scholarly journals A Joining Process between Beryllium and Reduced-Activation Ferritic–Martensitic Steel by Plasma Sintering

Materials ◽  
2021 ◽  
Vol 14 (21) ◽  
pp. 6348
Author(s):  
Jae-Hwan Kim ◽  
Taehyun Hwang ◽  
Masaru Nakamichi
Keyword(s):  
Intermetallic Compounds ◽  
Reaction Layer ◽  
Martensitic Steel ◽  
Layer Growth ◽  
Elemental Mapping ◽  
Parabolic Law ◽  
Plasma Sintering ◽  
Kinetics Of ◽  
Joining Process ◽  
Scanning Electron

To investigate the growth kinetics of the reaction layer and mechanical strength of joined materials, we joined beryllium and reduced-activation ferritic–martensitic steel (F82H) by plasma sintering under various conditions and characterized the joined region. Scanning electron microscopy revealed that the thickness of the reaction layer increased with an increase in the joining time and temperature. Line analyses and elemental mapping using an electron microprobe analyser showed that the reaction layer consists of Be–Fe intermetallic compounds, including Be12Fe, Be5Fe, and Be2Fe, with small amounts of chromium and tungsten. Owing to the time and temperature dependence of the reaction-layer thickness, the layer growth of Be–Fe intermetallic compounds obeys the parabolic law, and the activation energy for the reaction-layer growth was 116.2 kJ/mol. The bonding strengths of the joined materials varied inversely with the thickness of the reaction layer.

Influence of Content of Ni and Ag on Microstructure and Joint Strength of Lead-Free Solder Joint with Sn-Ag-Cu-Ni-Ge

2007 ◽  
Vol 353-358 ◽  
pp. 2033-2036 ◽  
Author(s):  
Ikuo Shohji ◽  
Satoshi Tsunoda ◽  
Hirohiko Watanabe ◽  
Tatsuhiko Asai
Keyword(s):  
Reaction Layer ◽  
Joint Strength ◽  
Heat Exposure ◽  
Layer Growth ◽  
Lead Free ◽  
Joint Interface ◽  
Lead Free Solder ◽  
Free Solder ◽  
Kinetics Of ◽  
Soldered Joint

An influence of content of Ni and Ag in a Sn-Ag-Cu-Ni-Ge lead-free solder has been investigated on microstructure and joint strength of the soldered joint under heat exposure conditions. The growth kinetics of the reaction layer formed at the joint interface has been investigated, and the apparent activation energy of the reaction layer growth has been also examined. Moreover, the soldered joints with Sn-Ag and Sn-Ag-Cu solders were prepared and were compared with the joints with the Sn-Ag-Cu-Ni-Ge solders.

Interfacial Reactions between Cu-Zr filler metal and alumina and kinetics of reaction layer growth

1998 ◽  
Vol 4 (2) ◽  
pp. 151-155 ◽  
Author(s):  
K. S. Bang ◽  
S. Liu
Keyword(s):  
Reaction Layer ◽  
Filler Metal ◽  
Layer Growth ◽  
Interfacial Reactions ◽  
Kinetics Of Reaction ◽  
Kinetics Of

Microstructural Development at Ti-Based Alloy/Coated SiC

1994 ◽  
Vol 343 ◽  
Author(s):  
M. Strangwood ◽  
C.B. Ponton ◽  
M.P. Delplancke ◽  
V. Vassileris ◽  
R. Winand
Keyword(s):  
Reaction Layer ◽  
Carbon Diffusion ◽  
Growth Conditions ◽  
Layer Growth ◽  
Microstructural Development ◽  
Composition And Structure ◽  
Kinetics Of Formation ◽  
Prolonged Heat ◽  
Kinetics Of ◽  
Rate Controlling Step

ABSTRACTThe kinetics of formation of reaction layers at the interface between a Ti-based alloy (β-21s) and graphite blocks coated first, by CVD techniques, with a 100 μm layer of SiC and then either TiC or C were determined. The rate controlling step for reaction at 900°C and 10 MPa for up to 6 hours was found to be carbon diffusion through the reaction layer. The behaviour was found to be consistent with that of composite systems for prolonged heat treatment and the same growth behaviour was exhibited by both systems. Incubation times of 0.42 and 0.9 hours were determined for reaction layer growth in the TiC- and C-coated systems respectively. The reaction layer/Ti-alloy bond strength was good but all couples failed readily, especially if any C layers remained. The growth conditions of TiC coatings by reactive magnetron sputtering were determined for two different types of gas mixtures: CH4/Ar and C2H2/Ar. The composition and structure of the films were extensively studied.

INTERMETALLIC COMPOUND FORMATION IN Ni/Sn DIFFUSION COUPLE AT ATMOSPHERIC AND AT 10−8 ATMOSPHERE PRESSURE

2017 ◽  
Vol 24 (Supp02) ◽  
pp. 1850023
Author(s):  
N. ADIOUI ◽  
E. B. HANNECH ◽  
W. GUERGUEB ◽  
M. BOUOUDINA
Keyword(s):  
Electron Microscopy ◽  
Interfacial Layer ◽  
Phase Layer ◽  
Compound Formation ◽  
Atmosphere Pressure ◽  
X Ray ◽  
Parabolic Law ◽  
Intermetallic Compound Formation ◽  
Kinetics Of ◽  
Scanning Electron

The microstructure resulting from diffusion reactions, at solid-state temperatures, in Ni/Sn couples has been studied by scanning electron microscopy (SEM) and energy dispersive X-ray (EDX). The Ni3Sn4 phase was the only reaction product which formed in the couples at temperatures from 150[Formula: see text]C to 220[Formula: see text]C. The growth kinetics of Ni3Sn4 layer followed the parabolic law with an apparent activation energy of 104[Formula: see text]kJ[Formula: see text]mol[Formula: see text]. The effect of the atmosphere on the microstructure of the interfacial layer was investigated at 220[Formula: see text]C for a pressure of 10[Formula: see text][Formula: see text]atm. A decrease in the growth rate of the phase layer was observed.

scholarly journals Behavior of Intermetallic Compounds of Al-Ti Composite Manufactured by Spark Plasma Sintering

Materials ◽  
2019 ◽  
Vol 12 (2) ◽  
pp. 331 ◽  
Author(s):  
Kwangjae Park ◽  
Dasom Kim ◽  
Kyungju Kim ◽  
Seungchan Cho ◽  
Hansang Kwon
Keyword(s):  
Intermetallic Compounds ◽  
Spark Plasma Sintering ◽  
Electron Probe ◽  
High Hardness ◽  
X Ray Diffraction ◽  
X Ray ◽  
Plasma Sintering ◽  
Formation Behavior ◽  
Spark Plasma ◽  
Scanning Electron

In this research, we successfully fabricate high-hardness and lightweight Al-Ti composites. Al-Ti composites powders with three compositions (Al-20, 50, and 80 vol.% Ti) are mixed using ball milling and subsequently subjected to spark plasma sintering (SPS). The microstructures and phases of the Al-Ti composites are characterized using scanning electron microscopy (SEM), X-ray diffraction (XRD) spectroscopy, and field emission-electron probe microanalysis (FE-EPMA). These tests confirm the presence of several intermetallic compounds (ICs) (Al3Ti, Al5Ti2, Al11Ti5) in the composites, and we are able to confirm that these ICs are produced by the reaction of Al and Ti during the SPS process. Furthermore, thermogravimetric-differential thermal analysis (TG-DTA) is used to analyze the formation behavior of the ICs. In addition, the mechanical properties of the composites are measured using their Vickers hardness and it is observed that the Al-80 vol.% Ti composite exhibits the highest hardness. Consequently, it is assumed that SPS is suitable for fabricating Al-Ti composites which represent the next-generation materials to be used in various industrial fields as high-hardness and lightweight materials.

Reaction Diffusion in Pb Free Solder-Cu System

2010 ◽  
Vol 297-301 ◽  
pp. 796-801
Author(s):  
O. Taguchi ◽  
C.G. Lee ◽  
D.Y. Park ◽  
G.S. Shin ◽  
Shigeru Suzuki ◽  
...  
Keyword(s):  
Intermetallic Compounds ◽  
Layer Thickness ◽  
Reaction Diffusion ◽  
Diffusion Time ◽  
Phase Form ◽  
Diffusion Behavior ◽  
Parabolic Law ◽  
Free Solder ◽  
Pure Cu ◽  
Kinetics Of

Reaction diffusion in liquid Pb free solder- and solid Pb free solder- pure Cu systems has been investigated in the temperature range between 397 K and 563 K. The Pb free solder of which composition is 95.7 mass% Sn, 2.8 mass% Ag, 1.0 mass% Bi and 0.5 mass% Cu and 99.99 mass% oxygen free Cu has been used. In the liquid Pb free solder-pure Cu system, as soon as the solder melted down, an intermetallic compound phase formed preferentially, and grew with increasing diffusion time. Only the phase exists in the experimental time up to 120 seconds. The layer thickness of the phase obeyed the parabolic law. On the other hand, in the solid Pb free solder-pure Cu system two intermetallic compounds  phase and ’ phase form and grew with increasing diffusion time, although the  phase forms after an incubation time at low temperature. The layer thickness of these intermetallic compounds obeyed the parabolic law. The growth rate of ’ phase is greater than that of the  phase. The growth kinetics of the intermetallic compounds and the diffusion behavior in the ’ phase have been investigated.

Growth Kinetics of Intermetallic Compounds at the Interface of Liquid Sn-9Zn/Cu

2011 ◽  
Vol 233-235 ◽  
pp. 2323-2327
Author(s):  
Hui Zhen Huang ◽  
Xiu Qin Wei ◽  
Lang Zhou
Keyword(s):  
Activation Energy ◽  
Intermetallic Compound ◽  
Intermetallic Compounds ◽  
Solder Alloy ◽  
Growth Kinetics ◽  
Layer Growth ◽  
Experimental Results ◽  
Cu Substrate ◽  
Diffusion Mechanisms ◽  
Kinetics Of

The morphology and growth of the intermetallic compound (IMC) formed between liquid Sn-9Zn eutectic solder alloy and Cu at 220-260°C was investigated. Experimental results showed that γ-Cu5Zn8 was present at the Sn-9Zn/Cu interface as the reaction product. The IMC layer growth follows the parabolic-growth law, which indicates that the growth of the IMC is controlled by the diffusion mechanisms. The activation energy of γ-Cu5Zn8 layer growth for liquid Sn-9Zn reacting with Cu substrate is determined as 50.5 KJ/mol.

Formation sequence of intermetallics and kinetics of reaction layer growth during solid state reaction between titanium and aluminum

Materialia ◽  
2020 ◽  
Vol 11 ◽  
pp. 100702
Author(s):  
Amlan Kar ◽  
Satish V. Kailas ◽  
Satyam Suwas
Keyword(s):  
Solid State ◽  
Reaction Layer ◽  
Solid State Reaction ◽  
Layer Growth ◽  
Kinetics Of Reaction ◽  
Kinetics Of

Oxidation Behaviour of WE54 and Elektron 21 Magnesium Alloys

2011 ◽  
Vol 312-315 ◽  
pp. 483-488 ◽  
Author(s):  
Andrzej Kiełbus ◽  
Tomasz Rzychoń ◽  
Roman Przeliorz
Keyword(s):  
Electron Microscopy ◽  
Scanning Electron Microscopy ◽  
Oxidation Kinetics ◽  
Oxidation Behaviour ◽  
X Ray Diffraction ◽  
X Ray ◽  
Parabolic Law ◽  
Supersaturated State ◽  
Kinetics Of ◽  
Scanning Electron

In the present study, the isothermal early oxidation behaviour of the WE54 and Elektron 21 alloys were studied at a temperature of 773 K in pure O2 up to 150 min. The results showed that the oxidation kinetics depending on the chemical composition and microstructure of the investigated alloys. The oxidation kinetics of these alloys in as-cast and T6 conditions obtained a parabolic law, while in supersaturated state these alloys exhibited a linear kinetics. Scanning electron microscopy (SEM) and X-ray diffraction (XRD) analyses indicated that an oxide film, composed of MgO and (Y,Dy)2O3 in WE54 alloy and (Nd,Gd)2O3 in Elektron 21 alloy, had been formed.

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