Nondestructive Visualizations of Short Circuits in Ball Grid Arrays by Magnetic Field Imaging and Three-Dimensional X-Ray Microscopy

Abstract It is important to locate a short circuit failure in semiconductor devices, and powerful tools such as lock-in thermography and optical beam induced resistance change are used. However, those tools are inappropriate for investigating the device covered with the impenetrable substance to light, because the covering substance blocks the light from the defect point in the device and also prevents the optical beam from outside of the device. We demonstrate that a subsurface short circuit in a ball grid array device can be located by magnetic field imaging (MFI) and the electromagnetic field reconstruction method (EM-FRM), which makes it possible to calculate a magnetic field in the immediate vicinity of the current that is the source of the field from a measured magnetic field at a distance. Moreover, we visualize the short circuit by three-dimensional X-ray microscopy. MFI is also applied to visualization of a magnetic field created by a current flowing inside a printed circuit board and a light emitting diode package.

Download Full-text

Non-Destructive 3D Failure Analysis Work Flow for Electrical Failure Analysis in Complex 2.5D-Based Devices Combining 3D Magnetic Field Imaging and 3D X-Ray Microscopy

10.31399/asm.cp.istfa2018p0032 ◽

2018 ◽

Author(s):

Antonio Orozco ◽

Elena Talanova ◽

Alex Jeffers ◽

Florencia Rusli ◽

Bernice Zee ◽

...

Keyword(s):

Magnetic Field ◽

Failure Analysis ◽

Integrated Circuit ◽

Semiconductor Industry ◽

Three Dimensional ◽

X Ray ◽

Electrical Failure ◽

Magnetic Field Imaging ◽

3D Stacking ◽

Field Imaging

Abstract Industry and market requirements keep imposing demands in terms of tighter transistor packing, die and component real estate management on the package, faster connections and expanding functionality. This has forced the semiconductor industry to look for novel packaging approaches to allow for 3D stacking of transistors (the so called “More than Moore”). This complex 3D geometry, with an abundance of opaque layers and interconnects, presents a great challenge for failure analysis (FA). Three-dimensional (3D) magnetic field imaging (MFI) has proven to be a natural, useful technique for non-destructively mapping 3D current paths in devices that allows for submicron vertical resolution. 3D X-ray microscopy (XRM) enables 3D tomographic imaging of advanced IC packages without the need to destroy the device. This is because it employs both geometric and optical image magnifications to achieve high spatial resolution. In this paper, we propose a fully nondestructive, 3D-capable workflow for FA comprising 3D MFI and 3D XRM. We present an application of this novel workflow to 3D defect localization in a complex 2.5D device combining high bandwidth memory (HBM) devices and an application specific integrated circuit (ASIC) unit on a Si interposer with a signal pin electrical short failure.

Download Full-text

Open Localization in 3D Package with TSV Daisy Chain Using Magnetic Field Imaging and High-Resolution Three-Dimensional X-ray Microscopy

Applied Sciences ◽

10.3390/app11178148 ◽

2021 ◽

Vol 11 (17) ◽

pp. 8148

Author(s):

Yuan Chen ◽

Ping Lai ◽

Hong-Zhong Huang ◽

Peng Zhang ◽

Xiaoling Lin

Keyword(s):

Magnetic Field ◽

High Resolution ◽

Failure Analysis ◽

Complex Structure ◽

Three Dimensional ◽

X Ray ◽

Defect Localization ◽

Magnetic Field Imaging ◽

3D Package ◽

Field Imaging

With the development of 3D integrated packaging technology, failure analysis is facing more and more challenges. Defect localization in a 3D package is a key step of failure analysis. The complex structure and materials of 3D package devices demand non-destructive defect localization technology for full packages. Magnetic field imaging and three-dimensional X-ray technology are not affected by package material or form. They are effective methods to realize defect localization on 3D packages. In this paper, magnetic field imaging and high-resolution three-dimensional X-ray microscopy were used to localize the open defect in a 3D package with a TSV daisy chain. A two-probe RF method in magnetic field imaging was performed to resolve isolation of the defect difficulties resulting from many different branches of TSV daisy chains. Additionally, a linear decay method was used to target sub-micron resolution at a long working distance. Multiple partition scans from a high-resolution 3D X-ray microscopy with a two-stage magnification structure were used to achieve sub-micron resolution. The open location identified by magnetic field imaging was consistent with that identified by a three-dimensional X-ray microscope. The opening was located on the top metal in the proximity of the fifth via. Physical failure analysis revealed the presence of a crack in the top metal at the opening location.

Download Full-text

An experimental study on characterizing damage and fracture of a rock-like material based on three-dimensional magnetic field imaging

Engineering Computations ◽

10.1108/ec-05-2020-0278 ◽

2020 ◽

Vol ahead-of-print (ahead-of-print) ◽

Author(s):

Wenping Yue ◽

Mingyang Yang

Keyword(s):

Magnetic Field ◽

Imaging System ◽

Three Dimensional ◽

Fracture Pattern ◽

Content Type ◽

Damage And Fracture ◽

Magnetic Marker ◽

Magnetic Field Imaging ◽

The Magnetic Field ◽

Field Imaging

Purpose The results showed that the use of a magnetic marker could relatively accurately reflect the fracture pattern inside the rock-like material (RLM). Design/methodology/approach This study investigated the internal structure and fracture pattern of a fractured RLM. Magnetized iron oxide powder, which was used as a magnetic marker, was mixed with water and glue to form a magnetic slurry, which was subsequently injected into a fractured RLM. After the magnetic slurry completely filled the cracks inside the RLM and became cemented, the distribution and magnitude of the magnetic field inside the RLM were determined using a three-dimensional (3D) magnetic field imaging system. Findings A model for determining the magnetic field strength was developed using MATLAB. Originality/value This model of 3D magnetic will further be used as a finite element tool to simulate and image cracks inside the rock.

Download Full-text

Magnetic Field Imaging on Stacked Flash Memories by Laser Probing and SQUID Scanning

ISTFA 2017: Conference Proceedings from the 43rd International Symposium for Testing and Failure Analysis ◽

10.31399/asm.cp.istfa2017p0495 ◽

2017 ◽

Author(s):

K. Sanchez ◽

G. Bascoul ◽

F. Infante ◽

N. Courjault ◽

T. Nakamura

Keyword(s):

Magnetic Field ◽

Failure Analysis ◽

Two Dimensions ◽

Analysis Tool ◽

Active Device ◽

Current Path ◽

3D Packaging ◽

Magnetic Field Imaging ◽

The Magnetic Field ◽

Field Imaging

Abstract Magnetic field imaging is a well-known technique which gives the possibility to study the internal activity of electronic components in a contactless and non-invasive way. Additional data processing can convert the magnetic field image into a current path and give the possibility to identify current flow anomalies in electronic devices. This technique can be applied at board level or device level and is particularly suitable for the failure analysis of complex packages (stacked device & 3D packaging). This approach can be combined with thermal imaging, X-ray observation and other failure analysis tool. This paper will present two different techniques which give the possibility to measure the magnetic field in two dimensions over an active device. Same device and same level of current is used for the two techniques to give the possibility to compare the performance.

Download Full-text

3D IC/Stacked Device Fault Isolation Using 3D Magnetic Field Imaging

ISTFA 2014: Conference Proceedings from the 40th International Symposium for Testing and Failure Analysis ◽

10.31399/asm.cp.istfa2014p0033 ◽

2014 ◽

Author(s):

A. Orozco ◽

N.E. Gagliolo ◽

C. Rowlett ◽

E. Wong ◽

A. Moghe ◽

...

Keyword(s):

Magnetic Field ◽

Fault Isolation ◽

Wafer Level ◽

Wafer Level Packaging ◽

Current Location ◽

Geometrical Information ◽

Magnetic Field Imaging ◽

Silicon Vias ◽

Non Destructive ◽

Field Imaging

Abstract The need to increase transistor packing density beyond Moore's Law and the need for expanding functionality, realestate management and faster connections has pushed the industry to develop complex 3D package technology which includes System-in-Package (SiP), wafer-level packaging, through-silicon-vias (TSV), stacked-die and flex packages. These stacks of microchips, metal layers and transistors have caused major challenges for existing Fault Isolation (FI) techniques and require novel non-destructive, true 3D Failure Localization techniques. We describe in this paper innovations in Magnetic Field Imaging for FI that allow current 3D mapping and extraction of geometrical information about current location for non-destructive fault isolation at every chip level in a 3D stack.

Download Full-text

A multi-magneto-inductive sensor array system for real-time magnetic field imaging of ferromagnetic targets

Review of Scientific Instruments ◽

10.1063/5.0039894 ◽

2021 ◽

Vol 92 (3) ◽

pp. 035113

Author(s):

Huan Liu ◽

Changfeng Zhao ◽

Xiaobin Wang ◽

Zehua Wang ◽

Jian Ge ◽

...

Keyword(s):

Magnetic Field ◽

Real Time ◽

Sensor Array ◽

Inductive Sensor ◽

Magnetic Field Imaging ◽

Field Imaging

Download Full-text

AGN torus threaded by large scale magnetic field

International Journal of Modern Physics D ◽

10.1142/s0218271818440066 ◽

2018 ◽

Vol 27 (10) ◽

pp. 1844006

Author(s):

A. Dorodnitsyn ◽

T. Kallman

Keyword(s):

Magnetic Field ◽

Angular Momentum ◽

Accretion Disk ◽

Large Scale ◽

Three Dimensional ◽

X Ray ◽

Radiative Feedback ◽

Large Scale Magnetic Field ◽

Three Dimensional Simulations

Large scale magnetic field can be easily dragged from galactic scales toward AGN along with accreting gas. There, it can contribute to both the formation of AGN “torus” and help to remove angular momentum from the gas which fuels AGN accretion disk. However the dynamics of such gas is also strongly influenced by the radiative feedback from the inner accretion disk. Here we present results from the three-dimensional simulations of pc-scale accretion which is exposed to intense X-ray heating.

Download Full-text

Magnetic field imaging of a model electric motor using polarized pulsed neutrons at J-PARC/MLF

Journal of Physics Conference Series ◽

10.1088/1742-6596/862/1/012008 ◽

2017 ◽

Vol 862 ◽

pp. 012008 ◽

Cited By ~ 4

Author(s):

K Hiroi ◽

T Shinohara ◽

H Hayashida ◽

J D Parker ◽

K Oikawa ◽

...

Keyword(s):

Magnetic Field ◽

Electric Motor ◽

Magnetic Field Imaging ◽

Field Imaging

Download Full-text

Retrieval of 3D information in X-ray dark-field imaging with a large field of view

Scientific Reports ◽

10.1038/s41598-021-02960-2 ◽

2021 ◽

Vol 11 (1) ◽

Author(s):

Jana Andrejewski ◽

Fabio De Marco ◽

Konstantin Willer ◽

Wolfgang Noichl ◽

Theresa Urban ◽

...

Keyword(s):

Three Dimensional ◽

Dark Field ◽

Large Field ◽

X Ray ◽

Dark Field Imaging ◽

Beam Geometry ◽

Different Dimensions ◽

3D Information ◽

Human Thorax ◽

Field Imaging

AbstractX-ray dark-field imaging is a widely researched imaging technique, with many studies on samples of very different dimensions and at very different resolutions. However, retrieval of three-dimensional (3D) information for human thorax sized objects has not yet been demonstrated. We present a method, similar to classic tomography and tomosynthesis, to obtain 3D information in X-ray dark-field imaging. Here, the sample is moved through the divergent beam of a Talbot–Lau interferometer. Projections of features at different distances from the source seemingly move with different velocities over the detector, due to the cone beam geometry. The reconstruction of different focal planes exploits this effect. We imaged a chest phantom and were able to locate different features in the sample (e.g. the ribs, and two sample vials filled with water and air and placed in the phantom) to corresponding focal planes. Furthermore, we found that image quality and detectability of features is sufficient for image reconstruction with a dose of 68 μSv at an effective pixel size of $$0.357 \times {0.357}\,\mathrm{mm}^{2}$$ 0.357 × 0.357 mm 2 . Therefore, we successfully demonstrated that the presented method is able to retrieve 3D information in X-ray dark-field imaging.

Download Full-text