scholarly journals Effect of Ni on the Suppression of Sn Whisker Formation in Sn-0.7Cu Solder Joint

Materials ◽  
2021 ◽  
Vol 14 (4) ◽  
pp. 738
Author(s):  
Aimi Noorliyana Hashim ◽  
Mohd Arif Anuar Mohd Salleh ◽  
Andrei Victor Sandu ◽  
Muhammad Mahyiddin Ramli ◽  
Khor Chu Yee ◽  
...  
Keyword(s):  
Solder Joint ◽  
Interfacial Layer ◽  
Whisker Growth ◽  
Intermetallic Layer ◽  
Nucleation And Growth ◽  
Noticeable Effect ◽  
Sn Whisker ◽  
Electron Imaging Mode ◽  
Free Solder ◽  
Electron Imaging

The evolution of internal compressive stress from the intermetallic compound (IMC) Cu6Sn5 growth is commonly acknowledged as the key inducement initiating the nucleation and growth of tin (Sn) whisker. This study investigates the effect of Sn-0.7Cu-0.05Ni on the nucleation and growth of Sn whisker under continuous mechanical stress induced. The Sn-0.7Cu-0.05Ni solder joint has a noticeable effect of suppression by diminishing the susceptibility of nucleation and growth of Sn whisker. By using a synchrotron micro X-ray fluorescence (µ-XRF) spectroscopy, it was found that a small amount of Ni alters the microstructure of Cu6Sn5 to form a (Cu,Ni)6Sn5 intermetallic layer. The morphology structure of the (Cu,Ni)6Sn5 interfacial intermetallic layer and Sn whisker growth were investigated by scanning electron microscope (SEM) in secondary and backscattered electron imaging mode, which showed that there is a strong correlation between the formation of Sn whisker and the composition of solder alloy. The thickness of the (Cu,Ni)6Sn5 IMC interfacial layer was relatively thinner and more refined, with a continuous fine scallop-shaped IMC interfacial layer, and consequently enhanced a greater incubation period for the nucleation and growth of the Sn whisker. These verification outcomes proposes a scientifically foundation to mitigate Sn whisker growth in lead-free solder joint.

Micro Impact Testing of Lead Free Solder Joints

2008 ◽  
Vol 32 ◽  
pp. 99-102
Author(s):  
Ranjan Rajoo ◽  
Erich H. Kisi ◽  
D.J. O'Connor
Keyword(s):  
Solder Joint ◽  
High Strain Rate ◽  
Strain Rate ◽  
High Strain ◽  
Intermetallic Layer ◽  
Displacement Transducer ◽  
Impact Testing ◽  
Lead Free ◽  
Linear Variable Displacement Transducer ◽  
Free Solder

This paper presents data obtained from a newly-developed instrument to test the quality of solder interconnections at high strain rate – the ‘micro-impactor’. This shear test of the interconnection at high strain rate mimics the stress experienced by the solder joint when undergoing shock due to drop-impact. Instrumented with a load cell and linear variable displacement transducer (LVDT), it also has the ability to provide dynamic impact force and displacement data. Earlier concepts to characterise the solder joint at high strain rates such as the miniature pendulum impact tester [1] lacked this capability. This micro-impactor was used to study the effect of increasing silver (Ag) and copper (Cu) concentration in solder alloys on the shear strength of the solder joint. The performance of these lead-free alloys was also compared to that of the well-established leaded solder. It was found that increasing the silver content increases the yield strength of the solder, causing the failure to occur at the brittle intermetallic layer instead of in the bulk of the solder.

scholarly journals Preliminary study on the effect of Ni addition on tin (Sn) whisker growth from lead-free solder coating

2020 ◽  
Vol 957 ◽  
pp. 012062
Author(s):  
Aimi Noorliyana Hashim ◽  
Mohd Arif Anuar Mohd Salleh ◽  
Muhammad Mahyiddin Ramli ◽  
Khor Chu Yee ◽  
Noor Zaimah Mohd Mokhtar
Keyword(s):  
Whisker Growth ◽  
Lead Free ◽  
Lead Free Solder ◽  
Sn Whisker ◽  
Ni Addition ◽  
Preliminary Study ◽  
Free Solder

Sn whisker growth in Sn–9Zn–0.5Ga–0.7Pr lead-free solder

2011 ◽  
Vol 509 (5) ◽  
pp. L52-L55 ◽  
Author(s):  
Huan Ye ◽  
Songbai Xue ◽  
Liang Zhang ◽  
Zhengxiang Xiao ◽  
Yuhua Hu ◽  
...  
Keyword(s):  
Whisker Growth ◽  
Lead Free ◽  
Lead Free Solder ◽  
Sn Whisker ◽  
Free Solder

scholarly journals Morphology Analysis of Spontaneous Tin (Sn) Whisker Growth on Lead-Free Solder

2019 ◽  
Vol 551 ◽  
pp. 012095 ◽  
Author(s):  
Aimi Noorliyana Hashim ◽  
Mohd Arif Anuar Mohd Salleh ◽  
Noor Zaimah Mohd Mokhtar
Keyword(s):  
Whisker Growth ◽  
Lead Free ◽  
Lead Free Solder ◽  
Sn Whisker ◽  
Morphology Analysis ◽  
Free Solder

scholarly journals Kinetics of Sn whisker growth from Sn thin-films on Cu substrate

2020 ◽  
Vol 31 (19) ◽  
pp. 16314-16323 ◽  
Author(s):  
Balázs Illés ◽  
Olivér Krammer ◽  
Tamás Hurtony ◽  
Karel Dušek ◽  
David Bušek ◽  
...  
Keyword(s):  
Thin Films ◽  
Growth Rates ◽  
Whisker Growth ◽  
Layer Structure ◽  
Intermetallic Layer ◽  
Layer Growth ◽  
Sn Whisker ◽  
Cu Substrate ◽  
Sn Whiskers ◽  
Kinetics Of

Abstract The kinetics of Sn whisker growth was investigated on vacuum-evaporated Sn thin-films. Sn film layers were deposited on a Cu substrate with 0.5 and 1 µm thicknesses. The samples were stored in room conditions (22 ± 1 °C/50 ± 5RH%) for 60 days. The Sn whiskers and the Cu–Sn layer structure underneath them were investigated with both scanning electron and ion microscopy. Fast Cu–Sn intermetallic formation resulted in considerable mechanical stress in the Sn layer, which initiated intensive whisker growth right after the layer deposition. The thinner Sn layer produced twice many whiskers compared to the thicker one. The lengths of the filament-type whiskers were similar, but the growth characteristics differed. The thinner Sn layer performed the highest whisker growth rates during the first 7 days, while the thicker Sn layer increased the growth rate only after 7 days. This phenomenon was explained by the cross-correlation of the stress relaxation ability of Sn layers and the amount of Sn atoms for whisker growth. The very high filament whisker growth rates might be caused by the interface flow mechanism, which could be initiated by the intermetallic layer growth itself. Furthermore, a correlation was found between the type of the whiskers and the morphology of the intermetallic layer underneath.

Impact reliability estimation of lead free solder joint with IMC layer

2009 ◽  
Vol 517 (14) ◽  
pp. 4255-4259 ◽  
Author(s):  
Jong-Min Kim ◽  
Seung-Wan Woo ◽  
Yoon-Suk Chang ◽  
Young-Jin Kim ◽  
Jae-Boong Choi ◽  
...  
Keyword(s):  
Solder Joint ◽  
Reliability Estimation ◽  
Lead Free ◽  
Lead Free Solder ◽  
Free Solder ◽  
Impact Reliability

Root Cause Investigation of Lead-Free Solder Joint Interfacial Failures After Multiple Reflows

2016 ◽  
Vol 46 (3) ◽  
pp. 1674-1682 ◽  
Author(s):  
Yan Li ◽  
Olen Hatch ◽  
Pilin Liu ◽  
Deepak Goyal
Keyword(s):  
Solder Joint ◽  
Lead Free ◽  
Lead Free Solder ◽  
Root Cause ◽  
Free Solder

Effects on the microstructure and mechanical properties of Sn-0.7Cu lead-free solder with the addition of a small amount of magnesium

2016 ◽  
Vol 23 (6) ◽  
pp. 641-647
Author(s):  
Her-Yueh Huang ◽  
Chung-Wei Yang ◽  
Yu-Chang Peng
Keyword(s):  
Mechanical Properties ◽  
Aging Process ◽  
Intermetallic Layer ◽  
Eutectic Structure ◽  
Contact Angles ◽  
Solidification Structure ◽  
Lead Free Solder ◽  
Bulk Alloy ◽  
Scanning Calorimetry ◽  
Free Solder

AbstractThe influence of a small amount of magnesium (only 0.01 wt.%) added to the Sn-0.7Cu solder alloy during the aging process of microstructural evolution is studied along with the mechanical properties of the alloy. The experimental results indicate that the addition of magnesium decreases the tensile strength of the solders but improves their elongation. The solidification structure of eutectic Sn-0.7Cu consists of β-Sn, and the eutectic structure, which has extremely fine intermetallic nodules, Cu6Sn5, is located in the interdendritic region. When the magnesium is added to the Sn-0.7Cu alloy, the Sn dendrites become slightly coarser; in comparison, the melting point of the Sn-0.7Cu-0.01Mg alloy decreased by 2°C for the differential scanning calorimetry results of bulk alloy samples. Sn-0.7Cu-0.01Mg exhibits the lowest contact angles and the widest spreading areas. After aging, the Sn-0.7Cu and Sn-0.7Cu-0.01Mg solders show significant changes in strength, mainly because of the obvious increase in the thickness of the Cu6Sn5 intermetallic layer.

Effects of doping trace Ni element on interfacial behavior of Sn/Ni (polycrystal/single-crystal) joints

2021 ◽  
Vol ahead-of-print (ahead-of-print) ◽  
Author(s):  
Jianing Wang ◽  
Jieshi Chen ◽  
Zhiyuan Zhang ◽  
Peilei Zhang ◽  
Zhishui Yu ◽  
...  
Keyword(s):  
Solder Joint ◽  
Single Crystal ◽  
Microstructure Evolution ◽  
Thermal Aging ◽  
Interfacial Layer ◽  
Aging Treatment ◽  
Growth Behavior ◽  
Reflow Process ◽  
Content Type ◽  
Ni Substrate

Purpose The purpose of this article is the effect of doping minor Ni on the microstructure evolution of a Sn-xNi (x = 0, 0.05 and 0.1 wt.%)/Ni (Poly-crystal/Single-crystal abbreviated as PC Ni/SC Ni) solder joint during reflow and aging treatment. Results showed that the intermetallic compounds (IMCs) of the interfacial layer of Sn-xNi/PC Ni joints were Ni3Sn4 phase, while the IMCs of Sn-xNi/SC Ni joints were NiSn4 phase. After the reflow process and thermal aging of different joints, the growth behavior of interfacial layer was different due to the different mechanism of element diffusion of the two substrates. The PC Ni substrate mainly provided Ni atoms through grain boundary diffusion. The Ni3Sn4 phase of the Sn0.05Ni/PC Ni joint was finer, and the diffusion flux of Sn and Ni elements increased, so the Ni3Sn4 layer of this joint was the thickest. The SC Ni substrate mainly provided Ni atoms through the lattice diffusion. The Sn0.1Ni/SC Ni joint increases the number of Ni atoms at the interface due to the doping of 0.1Ni (wt.%) elements, so the joint had the thickest NiSn4 layer. Design/methodology/approach The effects of doping minor Ni on the microstructure evolution of an Sn-xNi (x = 0, 0.05 and 0.1 Wt.%)/Ni (Poly-crystal/Single-crystal abbreviated as PC Ni/SC Ni) solder joint during reflow and aging treatment was investigated in this study. Findings Results showed that the intermetallic compounds (IMCs) of the interfacial layer of Sn-xNi/PC Ni joints were Ni3Sn4 phase, while the IMCs of Sn-xNi/SC Ni joints were NiSn4 phase. After the reflow process and thermal aging of different joints, the growth behavior of the interfacial layer was different due to the different mechanisms of element diffusion of the two substrates. Originality/value In this study, the effect of doping Ni on the growth and formation mechanism of IMCs of the Sn-xNi/Ni (single-crystal) solder joints (x = 0, 0.05 and 0.1 Wt.%) was investigated.

Sign in / Sign up

Export Citation Format

Share Document