Soft Defect Localization Techniques without a Synchronization Signal to the Laser Scanning Module

2005 ◽  
Author(s):  
Diana M. Mitro ◽  
Dawn Glaeser ◽  
Clifford Howard
Keyword(s):  
Liquid Crystal ◽  
Hot Spots ◽  
Laser Scanning ◽  
Threshold Temperature ◽  
Support Design ◽  
Analysis Technique ◽  
Defect Localization ◽  
Localized Heating ◽  
Synchronization Signal ◽  
Race Conditions

Abstract Soft Defect Localization (SDL) is an analysis technique where changes in the pass/fail condition of a test are monitored while a laser is scanned across a die.[1,2,3,4] The technique has proven its usefulness for quickly locating failing nodes for functional fails that are temperature, frequency, and/or voltage dependant. The localized heating from the laser can toggle the pass/fail condition as it sweeps over failing nodes with the aforementioned sensitivity. The technique is instrumental in identifying latent defect locations on conditional fails even though they seldom produce light emissions or liquid crystal hot spots. These fails often manifest themselves after reliability stress or at the customer. The technique can also be applied to support design groups with first silicon analysis of timing race conditions and identification of signals that are speed path limiters. The main challenges associated with the technique are in synchronizing the tester with the Laser Scanning Module (LSM) and ensuring the laser can heat the device enough to overcome the pass/fail threshold temperature of the failing node.

Low Temperature Fault Isolation Using Soft Defect Localization

2012 ◽  
Author(s):  
Kristopher D. Staller
Keyword(s):  
Low Temperatures ◽  
Laser Scanning ◽  
Low Cost ◽  
Fault Isolation ◽  
Laser Scanning Microscopy ◽  
Cold Temperature ◽  
Multiple Point ◽  
Defect Localization ◽  
Low Levels

Abstract Cold temperature failures are often difficult to resolve, especially those at extreme low levels (< -40°C). Momentary application of chill spray can confirm the failure mode, but is impractical during photoemission microscopy (PEM), laser scanning microscopy (LSM), and multiple point microprobing. This paper will examine relatively low-cost cold temperature systems that can hold samples at steady state extreme low temperatures and describe a case study where a cold temperature stage was combined with LSM soft defect localization (SDL) to rapidly identify the cause of a complex cold temperature failure mechanism.

Test Circuit Conditioning for Soft Defect Localization

2014 ◽  
Author(s):  
Kristopher D. Staller ◽  
Corey Goodrich
Keyword(s):  
Laser Beam ◽  
Failure Analysis ◽  
Signal Frequency ◽  
Dynamic Failure ◽  
The Third ◽  
Analysis Technique ◽  
Test Circuit ◽  
Defect Localization ◽  
Manual Input ◽  
Fast Dynamic

Abstract Soft Defect Localization (SDL) is a dynamic laser-based failure analysis technique that can detect circuit upsets (or cause a malfunctioning circuit to recover) by generation of localized heat or photons from a rastered laser beam. SDL is the third and seldom used method on the LSM tool. Most failure analysis LSM sessions use the endo-thermic mode (TIVA, XIVA, OBIRCH), followed by the photo-injection mode (LIVA) to isolate most of their failures. SDL is seldom used or attempted, unless there is a unique and obvious failure mode that can benefit from the application. Many failure analysts, with a creative approach to the analysis, can employ SDL. They will benefit by rapidly finding the location of the failure mechanism and forgoing weeks of nodal probing and isolation. This paper will cover circuit signal conditioning to allow for fast dynamic failure isolation using an LSM for laser stimulation. Discussions of several cases will demonstrate how the laser can be employed for triggering across a pass/fail boundary as defined by voltage levels, supply currents, signal frequency, or digital flags. A technique for manual input of the LSM trigger is also discussed.

A technique in confocal laser microscopy for establishing biofilm coverage and thickness

1997 ◽  
Vol 36 (10) ◽  
pp. 117-124 ◽  
Author(s):  
G. Silyn-Roberts ◽  
G. Lewis
Keyword(s):  
Laser Scanning ◽  
Sewage Treatment ◽  
Laser Scanning Microscopy ◽  
Confocal Laser ◽  
Rock Surface ◽  
Optical Sectioning ◽  
Image Analysis Technique ◽  
Rock Types ◽  
Analysis Technique ◽  
Biofilm Quantification

This study uses confocal laser scanning microscopy to determine the coverage and thickness of biofilms on rock types commonly used in wetland sewage treatment systems in New Zealand. Samples of scoria, greywacke and slag - with glass used as a comparison - were submerged in subsurface flow wetlands and examined after six weeks. An image analysis technique was used to quantitatively determine the coverage and thickness of each biofilm. The technique consisted of the biofilm quantification of each individual image obtained from the confocal optical sectioning. The results indicated that the biofilm coverage for the substrata types did not exceed 25%. However, there was a marked difference between the biofilm structures grown on the different substrata; that on glass formed thin spindly structures, and slag and scoria showed similar dense patches interspersed with open channel structures that followed the contours of the pocketed rock surface.

Delay Compensation for Synchronization Signal in Rotating Laser-Scanning Measurement System

2021 ◽  
Vol 58 (3) ◽  
pp. 0312002-312002171
Author(s):  
郭同闯 Guo Tongchuang ◽  
任永杰 Ren Yongjie ◽  
林嘉睿 Lin Jiarui ◽  
金云超 Jin Yunchao ◽  
张振宇 Zhang Zhenyu
Keyword(s):  
Measurement System ◽  
Laser Scanning ◽  
Delay Compensation ◽  
Synchronization Signal

Application of Dynamic Masking on Rapid Prototyping

2008 ◽  
Vol 594 ◽  
pp. 261-272
Author(s):  
Chien Nan Chen ◽  
Sheng Jye Hwang ◽  
Huei Huang Lee ◽  
Durn Yuan Huang
Keyword(s):  
Material Processing ◽  
Liquid Crystal ◽  
Rapid Prototyping ◽  
Visible Light ◽  
Laser Scanning ◽  
Uv Light ◽  
Liquid Crystal Display ◽  
Digital Light Processing ◽  
Uv Curable ◽  
Main Components

In rapid prototyping (RP) technologies, curing of UV-curable photopolymers is mainly achieved by the application of laser scanning with limited fabrication speed. The dynamic masking approach can improve the fabrication speed; however, current researches and available systems cure photopolymers with visible light rather than UV light. In this research, we have attempted to develop a UV dynamic masking RP system by implementing digital micro-mirror device (DMD) from digital light processing (DLP) technology and TFT liquid crystal display (LCD) panel. A DLP projector was disassembled and the main components were then recombined to form a dynamic mask generator. Thus, this study has shown the feasibility of obtaining a UV dynamic masking RP system that may be integrated for a UV-curable material processing.

Liquid-crystal thermography of hot spots on electronic components

2007 ◽  
Vol 36 (6) ◽  
pp. 392-401 ◽  
Author(s):  
V. M. Popov ◽  
A. S. Klimenko ◽  
A. P. Pokanevich ◽  
I. I. Gavrilyuk ◽  
N. V. Moshel’
Keyword(s):  
Liquid Crystal ◽  
Hot Spots ◽  
Electronic Components ◽  
Liquid Crystal Thermography

Hot Spots from Dislocation Pile-up Avalanches

2005 ◽  
Vol 896 ◽  
Author(s):  
William Grisé
Keyword(s):  
Hot Spots ◽  
Hot Spot ◽  
Energetic Material ◽  
Shear Banding ◽  
Dislocation Dynamics ◽  
Circular Loop ◽  
Dislocation Mechanics ◽  
Pile Up ◽  
Localized Heating ◽  
Realistic Assessment

AbstractThe model of localized adiabatic heating associated with release of a dislocation pile-up avalanche is described and re-evaluated. The model supplies a fundamental explanation of shear banding behavior in metal and non-metal systems. Now, a dislocation dynamics description is provided for more realistic assessment of the hot spot heating, for both straight dislocation pile-ups and circular loop pile-ups. Such a localized heating effect was overestimated in the earlier work, in part, to show the dramatic enhancement of the work rate, and the corresponding temperature build-up, potentially occurring in the initial pile-up release, say, at achievement of the critical dislocation mechanics-based stress intensity for cleavage. Proposed applications are to potentially brittle metal, ionic, and energetic material systems.

scholarly journals Using terrestrial laser scanning in inventorying of a hybrid constructed wetland system

2017 ◽  
Vol 76 (10) ◽  
pp. 2664-2671
Author(s):  
Radomir Obroślak ◽  
Andrzej Mazur ◽  
Krzysztof Jóźwiakowski ◽  
Oleksandr Dorozhynskyy ◽  
Antoni Grzywna ◽  
...  
Keyword(s):  
Constructed Wetland ◽  
Hot Spots ◽  
National Park ◽  
Laser Scanning ◽  
Treatment Plant ◽  
Terrestrial Laser Scanning ◽  
Technical Documentation ◽  
Education Centre ◽  
Quantitative Changes

Abstract The goal of this paper was to evaluate the possibility of using terrestrial laser scanning (TLS) for inventorying of a hybrid constructed wetland (CW) wastewater treatment plant. The object under study was a turtle-shaped system built in 2015 in Eastern Poland. Its main purpose is the treatment of wastewater from the Museum and Education Centre of Polesie National Park. The study showed that the CW system had been built in compliance with the technical documentation, as differences between values obtained from the object and those given in the design project (max. ± 20 cm for situation and ±5 cm for elevation) were within the range defined by the legislator. It was also shown that the results were sufficiently precise to be used for as-built surveying of the aboveground elements of the CW system. The TLS technique can also be employed to analyse quantitative changes in object geometry arising during long-term use (e.g. landmass slides or erosion), the identification of which can help in selecting the hot-spots at risk of damage and thus restore the object to its original state as well as prevent new changes.

Layout Based Full Chip Thermal Simulations of Stacked 3D Integrated Circuits

2003 ◽  
Author(s):  
Ashok Raman ◽  
Marek Turowski ◽  
Monte Mar
Keyword(s):  
Integrated Circuits ◽  
Integrated Circuit ◽  
Hot Spots ◽  
Heat Dissipation ◽  
Three Dimensional ◽  
3D Ic ◽  
Localized Heating ◽  
3D Integrated Circuits ◽  
Thermal Simulations

This paper presents full-chip scale detailed thermal simulations of three-dimensional (3D) integrated circuit (IC) stacks. The inter-layer dielectric (ILD) and inter-metal dielectric (IMD) materials inside 3D IC stacks may cause extensive localized heating. The influence of multiple layers of dielectrics on heat trapping inside the 3D stack is analyzed. Different methods to minimize such localized heating are studied. It is shown that the use of thermal vias is very effective in heat dissipation from the hot spots. Comparisons are made between several 3D IC configurations to verify these conclusions.

Sign in / Sign up

Export Citation Format

Share Document