Dynamic Infrared System Level Fault Isolation

2003 ◽  
Author(s):  
John A. Naoum ◽  
Johan Rahardjo ◽  
Yitages Taffese ◽  
Marie Chagny ◽  
Jeff Birdsley ◽  
...  
Keyword(s):  
Fault Isolation ◽  
System Level ◽  
System Component ◽  
Component Level ◽  
Ir Imaging ◽  
Non Destructive

Abstract The use of Dynamic Infrared (IR) Imaging is presented as a novel, valuable and non-destructive approach for the analysis and isolation of failures at a system/component level.

Application of Fractional Scaling Analysis to Loss of Coolant Accidents: Component Level Scaling for Peak Clad Temperature

2009 ◽  
Vol 131 (12) ◽  
Author(s):  
Ivan Catton ◽  
Wolfgang Wulff ◽  
Novak Zuber ◽  
Upendra Rohatgi
Keyword(s):  
Computational Effort ◽  
System Level ◽  
System Component ◽  
Scaling Analysis ◽  
Primary System ◽  
Component Level ◽  
Single Experiment ◽  
Pressurized Water ◽  
Loss Of Coolant Accident ◽  
Loss Of Coolant

Fractional scaling analysis (FSA) is demonstrated here at the component level for depressurization of nuclear reactor primary systems undergoing a large-break loss of coolant accident. This paper is the third of a three-part sequence. The first paper by Zuber et al. (2005, “Application of Fractional Scaling Analysis (FSA) to Loss of Coolant Accidents (LOCA), Part 1. Methodology Development,” Nucl. Eng. Des., 237, pp. 1593–1607) introduces the FSA method; the second by Wulff et al. (2005, “Application of Fractional Scaling Methodology (FSM) to Loss of Coolant Accidents (LOCA), Part 2. System Level Scaling for System Depressurization,” ASME J. Fluid Eng., to be published) demonstrates FSA at the system level. This paper demonstrates that a single experiment or trustworthy computer simulation, when properly scaled, suffices for large break loss of coolant accident (LBOCAs) in the primary system of a pressurized water reactor and of all related test facilities. FSA, when applied at the system, component, and process levels, serves to synthesize the world-wide wealth of results from analyses and experiments into compact form for efficient storage, transfer, and retrieval of information. This is demonstrated at the component level. It is shown that during LBOCAs, the fuel rod stored energy is the dominant agent of change and that FSA can rank processes quantitatively and thereby objectively in the order of their importance. FSA readily identifies scale distortions. FSA is shown to supercede use of the subjectively implemented phenomena identification and ranking table and to minimize the number of experiments, analyses and computational effort by reducing the evaluation of peak clad temperature (PCT) to a single parameter problem, thus, greatly simplifying uncertainty analysis.

Advanced Non-Destructive Fault Isolation Techniques for PCB Substrates Using Magnetic Current Imaging and Terahertz Time Domain Reflectometry

2018 ◽  
Author(s):  
Daechul Choi ◽  
Yoonseong Kim ◽  
Jongyun Kim ◽  
Han Kim
Keyword(s):  
Time Domain ◽  
Quantum Interference ◽  
Flip Chip ◽  
Imaging System ◽  
Time Domain Reflectometry ◽  
Fault Isolation ◽  
Magnetic Current ◽  
Isolation Techniques ◽  
Super Conducting ◽  
Non Destructive

Abstract In this paper, we demonstrate cases for actual short and open failures in FCB (Flip Chip Bonding) substrates by using novel non-destructive techniques, known as SSM (Scanning Super-conducting Quantum Interference Device Microscopy) and Terahertz TDR (Time Domain Reflectometry) which is able to pinpoint failure locations. In addition, the defect location and accuracy is verified by a NIR (Near Infra-red) imaging system which is also one of the commonly used non-destructive failure analysis tools, and good agreement was made.

Fault Localization of Power-Ground Short via Signal Injection and Oscilloscope Technique

2010 ◽  
Author(s):  
Binh Nguyen
Keyword(s):  
Low Cost ◽  
Short Circuit ◽  
Fault Localization ◽  
Fault Isolation ◽  
Test Apparatus ◽  
Good Working ◽  
Signal Injection ◽  
Set Up ◽  
Non Destructive ◽  
Short Circuit Condition

Abstract For those attempting fault isolation on computer motherboard power-ground short issues, the optimal technique should utilize existing test equipment available in the debug facility, requiring no specialty equipment as well as needing a minimum of training to use effectively. The test apparatus should be both easy to set up and easy to use. This article describes the signal injection and oscilloscope technique which meets the above requirements. The signal injection and oscilloscope technique is based on the application of Ohm's law in a short-circuit condition. Two experiments were conducted to prove the effectiveness of these techniques. Both experiments simulate a short-circuit condition on the VCC3 power rail of a good working PC motherboard and then apply the signal injection and oscilloscope technique to localize the short. The technique described is a simple, low cost and non-destructive method that helps to find the location of the power-ground short quickly and effectively.

Extending Acoustic Microscopy for Comprehensive Failure Analysis Applications

2010 ◽  
Author(s):  
Sebastian Brand ◽  
Matthias Petzold ◽  
Peter Czurratis ◽  
Peter Hoffrogge
Keyword(s):  
Image Processing ◽  
Failure Analysis ◽  
Signal Analysis ◽  
Flip Chip ◽  
Fault Isolation ◽  
Acoustic Microscopy ◽  
Specific Information ◽  
Full Potential ◽  
Time Frequency ◽  
Non Destructive

Abstract In industrial manufacturing of microelectronic components, non-destructive failure analysis methods are required for either quality control or for providing a rapid fault isolation and defect localization prior to detailed investigations requiring target preparation. Scanning acoustic microscopy (SAM) is a powerful tool enabling the inspection of internal structures in optically opaque materials non-destructively. In addition, depth specific information can be employed for two- and three-dimensional internal imaging without the need of time consuming tomographic scan procedures. The resolution achievable by acoustic microscopy is depending on parameters of both the test equipment and the sample under investigation. However, if applying acoustic microscopy for pure intensity imaging most of its potential remains unused. The aim of the current work was the development of a comprehensive analysis toolbox for extending the application of SAM by employing its full potential. Thus, typical case examples representing different fields of application were considered ranging from high density interconnect flip-chip devices over wafer-bonded components to solder tape connectors of a photovoltaic (PV) solar panel. The progress achieved during this work can be split into three categories: Signal Analysis and Parametric Imaging (SA-PI), Signal Analysis and Defect Evaluation (SA-DE) and Image Processing and Resolution Enhancement (IP-RE). Data acquisition was performed using a commercially available scanning acoustic microscope equipped with several ultrasonic transducers covering the frequency range from 15 MHz to 175 MHz. The acoustic data recorded were subjected to sophisticated algorithms operating in time-, frequency- and spatial domain for performing signal- and image analysis. In all three of the presented applications acoustic microscopy combined with signal- and image processing algorithms proved to be a powerful tool for non-destructive inspection.

3D IC/Stacked Device Fault Isolation Using 3D Magnetic Field Imaging

2014 ◽  
Author(s):  
A. Orozco ◽  
N.E. Gagliolo ◽  
C. Rowlett ◽  
E. Wong ◽  
A. Moghe ◽  
...  
Keyword(s):  
Magnetic Field ◽  
Fault Isolation ◽  
Wafer Level ◽  
Wafer Level Packaging ◽  
Current Location ◽  
Geometrical Information ◽  
Magnetic Field Imaging ◽  
Silicon Vias ◽  
Non Destructive ◽  
Field Imaging

Abstract The need to increase transistor packing density beyond Moore's Law and the need for expanding functionality, realestate management and faster connections has pushed the industry to develop complex 3D package technology which includes System-in-Package (SiP), wafer-level packaging, through-silicon-vias (TSV), stacked-die and flex packages. These stacks of microchips, metal layers and transistors have caused major challenges for existing Fault Isolation (FI) techniques and require novel non-destructive, true 3D Failure Localization techniques. We describe in this paper innovations in Magnetic Field Imaging for FI that allow current 3D mapping and extraction of geometrical information about current location for non-destructive fault isolation at every chip level in a 3D stack.

Time Domain Reflectometry Technique for Failure Analysis

2004 ◽  
Author(s):  
Teoh King Long ◽  
Ko Yin Fern
Keyword(s):  
Failure Analysis ◽  
Time Domain ◽  
Time Domain Reflectometry ◽  
Fault Isolation ◽  
Reference Plane ◽  
First Case ◽  
Main Emphasis ◽  
Plastic Ball ◽  
Solder Balls ◽  
Non Destructive

Abstract In time domain reflectometry (TDR), the main emphasis lies on the reflected waveform. Poor probing contact is one of the common problems in getting an accurate waveform. TDR probe normalization is essential before measuring any TDR waveforms. The advantages of normalization include removal of test setup errors in the original test pulse and the establishment of a measurement reference plane. This article presents two case histories. The first case is about a Plastic Ball Grid Array package consisting of 352 solder balls where the open failure mode was encountered at various terminals after reliability assessment. In the second, a three-digit display LED suspected of an electrical short failure was analyzed using TDR as a fault isolation tool. TDR has been successfully used to perform non-destructive fault isolation in assisting the routine failure analysis of open and short failure. It is shown to be accurate and reduces the time needed to identify fault locations.

Advanced Fault Isolation Technique Using Electro-Optical Terahertz Pulse Reflectometry (EOTPR) for 2D and 2.5D Flip-Chip Package

2012 ◽  
Author(s):  
Lihong Cao ◽  
Manasa Venkata ◽  
Meng Yeow Tay ◽  
Wen Qiu ◽  
J. Alton ◽  
...  
Keyword(s):  
Time Domain ◽  
Flip Chip ◽  
Time Domain Reflectometry ◽  
Fault Isolation ◽  
Experimental Results ◽  
Terahertz Pulse ◽  
Isolation And Identification ◽  
Isolation Technique ◽  
Non Destructive

Abstract Electro-optical terahertz pulse reflectometry (EOTPR) was introduced last year to isolate faults in advanced IC packages. The EOTPR system provides 10μm accuracy that can be used to non-destructively localize a package-level failure. In this paper, an EOTPR system is used for non-destructive fault isolation and identification for both 2D and 2.5D with TSV structure of flip-chip packages. The experimental results demonstrate higher accuracy of the EOTPR system in determining the distance to defect compared to the traditional time-domain reflectometry (TDR) systems.

scholarly journals Energy dispersive X-ray diffraction (EDXRD) for operando materials characterization within batteries

2020 ◽  
Vol 22 (37) ◽  
pp. 20972-20989 ◽  
Author(s):  
Amy C. Marschilok ◽  
Andrea M. Bruck ◽  
Alyson Abraham ◽  
Chavis A. Stackhouse ◽  
Kenneth J. Takeuchi ◽  
...  
Keyword(s):  
Materials Characterization ◽  
Energy Dispersive ◽  
System Level ◽  
X Ray Diffraction ◽  
X Ray ◽  
Non Destructive ◽  
Non Destructive Characterization

This review highlights the efficacy of EDXRD as a non-destructive characterization tool in elucidating system-level phenomena for batteries.

System Level Bench Test for Trailing Arm Strength Estimation

2006 ◽  
Author(s):  
Jaychandar Muthu ◽  
Kanak Soundrapandian ◽  
Jyoti Mukherjee
Keyword(s):  
Failure Mode ◽  
Real Life ◽  
Element Model ◽  
Suspension System ◽  
System Level ◽  
Bench Test ◽  
Component Level ◽  
Arm Strength ◽  
Bench Testing ◽  
Nonlinear Finite Element Model

For suspension components, bench testing for strength is mostly accomplished at component level. However, replicating loading and boundary conditions at the component level in order to simulate the suspension system environment may be difficult. Because of this, the component's bench test failure mode may not be similar to its real life failure mode in vehicle environment. A suspension system level bench test eliminates most of the discrepancies between simulated component level and real life vehicle level environments resulting in higher quality bench tests yielding realistic test results. Here, a suspension level bench test to estimate the strength of its trailing arm link is presented. A suspension system level nonlinear finite element model was built and analyzed using ABAQUS software. The strength loading was applied at the wheel end. The analysis results along with the hardware test correlations are presented. The reasons why a system level test is superior to a component level one are also highlighted.

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