scholarly journals An Improved Investigation into the Effects of the Temperature-Dependent Parasitic Elements on the Losses of SiC MOSFETs

2020 ◽  
Vol 10 (20) ◽  
pp. 7192
Author(s):  
Yinong Zeng ◽  
Yingping Yi ◽  
Pu Liu
Keyword(s):  
Analytical Model ◽  
Printed Circuit Board ◽  
Practical Knowledge ◽  
Temperature Characteristic ◽  
Circuit Board ◽  
Power Losses ◽  
Loss Assessment ◽  
Temperature Dependent ◽  
State Equations ◽  
Physical Knowledge

This paper presents an improved investigation into the effects of temperature-dependent parasitic elements on the silicon carbide (SiC) MOSFET power losses. Based on the physical knowledge of MOSFET, a circuit-level loss analytical model is proposed, which takes the parasitic elements of the power devices and the stray inductances of the Printed Circuit Board (PCB) traces into consideration. The state equations derived from the equivalent circuit of each stage is solved by iteration to calculate the loss in the switching transients. In order to study the temperature characteristic completely, the key parameters needed in the calculation are extracted from power device test platform based on Agilent B1505A. The loss assessment of the proposed analytical model with varied elements has been successfully substantiated by the experimental results of a 400-V, 15-A double-pulse-test bench. Finally, some practical knowledge about loss mechanisms is given to help estimate the power losses and optimize the efficiency of power converters.

scholarly journals Analytical modeling of multi-layered printed circuit board using multi-stacked via clusters as component heat spreader

2016 ◽  
Vol 20 (5) ◽  
pp. 1633-1647 ◽  
Author(s):  
Eric Monier-Vinard ◽  
Najib Laraqi ◽  
Cheikh Dia ◽  
Minh-Nhat Nguyen ◽  
Valentin Bissuel
Keyword(s):  
Analytical Model ◽  
Printed Circuit Board ◽  
Electronics Cooling ◽  
Circuit Board ◽  
Design Parameters ◽  
Board Structure ◽  
Printed Circuit ◽  
Fourier Series Method ◽  
Potential Gain ◽  
Local Modification

In order to help the electronic designer to early determine the limits of the power dissipation of electronic component, an analytical model was established to allow a fast insight of relevant design parameters of a multi-layered electronic board constitution. The proposed steady-state approach based on Fourier series method promotes a practical solution to quickly investigate the potential gain of multi-layered thermal via clusters. Generally, it has been shown a good agreement between the results obtained by the proposed analytical model and those given by electronics cooling software widely used in industry. Some results highlight the fact that the conventional practices for Printed Circuit Board modeling can be dramatically underestimate source temperatures, in particular with smaller sources. Moreover, the analytic solution could be applied to optimize the heat spreading in the board structure with a local modification of the effective thermal conductivity layers.

scholarly journals METHOD FOR QUANTIFICATION OF SEMICONDUCTOR POWER LOSSES IN POWER CONVERTERS DUE TO PRINTED CIRCUIT BOARD PARASITE ELEMENTS

2021 ◽  
Vol 26 (1) ◽  
pp. 1-11
Author(s):  
Tális Piovesan ◽  
Hamiltom Confortin Sartori ◽  
Vitor Cristiano Bender ◽  
José Renes Pinheiro
Keyword(s):  
Printed Circuit Board ◽  
Power Converters ◽  
Circuit Board ◽  
Power Losses ◽  
Printed Circuit

scholarly journals Optimizing AC Resistance of Solid PCB Winding

Electronics ◽  
2020 ◽  
Vol 9 (5) ◽  
pp. 875 ◽  
Author(s):  
Minh Huy Nguyen ◽  
Handy Fortin Blanchette
Keyword(s):  
Printed Circuit Board ◽  
Eddy Currents ◽  
Proximity Effects ◽  
Circuit Board ◽  
Power Losses ◽  
Frequency Range ◽  
Track Width ◽  
Electromagnetic Calculation ◽  
Simulation Results ◽  
Frequency Power

At high frequency, power losses of a winding due to eddy currents becomes significant. Moreover, the skin and proximity AC resistances are influenced by the width of printed circuit board (PCB) conductors and distance between the adjacent tracks which causes many difficulties to design windings with lowest AC resistances. To clarify this phenomenon, this paper focuses on modeling the influence of skin and proximity effects on AC resistance of planar PCB winding, thereby providing guidelines to reduce the winding AC resistance. An approximate electromagnetic calculation method is proposed and it shows that when the winding proximity AC to DC ratio ( F p r o x i m i t y ) is equal to 1 3 the AC on DC ratio caused by skin effect ( F s k i n ) , the winding is optimized and it has lowest AC resistance. 3-D finite element simulations of 3, 7 and 10-Turn windings, which are divided into 3 groups with the same footprint, are presented to investigate the lowest AC resistance when the track width varies from 3 mm to 5 mm and the frequency range is up to 700 kHz. In order to verify the theoretical analysis and simulation results, an experiment with 3 simulated groups, (9 prototypes in total) is built and has a very good fit with simulation results. Experimental results show that at the optimal width, the AC resistance of the windings can be reduced up to 16.5 % in the frequency range from 200 kHz to 700 kHz.

Fracture Mechanics Analysis of Low Cost Solder Bumped Flip Chip Assemblies With Imperfect Underfills

2000 ◽  
Vol 122 (4) ◽  
pp. 306-310 ◽  
Author(s):  
John H. Lau ◽  
S.-W. Ricky Lee
Keyword(s):  
Fracture Mechanics ◽  
Solder Joint ◽  
Flip Chip ◽  
Printed Circuit Board ◽  
Low Cost ◽  
Strain Energy Release ◽  
Circuit Board ◽  
Temperature Dependent ◽  
Joint Reliability

Solder joint reliability of flip chip on various thickness of printed circuit board with imperfect underfill is presented in this study. Emphasis is placed on the determination of the temperature-dependent stress and plastic strain at the corner solder joint with different crack (delamination) lengths. Also, the strain energy release rate and phase angle at the crack tip of the interface between the underfill and solder mask are obtained by fracture mechanics. [S1043-7398(00)01104-X]

A New Thermal-Fatigue Life Prediction Model for Wafer Level Chip Scale Package (WLCSP) Solder Joints

2002 ◽  
Vol 124 (3) ◽  
pp. 212-220 ◽  
Author(s):  
John H. Lau ◽  
Stephen H. Pan ◽  
Chris Chang
Keyword(s):  
Fatigue Life ◽  
Thermal Fatigue ◽  
Printed Circuit Board ◽  
Solder Joints ◽  
Time Dependent ◽  
Circuit Board ◽  
Wafer Level ◽  
Temperature Dependent ◽  
Thermal Fatigue Life ◽  
Chip Scale Package

A new empirical equation for predicting the thermal-fatigue life of wafer level chip scale package (WLCSP) solder joints on printed circuit board (PCB) is presented. The solder joints are subjected to thermal cycling and their crack lengths at different thermal cycles are measured. Also, the average strain energy density around the crack tip of different crack lengths in the corner solder joint is determined by a time-dependent nonlinear fracture mechanics with finite element method. The solder is assumed to be a temperature-dependent elastic-plastic and a time-dependent creep material.

A New Thermal-Fatigue Life Prediction Model for Wafer Level Chip Scale Package (WLCSP) Solder Joints

2000 ◽  
Author(s):  
John H. Lau ◽  
Stephen H. Pan ◽  
Chris Chang
Keyword(s):  
Fatigue Life ◽  
Thermal Fatigue ◽  
Printed Circuit Board ◽  
Solder Joints ◽  
Time Dependent ◽  
Circuit Board ◽  
Wafer Level ◽  
Temperature Dependent ◽  
Thermal Fatigue Life ◽  
Chip Scale Package

Abstract A new empirical equation for predicting the thermal-fatigue life of wafer level chip scale package (WLCSP) solder joints on printed circuit board (PCB) is presented. The solder joints are subjected to thermal cycling and their crack lengths at different thermal cycles are measured. Also, the average strain energy density around the crack tip of different crack lengths in the corner solder joint is determined by a time-dependent nonlinear fracture mechanics with finite element method. The solder is assumed to be a temperature-dependent elastic-plastic and a time-dependent creep material.

Effect of Printed Circuit Board Structures on Temperature-Dependent Gain Characteristics of RF Power Amplifier Chips

2008 ◽  
Vol 18 (5) ◽  
pp. 323-325 ◽  
Author(s):  
Jeongkyu Heo ◽  
Jae Choon Kim ◽  
Ki Hyuk Kim ◽  
Jae-Sung Rieh ◽  
Jin Taek Chung ◽  
...  
Keyword(s):  
Power Amplifier ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Rf Power ◽  
Temperature Dependent ◽  
Printed Circuit ◽  
Rf Power Amplifier

406. An Ergonomic Hazards Survey of Printed Circuit Board Factories

1999 ◽  
Author(s):  
C. Lu ◽  
S. Wang ◽  
C. Wei ◽  
S. In
Keyword(s):  
Printed Circuit Board ◽  
Circuit Board ◽  
Printed Circuit

Characteristics of Radiated Emission from a Printed Circuit Board with a Slit

2012 ◽  
Vol 132 (6) ◽  
pp. 404-410 ◽  
Author(s):  
Kenichi Nakayama ◽  
Kenichi Kagoshima ◽  
Shigeki Takeda
Keyword(s):  
Printed Circuit Board ◽  
Circuit Board ◽  
Printed Circuit ◽  
Radiated Emission

Confirming the Signal Integrity in Transmission of Digital Signals on Microstrip Straight Circuits via the Eye Diagrams

2014 ◽  
Vol 5 (1) ◽  
pp. 737-741
Author(s):  
Alejandro Dueñas Jiménez ◽  
Francisco Jiménez Hernández
Keyword(s):  
Integrated Circuits ◽  
Printed Circuit Board ◽  
Signal Integrity ◽  
High Volume ◽  
Information Storage ◽  
Circuit Board ◽  
Electromagnetic Simulation ◽  
Electronic Systems ◽  
Digital Signals ◽  
Printed Circuit

Because of the high volume of processing, transmission, and information storage, electronic systems presently requires faster clock speeds tosynchronizethe integrated circuits. Presently the “speeds” on the connections of a printed circuit board (PCB) are in the order of the GHz. At these frequencies the behavior of the interconnects are more like that of a transmission line, and hence distortion, delay, and phase shift- effects caused by phenomena like cross talk, ringing and over shot are present and may be undesirable for the performance of a circuit or system.Some of these phrases were extracted from the chapter eight of book “2-D Electromagnetic Simulation of Passive Microstrip Circuits” from the corresponding author of this paper.

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