

Abstract Over the years, failures induced by an electrostatic discharge (ESD) have become a major concern for semiconductor manufacturers and electronic equipment makers. The ESD events that cause destructive failures have been studied extensively [1, 2]. However, not all ESD events cause permanent damage. Some events lead to recoverable failures that disrupt system functionality only temporarily (e.g. reboot, lockup, and loss of data). These recoverable failures are not as well understood as the ones causing permanent damage and tend to be ignored in the ESD literature [3, 4]. This paper analyzes and characterizes how these recoverable failures affect computer systems. An experimental methodology is developed to characterize the sensitivity of motherboards to ESD by simulating the systemlevel ESD events induced by computer users. The manuscript presents a case study where this methodology was used to evaluate the robustness of desktop computers to ESD. The method helped isolate several weak nets contributing to the failures and identified a design improvement. The result was that the robustness of the systems improved by a factor of 2.

Novel die-sinking micro-electro discharge machining process using microelectromechanical systems technology

2006 ◽  
Vol 220 (9) ◽  
pp. 1481-1487 ◽  
Author(s):  
J-B Li ◽  
K Jiang ◽  
G J Davies
Keyword(s):  
Microelectromechanical Systems ◽  
Machining Process ◽  
Metallic Surface ◽  
Manufacturing Cost ◽  
Sem Images ◽  
Deep Reactive Ion Etching ◽  
Electro Discharge Machining ◽  
Mems Technology ◽  
Fabrication Condition ◽  
Edm Process

A novel die-sinking micro-electro discharge machining (EDM) process is presented for volume fabrication of metallic microcomponents. In the process, a high-precision silicon electrode is fabricated using deep reactive ion etching (DRIE) process of microelectromechanical systems (MEMS) technology and then coated with a thin layer of copper to increase the conductivity. The metalized Si electrode is used in the EDM process to manufacture metallic microcomponents by imprinting the electrode onto a flat metallic surface. The two main advantages of this process are that it enables the fabrication of metallic microdevices and reduces manufacturing cost and time. The development of the new EDM process is described. A silicon component was produced using the Surface Technology Systems plasma etcher and the DRIE process. Such components can be manufactured with a precision in nanometres. The minimum feature of the component is 50 μm. In the experiments, the Si component was coated with copper and then used as the electrode on an EDM machine of 1 μm resolution. In the manufacturing process, 130 V and 0.2 A currents were used for a period of 5 min. The SEM images of the resulting device show clear etched areas, and the electric discharge wave chart indicates a good fabrication condition. The experimental results have been analysed and the new micro-EDM process is found to be able to fabricate 25 μm features.

New Hybrid Methodology for the Development of MEMS Multivariable Sensors

2001 ◽  
Author(s):  
Emily J. Pryputniewicz ◽  
John P. Angelosanto ◽  
Gordon C. Brown ◽  
Cosme Furlong ◽  
Ryszard J. Pryputniewicz
Keyword(s):  
Process Control ◽  
Microelectromechanical Systems ◽  
Absolute Pressure ◽  
Single Chip ◽  
Specific Test ◽  
Mems Sensor ◽  
Test Conditions ◽  
Mems Technology ◽  
Functional Operation ◽  
Hybrid Methodology

Abstract Using recent advances in microelectromechanical systems (MEMS) technology, a new multivariable sensor was developed. This MEMS sensor, capable of measuring temperature, absolute pressure, and differential pressure on a single chip, is particularly suitable for applications in process control industry. However, functional operation of the sensor depends on validation of its performance under specific test conditions. We have developed a hybrid methodology, based on analysis and measurements, that allows such validation. In this paper, the MEMS multivariable sensor is described, the hybrid methodology is outlined, and its use is illustrated with representative results.

RF-MEMS Components and Networks for High-Performance Reconfigurable Telecommunication and Wireless Systems

2012 ◽  
Vol 81 ◽  
pp. 65-74 ◽  
Author(s):  
Jacopo Iannacci ◽  
Giuseppe Resta ◽  
Paola Farinelli ◽  
Roberto Sorrentino
Keyword(s):  
High Performance ◽  
Microelectromechanical Systems ◽  
Rf Mems ◽  
Low Cost ◽  
Impedance Matching ◽  
Phase Shifters ◽  
Rf Systems ◽  
Mems Technology ◽  
And Performance ◽  
Rf Performance

MEMS (MicroElectroMechanical-Systems) technology applied to the field of Radio Frequency systems (i.e. RF-MEMS) has emerged in the last 10-15 years as a valuable and viable solution to manufacture low-cost and very high-performance passive components, like variable capacitors, inductors and micro-relays, as well as complex networks, like tunable filters, reconfigurable impedance matching networks and phase shifters, and so on. The availability of such components and their integration within RF systems (e.g. radio transceivers, radars, satellites, etc.) enables boosting the characteristics and performance of telecommunication systems, addressing for instance a significant increase of their reconfigurability. The benefits resulting from the employment of RF-MEMS technology are paramount, being some of them the reduction of hardware redundancy and power consumption, along with the operability of the same RF system according to multiple standards. After framing more in detail the whole context of RF MEMS technology, this paper will provide a brief introduction on a typical RF-MEMS technology platform. Subsequently, some relevant examples of lumped RF MEMS passive elements and complex reconfigurable networks will be reported along with their measured RF performance and characteristics.

scholarly journals Towards a biomimetic gyroscope inspired by the fly's haltere using microelectromechanical systems technology

2014 ◽  
Vol 11 (99) ◽  
pp. 20140573 ◽  
Author(s):  
H. Droogendijk ◽  
R. A. Brookhuis ◽  
M. J. de Boer ◽  
R. G. P. Sanders ◽  
G. J. M. Krijnen
Keyword(s):  
Microelectromechanical Systems ◽  
Damping Ratio ◽  
Fast Response ◽  
Gyroscopic System ◽  
Drive Mode ◽  
Mems Gyroscope ◽  
Coriolis Forces ◽  
Mems Technology ◽  
Large Measurement ◽  
Theoretical Performance

Flies use so-called halteres to sense body rotation based on Coriolis forces for supporting equilibrium reflexes. Inspired by these halteres, a biomimetic gimbal-suspended gyroscope has been developed using microelectromechanical systems (MEMS) technology. Design rules for this type of gyroscope are derived, in which the haltere-inspired MEMS gyroscope is geared towards a large measurement bandwidth and a fast response, rather than towards a high responsivity. Measurements for the biomimetic gyroscope indicate a (drive mode) resonance frequency of about 550 Hz and a damping ratio of 0.9. Further, the theoretical performance of the fly's gyroscopic system and the developed MEMS haltere-based gyroscope is assessed and the potential of this MEMS gyroscope is discussed.

System Design and Modeling of a Thermally Activated Reconfigurable Wing

2010 ◽  
Author(s):  
Richard Beblo ◽  
Darrel Robertson ◽  
James Joo ◽  
Brian Smyers ◽  
Gregory Reich
Keyword(s):  
Thermal Energy ◽  
High Speed ◽  
Frictional Heating ◽  
Mechanical Analysis ◽  
Design Tool ◽  
System Level ◽  
Morphing Aircraft ◽  
Thermal Actuation ◽  
Short Period ◽  
Reconfigurable Structures

Reconfigurable structures such as morphing aircraft generally require an on board energy source to function. Frictional heating during the high speed deployment of a blunt nosed low speed reconnaissance air vehicle can provide a large amount of thermal energy during a short period of time. This thermal energy can be collected, transferred, and utilized to reconfigure the deployable aircraft. Direct utilization of thermal energy has the ability to significantly decrease or eliminate the losses associated with converting thermal energy to other forms, such as electric. The following work attempts to describe possible system designs and components that can be utilized to transfer the thermal energy harvested at the nose of the aircraft during deployment to internal components for direct thermal actuation of a reconfigurable wing structure. A model of a loop heat pipe is presented and used to predict the time dependant transfer of energy. Previously reported thermal profiles of the nose of the aircraft calculated based on trajectory and mechanical analysis of the actuation mechanism are reviewed and combined with the model of the thermal transport system providing a system level feasibility investigation and design tool. The efficiency, implementation, benefits, and limitations of the direct use thermal system are discussed and compared with currently utilized systems.

Sign in / Sign up

Export Citation Format

Share Document