scholarly journals Fully Differential Chopper-Stabilized Multipath Current-Feedback Instrumentation Amplifier with R-2R DAC Offset Adjustment for Resistive Bridge Sensors

2019 ◽  
Vol 10 (1) ◽  
pp. 63 ◽  
Author(s):  
Yongsu Kwon ◽  
Hyungseup Kim ◽  
Jaesung Kim ◽  
Kwonsang Han ◽  
Donggeun You ◽  
...  
Keyword(s):  
Integrated Circuit ◽  
Complementary Metal Oxide Semiconductor ◽  
Oxide Semiconductor ◽  
Instrumentation Amplifier ◽  
Cmos Process ◽  
Current Feedback ◽  
Readout Integrated Circuit ◽  
Fully Differential ◽  
Chopper Stabilization ◽  
Rejection Ratio

A fully differential multipath current-feedback instrumentation amplifier (CFIA) for a resistive bridge sensor readout integrated circuit (IC) is proposed. To reduce the CFIA’s own offset and 1/f noise, a chopper stabilization technique is implemented. To attenuate the output ripple caused by chopper up-modulation, a ripple reduction loop (RRL) is employed. A multipath architecture is implemented to compensate for the notch in the chopping frequency band of the transfer function. To prevent performance degradation resulting from external offset, a 12-bit R-2R digital-to-analog converter (DAC) is employed. The proposed CFIA has an adjustable gain of 16–44 dB with 5-bit programmable resistors. The proposed resistive sensor readout IC is implemented in a 0.18 μm complementary metal-oxide-semiconductor (CMOS) process. The CFIA draws 169 μA currents from a 3.3 V supply. The simulated input-referred noise and noise efficiency factor (NEF) are 28.3 nV/√Hz and 14.2, respectively. The simulated common-mode rejection ratio (CMRR) is 162 dB, and the power supply rejection ratio (PSRR) is 112 dB.

scholarly journals A 24.88 nV/√Hz Wheatstone Bridge Readout Integrated Circuit with Chopper-Stabilized Multipath Operational Amplifier

2020 ◽  
Vol 10 (1) ◽  
pp. 399 ◽  
Author(s):  
Kwonsang Han ◽  
Hyungseup Kim ◽  
Jaesung Kim ◽  
Donggeun You ◽  
Hyunwoo Heo ◽  
...  
Keyword(s):  
Integrated Circuit ◽  
Operational Amplifier ◽  
Wheatstone Bridge ◽  
Input Resistance ◽  
Cmos Technology ◽  
Low Noise ◽  
Oxide Semiconductor ◽  
Instrumentation Amplifier ◽  
Readout Integrated Circuit ◽  
Chopper Stabilization

This paper proposes a low noise readout integrated circuit (IC) with a chopper-stabilized multipath operational amplifier suitable for a Wheatstone bridge sensor. The input voltage of the readout IC changes due to a change in input resistance, and is efficiently amplified using a three-operational amplifier instrumentation amplifier (IA) structure with high input impedance and adjustable gain. Furthermore, a chopper-stabilized multipath structure is applied to the operational amplifier, and a ripple reduction loop (RRL) in the low frequency path (LFP) is employed to attenuate the ripple generated by the chopper stabilization technique. A 12-bit successive approximation register (SAR) analog-to-digital converter (ADC) is employed to convert the output voltage of the three-operational amplifier IA into digital code. The Wheatstone bridge readout IC is manufactured using a standard 0.18 µm complementary metal-oxide-semiconductor (CMOS) technology, drawing 833 µA current from a 1.8 V supply. The input range and the input referred noise are ±20 mV and 24.88 nV/√Hz, respectively.

HIGH INDUCTANCE COIL EMBEDDED ON MAGNETIC SENSOR CHIP FOR BIOMAGNETIC SIGNAL MEASUREMENTS

2013 ◽  
Vol 27 (26) ◽  
pp. 1350159
Author(s):  
HYUNJUNE LYU ◽  
JUN RIM CHOI
Keyword(s):  
Complementary Metal Oxide Semiconductor ◽  
Magnetic Sensor ◽  
Oxide Semiconductor ◽  
Sensor Chip ◽  
Instrumentation Amplifier ◽  
Cmos Process ◽  
Band Pass Filter ◽  
Current Feedback ◽  
Pass Filter ◽  
Inductance Coil

For the purpose of biomagnetic measurements, a magnetic sensor chip is manufactured using a 0.18 μm complementary metal–oxide–semiconductor (CMOS) process. A high-inductance coil and an instrumentation amplifier (IA) are embedded on this chip. The embedded high-inductance coil sensor contains suitable sensitivity and bandwidth for biomagnetic measurements, and is designed via electromagnetic field simulation. A low-gm operational transconductance amplifier (OTA) is also implemented on the chip to reduce the transconductance value. The output signal sensitivity of the magnetic sensor chip is 3.25 fT/μV, and the output reference noise is [Formula: see text]. The instrumentation amplifier is designed to minimize the magnetic signal noise using current feedback and a band-pass filter (BPF) with a bandwidth between 0.5 kHz and 5 kHz. The common-mode rejection ratio (CMRR) is measured at 117.5 dB by the Multi-Project Chip test. The proposed magnetic sensor chip is designed such that the input reference noise is maintained below 0.87 μV.

scholarly journals A Radiation-Hardened Instrumentation Amplifier for Sensor Readout Integrated Circuits in Nuclear Fusion Applications

Electronics ◽  
2018 ◽  
Vol 7 (12) ◽  
pp. 429 ◽  
Author(s):  
Kyungsoo Jeong ◽  
Duckhoon Ro ◽  
Gwanho Lee ◽  
Myounggon Kang ◽  
Hyung-Min Lee
Keyword(s):  
Integrated Circuits ◽  
Integrated Circuit ◽  
Radiation Effects ◽  
Nuclear Fusion ◽  
Oxide Semiconductor ◽  
Instrumentation Amplifier ◽  
Cmos Process ◽  
Readout Integrated Circuit ◽  
Nuclear Fusion Reactor ◽  
Radiation Hardened

A nuclear fusion reactor requires a radiation-hardened sensor readout integrated circuit (IC), whose operation should be tolerant against harsh radiation effects up to MGy or higher. This paper proposes radiation-hardening circuit design techniques for an instrumentation amplifier (IA), which is one of the most sensitive circuits in the sensor readout IC. The paper studied design considerations for choosing the IA topology for radiation environments and proposes a radiation-hardened IA structure with total-ionizing-dose (TID) effect monitoring and adaptive reference control functions. The radiation-hardened performance of the proposed IA was verified through model-based circuit simulations by using compact transistor models that reflected the TID effects into complementary metal–oxide–semiconductor (CMOS) parameters. The proposed IA was designed with the 65 nm standard CMOS process and provides adjustable voltage gain between 3 and 15, bandwidth up to 400 kHz, and power consumption of 34.6 μW, while maintaining a stable performance over TID effects up to 1 MGy.

Fabrication of microbridges in standard complementary metal oxide semiconductor technology

1989 ◽  
Vol 67 (4) ◽  
pp. 184-189 ◽  
Author(s):  
M. Parameswaran ◽  
Lj. Ristic ◽  
A. C. Dhaded ◽  
H. P. Baltes ◽  
W. Allegretto ◽  
...  
Keyword(s):  
Metal Oxide ◽  
Integrated Circuit ◽  
Complementary Metal Oxide Semiconductor ◽  
Cmos Technology ◽  
Layout Design ◽  
Metal Oxide Semiconductor ◽  
Oxide Semiconductor ◽  
Cmos Process ◽  
Digital Cmos ◽  
Sensor Applications

Complementary metal oxide semiconductor (CMOS) technology is one of the leading fabrication technologies of the semiconductor integrated-circuit industry. We have discovered features inherent in the standard CMOS fabrication process that lend themselves to the manufacturing of micromechanical structures for sensor applications. In this paper we present an unconventional layout design methodology that allows us to exploit the standard CMOS process for producing microbridges. Two types of microbridges, bare polysilicon microbridges and sandwiched oxide microbridges, have been manufactured by first implementing a special layout design in an industrial digital CMOS process, followed by a postprocessing etching step.

scholarly journals Low-Cost Microbolometer Type Infrared Detectors

Micromachines ◽  
2020 ◽  
Vol 11 (9) ◽  
pp. 800
Author(s):  
Le Yu ◽  
Yaozu Guo ◽  
Haoyu Zhu ◽  
Mingcheng Luo ◽  
Ping Han ◽  
...  
Keyword(s):  
Integrated Circuit ◽  
Focal Plane ◽  
Technological Development ◽  
Low Cost ◽  
Complementary Metal Oxide Semiconductor ◽  
Micro Electro Mechanical System ◽  
Focal Plane Arrays ◽  
Oxide Semiconductor ◽  
Cmos Process ◽  
Cmos Compatible

The complementary metal oxide semiconductor (CMOS) microbolometer technology provides a low-cost approach for the long-wave infrared (LWIR) imaging applications. The fabrication of the CMOS-compatible microbolometer infrared focal plane arrays (IRFPAs) is based on the combination of the standard CMOS process and simple post-CMOS micro-electro-mechanical system (MEMS) process. With the technological development, the performance of the commercialized CMOS-compatible microbolometers shows only a small gap with that of the mainstream ones. This paper reviews the basics and recent advances of the CMOS-compatible microbolometer IRFPAs in the aspects of the pixel structure, the read-out integrated circuit (ROIC), the focal plane array, and the vacuum packaging.

scholarly journals Gilbert-Cell Mixer for WiMAX Applications

2018 ◽  
pp. 1-9
Author(s):  
Frederick Ray I. Gomez
Keyword(s):  
Integrated Circuit ◽  
Dynamic Range ◽  
Noise Figure ◽  
Impedance Matching ◽  
Complementary Metal Oxide Semiconductor ◽  
Past Research ◽  
Direct Conversion ◽  
Oxide Semiconductor ◽  
Cmos Process ◽  
Mixer Design

Differential implementation is becoming highly popular in Radio Frequency Integrated Circuit (RFIC) design, notably for its high immunity to common-mode noises, acceptable rejection of parasitic coupling, and increased dynamic range. One RF front-end building block that is usually designed as a differential circuit is the mixer. This paper presents a design, study, and optimization of a differential mixer, more specifically the Gilbert-cell mixer (also known as double-balanced mixer) implemented on a direct-conversion architecture in a standard 90 nm Complementary Metal-Oxide Semiconductor (CMOS) process. Operating frequency is set to 5GHz, which is a typical frequency for Worldwide Interoperability for Microwave Access (WiMAX) receiver. Impedance matching was necessary to design and fully optimize the mixer design. The direct-conversion Gilbert-cell mixer design ultimately achieved conversion gain of 11.463dB and noise figure of 16.529dB, comparable to mixer designs from past research and studies.

scholarly journals Readout Integrated Circuit for Small-Sized and Low-Power Gas Sensor Based on HEMT Device

Sensors ◽  
2021 ◽  
Vol 21 (16) ◽  
pp. 5637
Author(s):  
Seungjun Lee ◽  
Joohwan Jin ◽  
Jihyun Baek ◽  
Juyong Lee ◽  
Hyungil Chae
Keyword(s):  
Low Power ◽  
Gas Sensor ◽  
Integrated Circuit ◽  
Hydrogen Gas ◽  
Oxide Semiconductor ◽  
Sensor System ◽  
Cmos Process ◽  
High Electron ◽  
Readout Integrated Circuit ◽  
Detection Unit

This paper presents a small-sized, low-power gas sensor system combining a high-electron-mobility transistor (HEMT) device and readout integrated circuit (ROIC). Using a semiconductor-based HEMT as a gas-sensing device, it is possible to secure high sensitivity, reduced complexity, low power, and small size of the ROIC sensor system. Unlike existing gas sensors comprising only HEMT elements, the proposed sensor system has both an ROIC and a digital controller and can control sensor operation through a simple calibration process with digital signal processing while maintaining constant performance despite variations. The ROIC mainly consists of a transimpedance amplifier (TIA), a negative-voltage generator, and an analog-to-digital converter (ADC) and is designed to match a minimum target detection unit of 1 ppm for hydrogen. The prototype ROIC for the HEMT presented herein was implemented in a 0.18 µm complementary metal–oxide–semiconductor (CMOS) process. The total measured power consumption and detection unit of the proposed ROIC for hydrogen gas were 3.1 mW and 2.6 ppm, respectively.

scholarly journals A Chopper Stabilization Audio Instrumentation Amplifier for IoT Applications

2020 ◽  
Vol 10 (2) ◽  
pp. 13 ◽  
Author(s):  
Jamel Nebhen ◽  
Pietro M. Ferreira ◽  
Sofiene Mansouri
Keyword(s):  
Power Consumption ◽  
Silicon Nanowires ◽  
Supply Voltage ◽  
Complementary Metal Oxide Semiconductor ◽  
Low Noise ◽  
Oxide Semiconductor ◽  
Instrumentation Amplifier ◽  
Chopper Stabilization ◽  
Iot Applications ◽  
Trade Offs

A low-noise instrumentation amplifier dedicated to a nano- and micro-electro-mechanical system (M&NEMS) microphone for the use in Internet of Things (IoT) applications is presented. The piezoresistive sensor and the electronic interface are respectively, silicon nanowires and an instrumentation amplifier. To design an instrumentation amplifier for IoT applications, different trade-offs are discussed like power consumption, gain, noise and sensitivity. Because the most critical noisy block is the amplifier, a delay-time chopper stabilization (CHS) technique is implemented around it to eliminate its offset and 1/f noise. The low-noise instrumentation amplifier is implemented in a 65-nm CMOS (Complementary metal–oxide–semiconductor) technology. The supply voltage is 2.5 V while the power consumption is 0.4 mW and the core area is 1 mm2. The circuit of the M&NEMS microphone and the amplifier was fabricated and measured. From measurement results over a signal bandwidth of 20 kHz, it achieves a signal-to-noise ratio (SNR) of 77 dB.

scholarly journals Phase Change Metasurfaces by Continuous or Quasi-Continuous Atoms for Active Optoelectronic Integration

Materials ◽  
2021 ◽  
Vol 14 (5) ◽  
pp. 1272
Author(s):  
Zhihua Fan ◽  
Qinling Deng ◽  
Xiaoyu Ma ◽  
Shaolin Zhou
Keyword(s):  
Phase Change ◽  
Phase Change Materials ◽  
Complementary Metal Oxide Semiconductor ◽  
Photonic Devices ◽  
Oxide Semiconductor ◽  
Cmos Process ◽  
Nanophotonic Devices ◽  
Optoelectronic Integration ◽  
Hybrid Devices ◽  
Micro Electromechanical System

In recent decades, metasurfaces have emerged as an exotic and appealing group of nanophotonic devices for versatile wave regulation with deep subwavelength thickness facilitating compact integration. However, the ability to dynamically control the wave–matter interaction with external stimulus is highly desirable especially in such scenarios as integrated photonics and optoelectronics, since their performance in amplitude and phase control settle down once manufactured. Currently, available routes to construct active photonic devices include micro-electromechanical system (MEMS), semiconductors, liquid crystal, and phase change materials (PCMs)-integrated hybrid devices, etc. For the sake of compact integration and good compatibility with the mainstream complementary metal oxide semiconductor (CMOS) process for nanofabrication and device integration, the PCMs-based scheme stands out as a viable and promising candidate. Therefore, this review focuses on recent progresses on phase change metasurfaces with dynamic wave control (amplitude and phase or wavefront), and especially outlines those with continuous or quasi-continuous atoms in favor of optoelectronic integration.

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