Effect of Aging Temperature on the Intermetallic Compound (IMC) Formation of Sn-0.7Cu/Si3N4 Composite Solder

2013 ◽  
Vol 795 ◽  
pp. 522-525 ◽  
Author(s):  
S.I. Najib ◽  
Mohd Arif Anuar Mohd Salleh ◽  
Saud Norainiza
Keyword(s):  
Intermetallic Compound ◽  
Aging Temperature ◽  
Electronic Packaging ◽  
Isothermal Aging ◽  
Aging Process ◽  
Composite Solder ◽  
Intermetallic Formation ◽  
Imcs Growth ◽  
Packaging Industry ◽  
Growth Formation

Nowadays, excessive growth intermetallic formation becomes the major issue in electronic packaging industry. The investigation on the effect of aging temperature to the intermetallic compound (IMCs) growth formation for Sn-0.7Cu/1.0-Si3N4 was studied. Isothermal aging process was carried out for 24 hours, with 5 difference aging temperature from 50°C up to 150°C. It is found that the Cu-Sn IMCs which appear after reflowed process, has grew rapidly when aging temperature was increased up to 125°C and started to reduced after 150°C aging temperature.

Effect of Aging Time towards Intermetallic Compound (IMC) Growth Kinetics Formation for Sn-0.7Cu-Si3N4 Composite Solder on Copper Substrate

2013 ◽  
Vol 795 ◽  
pp. 505-508 ◽  
Author(s):  
S.I. Najib ◽  
Mohd Arif Anuar Mohd Salleh ◽  
Saud Norainiza
Keyword(s):  
Diffusion Coefficient ◽  
Intermetallic Compound ◽  
Aging Time ◽  
Growth Kinetics ◽  
Aging Temperature ◽  
Composite Solder ◽  
Copper Substrate ◽  
Intermetallic Growth ◽  
Reliability Of Solder Joints ◽  
Electronic Assemblies

The effect of excessive intermetallic growth to the reliability of solder joints become major problem in electronic assemblies industry. In this investigation, we used Sn-0.7Cu/1.0-Si3N4 composite solder to analyze its interfacial joint on Cu substrate. Various isothermal of aging times were carried in this study by using 24hrs, 240hrs, 480hrs, 600hrs and 720hrs at 150°C of aging temperature. The Cu-Sn IMC thickness was increase with increasing aging time and the diffusion coefficient of this composite solder is 1.16x10-16m2/s.

Isothermal Aging Affect to the Growth of Sn-Cu-Ni-1 wt.% TiO2 Composite Solder Paste

2016 ◽  
Vol 700 ◽  
pp. 123-131 ◽  
Author(s):  
Rita Mohd Said ◽  
Mohd Arif Anuar Mohd Salleh ◽  
Mohd Nazree Derman ◽  
Mohd Izrul Izwan Ramli ◽  
Norhayanti Mohd Nasir ◽  
...  
Keyword(s):  
Intermetallic Compound ◽  
Solder Joint ◽  
Aging Time ◽  
Isothermal Aging ◽  
Composite Solder ◽  
Solder Paste ◽  
Cu Substrate ◽  
Interfacial Imcs ◽  
Planar Shape ◽  
Interfacial Intermetallic Compound

This work investigated the effects of 1.0 wt. % TiO2 particles addition into Sn-Cu-Ni solder paste to the growth of the interfacial intermetallic compound (IMC) on Cu substrate after isothermal aging. Sn-Cu-Ni solder paste with TiO2 particles were mechanically mixed to fabricate the composite solder paste. The composite solder paste then reflowed in the reflow oven to form solder joint. The reflowed samples were then isothermally aged 75, 125 and 150 ° C for 24 and 240 h. It was found that the morphology of IMCs changed from scallop-shape to a more uniform planar shape in both Sn-Cu-Ni/Cu joints and Sn-Cu-Ni-TiO2 /Cu joint. Cu6Sn5 and Cu3Sn IMC were identified and grew after prolong aging time and temperature. The IMCs thickness and scallop diameter of composite solder paste were reduced and the growth of IMCs thickness after isothermal aging become slower as compared to unreinforced Sn-Cu-Ni solder paste. It is suggested that TiO2 particles have influenced the evolution and retarded the growth of interfacial IMCs.

Non-Metal Reinforced Lead-Free Composite Solder Fabrication Methods and its Reinforcing Effects to the Suppression of Intermetallic Formation: Short Review

2013 ◽  
Vol 421 ◽  
pp. 260-266 ◽  
Author(s):  
M.A.A. Mohd Salleh ◽  
Stuart McDonald ◽  
Kazuhiro Nogita
Keyword(s):  
Intermetallic Compound ◽  
Solder Joint ◽  
Composite Solder ◽  
Short Review ◽  
Lead Free ◽  
Nanoparticle Size ◽  
Intermetallic Formation ◽  
Reinforcing Effects ◽  
Lead Free Solders

To increase the solder joint robustness, researches and studies on composite solder carried out by many researchers in an effort to develop viable lead-free solders which can replace the conventional lead-based solders.This paper reviews the fabrication processes of the lead-free composite solder and its non-metal reinforcing effects to the suppression of intermetallic formation. Most researchers using different solder fabrication methods have found that byadditions of non-metal reinforcement from micron up to nanoparticle size had suppressed the intermetallic compound formations of lead-free composite solders.

Low and High Temperature Isothermal Aging Effect on Morphology and Diffusion Kinetics of Intermetallic Compound (IMC) for Sn-Cu-Si3N4 Composite Solder

2013 ◽  
Vol 594-595 ◽  
pp. 666-670
Author(s):  
Saud Norainiza ◽  
S.I. Najib ◽  
M.A.A. Mohd Salleh
Keyword(s):  
High Temperature ◽  
Intermetallic Compound ◽  
Aging Temperature ◽  
Composite Solder ◽  
Aging Effect ◽  
Cu6sn5 Phase ◽  
High Aging Temperature ◽  
Reliability Of Solder Joints ◽  
Kinetics Of ◽  
And Diffusion

The effect of excessive intermetallic growth to the reliability of solder joints become major problem in electronic devices industry. In this study, we used Sn-Cu-Si3N4composite solder to observe the intermetallic compound (IMC) growth during low and high temperature aging. 50°C and 150°C represent low and high aging temperature respectively. Various isothermal of aging times were carried out by using 24hrs, 240hrs and 720hrs. The IMC thickness increases with increasing of aging temperature and time. Cu6Sn5 phase appear at low aging temperature whilst Cu6Sn5together with Cu3Sn phases has been observed at high aging temperature. The growth kinetics for low and high aging temperature is 1.63x10-18μm2/s and 2.75 x10-18μm2/s.

Copper to Aluminum Bonding: IMC Characterization through New Mechanical Sectioning Methods

2010 ◽  
Author(s):  
Lucas Copeland ◽  
Mukul Saran
Keyword(s):  
Intermetallic Compound ◽  
Imaging Study ◽  
Thermal Ageing ◽  
Initial Model ◽  
Growth Morphology ◽  
Intermetallic Formation ◽  
Imaging Parameters ◽  
Bonded Interface ◽  
Bond Interface ◽  
Sem Imaging

Abstract This paper presents a mechanical cross-sectioning approach that produces an image clarity not yet demonstrated in published literature. It demonstrates how a critical sequence of polishing, basic slurry optimization and staining, in conjunction with correct imaging parameters can be used to highlight the growth morphology of the intermetallic compound (IMCs). Utilizing this approach, the paper describes the results of a SEM imaging study of the intermetallic formation and growth at the Cu-Al bond interface during thermal ageing for up to 4000hrs at 150 deg C. The paper uses direct SEM imaging to catalog observations which are used to create an initial model for IMC and void growth at the wire bonded interface. It examines the effect of aluminum splash and concludes that growth of intermetallics at the Cu-Al interface is rapid into the bond-pad aluminum than into the Cu-ball, but the growth thickness uniformity is much higher into the Cu-ball.

scholarly journals Suppression of the Growth of Intermetallic Compound Layers with the Addition of Graphene Nano-Sheets to an Epoxy Sn–Ag–Cu Solder on a Cu Substrate

Materials ◽  
2019 ◽  
Vol 12 (6) ◽  
pp. 936 ◽  
Author(s):  
Min-Soo Kang ◽  
Do-Seok Kim ◽  
Young-Eui Shin
Keyword(s):  
Intermetallic Compound ◽  
Isothermal Aging ◽  
Solder Joints ◽  
Solder Paste ◽  
Shear Tests ◽  
Sac305 Solder ◽  
Epoxy Solder ◽  
The Relationship ◽  
Bonding Characteristics ◽  
Preventive Effects

This study investigated the suppression of the growth of the intermetallic compound (IMC) layer that forms between epoxy solder joints and the substrate in electronic packaging by adding graphene nano-sheets (GNSs) to 96.5Sn–3.0Ag–0.5Cu (wt %, SAC305) solder whose bonding characteristics had been strengthened with a polymer. IMC growth was induced in isothermal aging tests at 150 °C, 125 °C and 85 °C for 504 h (21 days). Activation energies were calculated based on the IMC layer thickness, temperature, and time. The activation energy required for the formation of IMCs was 45.5 KJ/mol for the plain epoxy solder, 52.8 KJ/mol for the 0.01%-GNS solder, 62.5 KJ/mol for the 0.05%-GNS solder, and 68.7 KJ/mol for the 0.1%-GNS solder. Thus, the preventive effects were higher for increasing concentrations of GNS in the epoxy solder. In addition, shear tests were employed on the solder joints to analyze the relationship between the addition of GNSs and the bonding characteristics of the solder joints. It was found that the addition of GNSs to epoxy solder weakened the bonding characteristics of the solder, but not critically so because the shear force was higher than for normal solder (i.e., without the addition of epoxy). Thus, the addition of a small amount of GNSs to epoxy solder can suppress the formation of an IMC layer during isothermal aging without significantly weakening the bonding characteristics of the epoxy solder paste.

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