scholarly journals An Integrated Three-Level Synergetic and Reliable Optimization Method Considering Heat Transfer Process, Component, and System

Energies ◽  
2020 ◽  
Vol 13 (16) ◽  
pp. 4112
Author(s):  
Tian Zhao ◽  
Di Liu ◽  
Ke-Lun He ◽  
Xi Chen ◽  
Qun Chen
Keyword(s):  
Heat Transfer ◽  
Optimization Method ◽  
Heat Transfer Process ◽  
System Level ◽  
Heat Current ◽  
Shape Variation ◽  
Component Level ◽  
Local Process ◽  
Process Component ◽  
Process Level

Optimization of heat transfer systems (HTSs) benefits energy efficiency. However, current optimization studies mainly focus on the improvement of system design, component design, and local process intensification separately, which may miss the optimal results and lack reliability. This work proposes a synergetic optimization method integrating levels of the local process, component to system, which could guarantee the reliability of results. The system-level optimization employs the heat current method and hydraulic analysis, the component level optimization adopts heuristic optimization algorithm, and the process level optimization applies the field synergy principle. The introduction of numerical simulation and iteration provides the self-consistency and credibility of results. Optimization results of a multi-loop heat transfer system present that the proposed method can save 16.3% pumping power consumption comparing to results only considering system and process level optimization. Moreover, the optimal parameters of component originate from the trade-off relation between two competing mechanisms of performance enhancement, i.e., the mass flow rate increase and shape variation. Finally, the proposed method is not limited to heat transfer systems but also applicable to other thermal systems.

Integrated Thermal Analysis of Natural Convection Air Cooled Electronic Enclosure

1999 ◽  
Vol 121 (2) ◽  
pp. 108-115 ◽  
Author(s):  
L. Tang ◽  
Y. K. Joshi
Keyword(s):  
Heat Transfer ◽  
Thermal Analysis ◽  
Boundary Condition ◽  
Natural Convection ◽  
Thermal Analyses ◽  
Heat Fluxes ◽  
Global Model ◽  
System Level ◽  
Integrated Analysis ◽  
Component Level

In the present paper, a methodology is described for the integrated thermal analysis of a laminar natural convection air cooled nonventilated electronic system. This approach is illustrated by modeling an enclosure with electronic components of different sizes mounted on a printed wiring board. First, a global model for the entire enclosure was developed using a finite volume computational fluid dynamics/heat transfer (CFD/CHT) approach on a coarse grid. Thermal information from the global model, in the form of board and component surface temperatures, local heat transfer coefficients and reference temperatures, and heat fluxes, was extracted. These quantities were interpolated on a finer grid using bilinear interpolation and further employed in board and component level thermal analyses as various boundary condition combinations. Thus, thermal analyses at all levels were connected. The component investigated is a leadless ceramic chip carrier (LCCC). The integrated analysis approach was validated by comparing the results for a LCCC package with those obtained from detailed system level thermal analysis for the same package. Two preferred boundary condition combinations are suggested for component level thermal analysis.

System Level Design Optimization Method for Lightweight Manufacturable Design

2018 ◽  
Author(s):  
Michael Nucci ◽  
Graeme Sabiston ◽  
Christopher Carrick ◽  
Il Yong Kim
Keyword(s):  
Topology Optimization ◽  
Design Optimization ◽  
Optimization Method ◽  
System Level ◽  
System Level Design ◽  
Component Level ◽  
Roof Structure ◽  
Design Requirements ◽  
Level Design ◽  
Beam Component

This paper presents a method for a system level design optimization, using currently available commercial tools. A process outlining the optimization steps to be used was created based on performing topology optimization on important components and performing a conceptual topology optimization on the entire system. Using this process, a study was performed on a ceiling structure provided by an industry partner. From the design requirements, three primary areas were targeted for design optimization, the component level optimization of the cross beam component, the component level optimization of a roof attachment bracket, and the system level of the general roof structure. This study produced a design for the ceiling structure that reduced the total mass of the system by 34%, while also reducing the amount of total components in the system by 30%.

Dynamic Infrared System Level Fault Isolation

2003 ◽  
Author(s):  
John A. Naoum ◽  
Johan Rahardjo ◽  
Yitages Taffese ◽  
Marie Chagny ◽  
Jeff Birdsley ◽  
...  
Keyword(s):  
Fault Isolation ◽  
System Level ◽  
System Component ◽  
Component Level ◽  
Ir Imaging ◽  
Non Destructive

Abstract The use of Dynamic Infrared (IR) Imaging is presented as a novel, valuable and non-destructive approach for the analysis and isolation of failures at a system/component level.

Design of the Blast Furnace Wall Structure Made of Efficient Materials. Part 4. Calculation Examples

2020 ◽  
Vol 786 (11) ◽  
pp. 30-34
Author(s):  
A.M. IBRAGIMOV ◽  
◽  
L.Yu. GNEDINA ◽  
Keyword(s):  
Heat Transfer ◽  
Mathematical Model ◽  
Blast Furnace ◽  
Boundary Value Problems ◽  
Transfer Process ◽  
Rational Design ◽  
Boundary Value ◽  
Heat Transfer Process ◽  
Furnace Wall ◽  
Time Interval

This work is part of a series of articles under the general title The structural design of the blast furnace wall from efficient materials [1–3]. In part 1, Problem statement and calculation prerequisites, typical multilayer enclosing structures of a blast furnace are considered. The layers that make up these structures are described. The main attention is paid to the lining layer. The process of iron smelting and temperature conditions in the characteristic layers of the internal environment of the furnace is briefly described. Based on the theory of A.V. Lykov, the initial equations describing the interrelated transfer of heat and mass in a solid are analyzed in relation to the task – an adequate description of the processes for the purpose of further rational design of the multilayer enclosing structure of the blast furnace. A priori the enclosing structure is considered from a mathematical point of view as the unlimited plate. In part 2, Solving boundary value problems of heat transfer, boundary value problems of heat transfer in individual layers of a structure with different boundary conditions are considered, their solutions, which are basic when developing a mathematical model of a non-stationary heat transfer process in a multi-layer enclosing structure, are given. Part 3 presents a mathematical model of the heat transfer process in the enclosing structure and an algorithm for its implementation. The proposed mathematical model makes it possible to solve a large number of problems. Part 4 presents a number of examples of calculating the heat transfer process in a multilayer blast furnace enclosing structure. The results obtained correlate with the results obtained by other authors, this makes it possible to conclude that the new mathematical model is suitable for solving the problem of rational design of the enclosing structure, as well as to simulate situations that occur at any time interval of operation of the blast furnace enclosure.

scholarly journals A Computational Study on the Role of Parameters for Identification of Thyroid Nodules by Infrared Images (and Comparison with Real Data)

Sensors ◽  
2021 ◽  
Vol 21 (13) ◽  
pp. 4459
Author(s):  
José R. González ◽  
Charbel Damião ◽  
Maira Moran ◽  
Cristina A. Pantaleão ◽  
Rubens A. Cruz ◽  
...  
Keyword(s):  
Heat Transfer ◽  
Thyroid Nodules ◽  
Numerical Study ◽  
Computational Study ◽  
Internal Heat ◽  
Heat Transfer Process ◽  
The Body ◽  
Physical Parameters ◽  
Infrared Sensors ◽  
Wide Range

According to experts and medical literature, healthy thyroids and thyroids containing benign nodules tend to be less inflamed and less active than those with malignant nodules. It seems to be a consensus that malignant nodules have more blood veins and more blood circulation. This may be related to the maintenance of the nodule’s heat at a higher level compared with neighboring tissues. If the internal heat modifies the skin radiation, then it could be detected by infrared sensors. The goal of this work is the investigation of the factors that allow this detection, and the possible relation with any pattern referent to nodule malignancy. We aim to consider a wide range of factors, so a great number of numerical simulations of the heat transfer in the region under analysis, based on the Finite Element method, are performed to study the influence of each nodule and patient characteristics on the infrared sensor acquisition. To do so, the protocol for infrared thyroid examination used in our university’s hospital is simulated in the numerical study. This protocol presents two phases. In the first one, the body under observation is in steady state. In the second one, it is submitted to thermal stress (transient state). Both are simulated in order to verify if it is possible (by infrared sensors) to identify different behavior referent to malignant nodules. Moreover, when the simulation indicates possible important aspects, patients with and without similar characteristics are examined to confirm such influences. The results show that the tissues between skin and thyroid, as well as the nodule size, have an influence on superficial temperatures. Other thermal parameters of thyroid nodules show little influence on surface infrared emissions, for instance, those related to the vascularization of the nodule. All details of the physical parameters used in the simulations, characteristics of the real nodules and thermal examinations are publicly available, allowing these simulations to be compared with other types of heat transfer solutions and infrared examination protocols. Among the main contributions of this work, we highlight the simulation of the possible range of parameters, and definition of the simulation approach for mapping the used infrared protocol, promoting the investigation of a possible relation between the heat transfer process and the data obtained by infrared acquisitions.

scholarly journals A Thermal Transport Study of Branched Carbon Nanotubes with Cross and T-Junctions

2021 ◽  
Vol 11 (13) ◽  
pp. 5933
Author(s):  
Wei-Jen Chen ◽  
I-Ling Chang
Keyword(s):  
Heat Transfer ◽  
Carbon Nanotubes ◽  
Thermal Management ◽  
Thermal Transport ◽  
Topological Defects ◽  
Branch Length ◽  
Phonon Transport ◽  
Heat Current ◽  
Transport Mechanisms ◽  
Non Equilibrium Molecular Dynamics

This study investigated the thermal transport behaviors of branched carbon nanotubes (CNTs) with cross and T-junctions through non-equilibrium molecular dynamics (NEMD) simulations. A hot region was created at the end of one branch, whereas cold regions were created at the ends of all other branches. The effects on thermal flow due to branch length, topological defects at junctions, and temperature were studied. The NEMD simulations at room temperature indicated that heat transfer tended to move sideways rather than straight in branched CNTs with cross-junctions, despite all branches being identical in chirality and length. However, straight heat transfer was preferred in branched CNTs with T-junctions, irrespective of the atomic configuration of the junction. As branches became longer, the heat current inside approached the values obtained through conventional prediction based on diffusive thermal transport. Moreover, directional thermal transport behaviors became prominent at a low temperature (50 K), which implied that ballistic phonon transport contributed greatly to directional thermal transport. Finally, the collective atomic velocity cross-correlation spectra between branches were used to analyze phonon transport mechanisms for different junctions. Our findings deeply elucidate the thermal transport mechanisms of branched CNTs, which aid in thermal management applications.

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