scholarly journals Efficient Approach for Electrical Design and Analysis of High-Speed Interconnect in Integrated Circuit Packages

Electronics ◽  
2020 ◽  
Vol 9 (2) ◽  
pp. 303
Author(s):  
Myunghoi Kim ◽  
Sunkyu Kong
Keyword(s):  
Hybrid Method ◽  
Integrated Circuit ◽  
High Speed ◽  
Design Space ◽  
Domain Decomposition Method ◽  
Characteristic Impedance ◽  
Efficient Approach ◽  
Design Variables ◽  
Current Design ◽  
Ic Package

In recent integrated circuit (IC) packages, the structure of the interconnect is highly complex, and the effect of high-frequency parasitics is significant. These factors increase the number and level of design variables and extend the analysis frequency range to tens of gigahertz. As a result of the high dimensions of the design space, it is difficult to reduce the design gap between the current design approach and the physical limits of the practical IC-package interconnect. In this paper, we present an efficient approach for designing and analyzing the electrical characteristics of the high-speed interconnect in IC packages. The proposed approach is developed using a hybrid method involving the design of experiments, the domain decomposition method, and the finite-element method. We present a procedure to identify critical design variables for the IC-package interconnect, and we derive a method to recombine the impedance parameters of a segmented interconnect. The proposed hybrid method is verified by comparing its characteristic impedance (Zo) with the Zo value from a full-wave simulation of a complete interconnect. We demonstrate that the proposed hybrid method significantly reduces the design space of the IC-package interconnect so that we can efficiently and rapidly obtain the optimized solution, thereby improving the system performance.

Hygrothermal Fracture Analysis of Plastic IC Package in Reflow Soldering Process

1999 ◽  
Vol 121 (3) ◽  
pp. 148-155 ◽  
Author(s):  
Kang Yong Lee ◽  
Taek Sung Lee
Keyword(s):  
Integrated Circuit ◽  
Fracture Analysis ◽  
Stress Variation ◽  
Reflow Soldering ◽  
Soldering Process ◽  
Ir Heating ◽  
Design Variables ◽  
Plastic Package ◽  
Optimal Values ◽  
Ic Package

The purpose of this paper is to evaluate the delamination and fracture integrity of the integrated circuit (IC) plastic package under hygrothermal loading by the approaches of stress analysis and fracture mechanics. The plastic small outline J-lead (SOJ) package with a dimpled diepad under the reflow soldering process of infrared (IR) heating type is considered. On the package without a crack, the stress variation according to the change of the design variables such as the material and shape of the package is calculated and the possibility of delamination is considered. For the model fully delaminated between the chip and the dimpled diepad, J-integrals are calculated for the various design variables and the fracture integrity is discussed. From the results, optimal values of design variables to prevent the delamination and fracture of the package are obtained. In this study, the finite difference method (FDM) program to obtain the vapor pressure from the content of moisture absorbed into the package is developed.

Design space optimisation of an unmanned aerial vehicle submerged inlet through the formulation of a data-fusion-based hybrid model

2021 ◽  
pp. 1-18
Author(s):  
F. Akram ◽  
H. A. Khan ◽  
T. A. Shams ◽  
D. Mavris
Keyword(s):  
Data Mining ◽  
Data Fusion ◽  
Design Space ◽  
Design Parameters ◽  
Design Variables ◽  
Current Design ◽  
Aerial Vehicle ◽  
Hybrid Data ◽  
Computational Fluid Dynamics Cfd ◽  
Cruise Flight

ABSTRACT The research focuses on the design space optimisation of National Advisory Committee for Aeronautics (NACA) submerged inlets through the formulation of a hybrid data fusion methodology. Submerged inlets have drawn considerable attention owing to their potential for good on-design performance, for example during cruise flight conditions. However, complexities due to the geometrical topology and interactions among various design variables remain a challenge. This research enhances the current design knowledge of submerged inlets through the utilisation of data mining and Computational Fluid Dynamics (CFD) methodologies, focusing on design space optimisation. A two-pronged approach is employed where the first step encompasses a low-fidelity model through data mining and surrogate modelling to predict and optimise the design parameters, while the second step uses the Design of Experiments (DOE) approach based on the CFD results for the candidate design geometry to construct a surrogate model with high fidelity for design refinement. The feasibility of the proposed methodology is demonstrated for the optimisation of the total pressure recovery of a NACA submerged inlet for the subsonic flight regime. The proposed methodology is found to provide good agreement between the surrogate and CFD-based model and reduce the optimisation processing time by half in comparison with conventional (global-based) CFD optimisation approaches.

Acoustic microscopy techniques for the inspection of integrated circuit devices and packages

1992 ◽  
Vol 50 (2) ◽  
pp. 966-967
Author(s):  
Thomas M. Moore
Keyword(s):  
Integrated Circuit ◽  
Acoustic Microscopy ◽  
Hybrid Technique ◽  
Frequency Scanning ◽  
Ic Packaging ◽  
Ic Package ◽  
Microscopy Techniques ◽  
Ic Package Inspection ◽  
Pulse Echo ◽  
Scanning Acoustic Microscope

In the last decade, a variety of characterization techniques based on acoustic phenomena have come into widespread use. Characteristics of matter waves such as their ability to penetrate optically opaque solids and produce image contrast based on acoustic impedance differences have made these techniques attractive to semiconductor and integrated circuit (IC) packaging researchers.These techniques can be divided into two groups. The first group includes techniques primarily applied to IC package inspection which take advantage of the ability of ultrasound to penetrate deeply and nondestructively through optically opaque solids. C-mode Acoustic Microscopy (C-AM) is a recently developed hybrid technique which combines the narrow-band pulse-echo piezotransducers of conventional C-scan recording with the precision scanning and sophisticated signal analysis capabilities normally associated with the high frequency Scanning Acoustic Microscope (SAM). A single piezotransducer is scanned over the sample and both transmits acoustic pulses into the sample and receives acoustic echo signals from the sample.

TEM study of phosphorus-implanted pseudomorphic Si0.88Ge0.12 on Si(100)

1995 ◽  
Vol 53 ◽  
pp. 468-469
Author(s):  
N. David Theodore ◽  
Donald Y.C Lie ◽  
J. H. Song ◽  
Peter Crozier
Keyword(s):  
Integrated Circuits ◽  
Heterojunction Bipolar Transistors ◽  
Integrated Circuit ◽  
High Speed ◽  
Room Temperature ◽  
Strain Relaxation ◽  
Bipolar Transistors ◽  
Sige Hbt ◽  
Integrated Circuit Manufacturing ◽  
Microstructural Behavior

SiGe is being extensively investigated for use in heterojunction bipolar-transistors (HBT) and high-speed integrated circuits. The material offers adjustable bandgaps, improved carrier mobilities over Si homostructures, and compatibility with Si-based integrated-circuit manufacturing. SiGe HBT performance can be improved by increasing the base-doping or by widening the base link-region by ion implantation. A problem that arises however is that implantation can enhance strain-relaxation of SiGe/Si.Furthermore, once misfit or threading dislocations result, the defects can give rise to recombination-generation in depletion regions of semiconductor devices. It is of relevance therefore to study the damage and anneal behavior of implanted SiGe layers. The present study investigates the microstructural behavior of phosphorus implanted pseudomorphic metastable Si0.88Ge0.12 films on silicon, exposed to various anneals.Metastable pseudomorphic Si0.88Ge0.12 films were grown ~265 nm thick on a silicon wafer by molecular-beam epitaxy. Pieces of this wafer were then implanted at room temperature with 100 keV phosphorus ions to a dose of 1.5×1015 cm-2.

The Radio Probe™: A New Measurement Tool for High Speed Integrated Circuits

2005 ◽  
Author(s):  
Mark Kimball
Keyword(s):  
Integrated Circuits ◽  
Integrated Circuit ◽  
High Speed ◽  
Attenuation Factor ◽  
Cost Effective ◽  
Frequency Measurement ◽  
Single Frequency ◽  
Measurement Tool ◽  
Probe Design ◽  
Differential Measurement

Abstract This article presents a novel tool designed to allow circuit node measurements in a radio frequency (RF) integrated circuit. The discussion covers RF circuit problems; provides details on the Radio Probe design, which achieves an input impedance of 50Kohms and an overall attenuation factor of 0 dB; and describes signal to noise issues in the output signal, along with their improvement techniques. This cost-effective solution incorporates features that make it well suited to the task of differential measurement of circuit nodes within an RF IC. The Radio Probe concept offers a number of advantages compared to active probes. It is a single frequency measurement tool, so it complements, rather than replaces, active probes.

Aluminum Reflow Sputtering

MRS Bulletin ◽  
1995 ◽  
Vol 20 (11) ◽  
pp. 53-56 ◽  
Author(s):  
Kuniko Kikuta
Keyword(s):  
Integrated Circuit ◽  
High Speed ◽  
Lower Cost ◽  
High Reliability ◽  
Device Fabrication ◽  
Damascene Process ◽  
Aspect Ratios ◽  
Multi Level ◽  
Poor Adhesion ◽  
Lower Resistivity

The scaling of integrated-circuit device dimensions in the horizontal direction has caused an increase in aspect ratios of contact holes and vias without a corresponding scaledown in vertical dimensions. Conventional sputtering has become unreliable for handling higher aspect-ratio via/contact holes because of its poor step coverage. Several studies have attempted to overcome this problem by using W-CVD and reflow technology. The W-CVD is used for practical device fabrications. However, this technique has several problems such as poor adhesion to SiO2, poor W surface morphology, greater resistivity than Al, and the need of an etch-back process.Al reflow technology using a conventional DC magnetron sputtering system can simplify device-fabrication processes and achieve high reliability without Al/W interfaces. In particular, the Al reflow technology is profitable for multi-level interconnections in combination with a damascene process by using Al chemical mechanical polishing (CMP). These interconnections are necessary for miniaturized and high-speed devices because they provide lower resistivity than W and simplify fabrication processes, resulting in lower cost.This article describes recent Al reflow sputtering technologies as well as application of via and interconnect metallization.

Multi-Objective Optimization of an Autonomous Underwater Vehicle

2009 ◽  
Vol 43 (2) ◽  
pp. 48-60 ◽  
Author(s):  
M. Martz ◽  
W. L. Neu
Keyword(s):  
Design Space ◽  
Autonomous Underwater Vehicle ◽  
Underwater Vehicle ◽  
Design Problems ◽  
Single Measure ◽  
Design Variables ◽  
Complex Design ◽  
Final Design ◽  
Undersea Vehicle ◽  
Hierarchy Process

AbstractThe design of complex systems involves a number of choices, the implications of which are interrelated. If these choices are made sequentially, each choice may limit the options available in subsequent choices. Early choices may unknowingly limit the effectiveness of a final design in this way. Only a formal process that considers all possible choices (and combinations of choices) can insure that the best option has been selected. Complex design problems may easily present a number of choices to evaluate that is prohibitive. Modern optimization algorithms attempt to navigate a multidimensional design space in search of an optimal combination of design variables. A design optimization process for an autonomous underwater vehicle is developed using a multiple objective genetic optimization algorithm that searches the design space, evaluating designs based on three measures of performance: cost, effectiveness, and risk. A synthesis model evaluates the characteristics of a design having any chosen combination of design variable values. The effectiveness determined by the synthesis model is based on nine attributes identified in the U.S. Navy’s Unmanned Undersea Vehicle Master Plan and four performance-based attributes calculated by the synthesis model. The analytical hierarchy process is used to synthesize these attributes into a single measure of effectiveness. The genetic algorithm generates a set of Pareto optimal, feasible designs from which a decision maker(s) can choose designs for further analysis.

Current Design Activities on British Railways

1969 ◽  
Vol 184 (4) ◽  
pp. 5-14
Author(s):  
J. F. Thring
Keyword(s):  
High Speed ◽  
Design Review ◽  
New Developments ◽  
Maintenance Costs ◽  
Current Design ◽  
Design Activities ◽  
Selection Of ◽  
Freight Vehicles

With the identification of profitable freight areas and the selection of growth traffics for development has come the need to review in detail the running gear and, in particular, the suspensions of both 4-wheeled and bogie vehicles. This design review has been aimed at ensuring a high-speed capability for all new freight vehicles coupled with safety at all times, low maintenance costs, and maximum availability. After reviewing traditional suspensions, in wide use, with reference to their known strengths and weaknesses, the paper discusses in some detail the philosophy now being applied in B.R. design offices to new freight running gear, for both 4-wheeled and bogie vehicles, to ensure satisfactory achievement of technical objectives. Examples of new developments are provided, together with comments on progress to date.

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