scholarly journals Enhancement of the Mechanical Properties of Polyimide Film by Microwave Irradiation

Polymers ◽  
2019 ◽  
Vol 11 (3) ◽  
pp. 477 ◽  
Author(s):  
Ju-Young Choi ◽  
Seung-Won Jin ◽  
Dong-Min Kim ◽  
In-Ho Song ◽  
Kyeong-Nam Nam ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Irradiation Time ◽  
Polyimide Film ◽  
Amic Acid ◽  
Polyimide Films ◽  
Inorganic Substance ◽  
Short Irradiation Time ◽  
Green Approach ◽  
Thermal Imidization ◽  
Mw Irradiation

Polyimide films have conventionally been prepared by thermal imidization of poly(amic acid)s (PAAs). Here we report that the improvement of tensile strength while increasing (or maintaining) film flexibility of polyimide films was accomplished by simple microwave (MW) irradiation of the PAAs. This improvement in mechanical properties can be attributed to the increase in molecular weight of the polyimides by MW irradiation. Our results show that the mechanical properties of polyimide films can be improved by MW irradiation, which is a green approach that requires relatively low MW power, very short irradiation time, and no incorporation of any additional inorganic substance.

Surface Modification-Based Fabrication of Double Surface Highly Reflective and Conductive Metallized Polymeric Films and Microstructural Tuning Nanocomposite Layers

2006 ◽  
Vol 11-12 ◽  
pp. 497-500
Author(s):  
Zhan Peng Wu ◽  
De Zhen Wu ◽  
Fang Li ◽  
Feng Hong Hong ◽  
Sheng Li Qi ◽  
...  
Keyword(s):  
Electron Microscopy ◽  
Film Surface ◽  
Silver Ions ◽  
Polyimide Film ◽  
Amic Acid ◽  
Silver Clusters ◽  
Polyimide Films ◽  
Near Surface ◽  
Double Surface ◽  
Conductive Surfaces

Silvered polyimide films have been prepared by alkali hydroxylation of polyimide film surface and incorporation of silver ions through subsequent ion exchange. Thermal curing had not only re-cycloimidized the poly(amic acid) into polyimide, but also reduced silver ions into silver atoms and near-atomic silver clusters, which diffused and aggregated to give reflective and conductive surfaces without addition of reducing agents. By this method, silvered polyimide films can be easily fabricated with double excellent reflective (reflectivity > 97%) and conductive surfaces (surface resistance: 0.02 /sq), outstanding metal-polymer adhesion, high mechanical properties, and controllable thickness of silver layers at modest cost. As the side-to-side near-surface microstructure difference in the laboratory made samples and commercial PI films, the thickness of alkali induced hydrolysis, loading of silver ions and forming of silver layers at the two sides of the polyimide films were also discussed here. Films were characterized by transmission electron microscopy (TEM), scanning electron microscopy (SEM) and tapping mode atomic force microscopy (AFM). Results show that continuous silver layers were formed on the polyimide films.

Thermal And Mechanical Properties Of Polyimide Films

1995 ◽  
Vol 381 ◽  
Author(s):  
S. T. Chen
Keyword(s):  
Mechanical Properties ◽  
Structural Integrity ◽  
Polyimide Film ◽  
Thermal And Mechanical Properties ◽  
Polyimide Films ◽  
Low Dielectric ◽  
Semiconductor Chip ◽  
Thermal Expansion Coefficients ◽  
Microelectronic Devices ◽  
Processing Cost

AbstractIn recent years, polyimide film has become a commonly used insulator for microelectronic devices including advanced semiconductor chip and high density packaging. It has the advantages of low dielectric constant, thermal stability and low processing cost. In general, it is important to understand both the thermal and mechanical properties of a microelectronic material. Thermal and mechanical properties play very important roles in terms of determining the device structural integrity. Mismatch of material properties could cause feasibility and reliability problems. These properties are also essential for mechanical stress and thermal stress modeling studies. Biphenyldianhydride-Phenylenediamine (BPDA-PDA) and Pyromellitic Dianhydride-Oxydianiline (PMDA-ODA) are two commonly used polyimide films in electronic industry. Their thermal expansion coefficients and mechanical properties were studied and reported here.

Naphthalene Containing Polyimide Nanocomposites Hybrid with Organo-Modified Montmorillonite

2006 ◽  
Vol 111 ◽  
pp. 43-46
Author(s):  
B.K. Chen ◽  
S.Y. Tsay ◽  
C.P. Chen
Keyword(s):  
Mechanical Properties ◽  
Thermal Stability ◽  
Dielectric Constant ◽  
Amic Acid ◽  
Aggregate Formation ◽  
Thermal And Mechanical Properties ◽  
Modified Montmorillonite ◽  
Thermal Imidization ◽  
Tetracarboxylic Dianhydride ◽  
Acid Precursor

To improve the thermal and mechanical properties of polyimides, a nanocomposite of naphthalene containing polyimide (PI) was hybridized with Montmorillonite (MMT). The PI was synthesized from a diamine, 2,7-bis (4-aminophenoxy) naphthalene and polymerized with a 3,3’,4,4’-benzophenone tetracarboxylic dianhydride via thermal imidization. PI-MMT nanocomposites were then prepared from a DMAc solution of poly(amic acid) precursor and a DMAc dispersion of MMT which were organo-modified with various amount of n-dodecylamine. Characterization results demonstrated that the introduction of a small amount of MMT (up to 5%) led to enhanced thermal stability and mechanical properties of PI. The 5% weight loss temperature in N2 was increased by 46oC in comparison to pristine PI with an organoclay content of 5%. The CTE and dielectric constant were decreased. However, at organoclay contents higher than 5% these properties were reduced because the organoclay was poorly dispersed and resulted in aggregate formation.

Effect of Alkali Treatment on the Mechanical Property of Polyimide Film

2017 ◽  
Vol 744 ◽  
pp. 364-369 ◽  
Author(s):  
Ming Yu Zhang ◽  
Li Zhu Liu ◽  
K.S. Hui ◽  
K.N. Hui
Keyword(s):  
Mechanical Properties ◽  
Ion Exchange ◽  
Treatment Time ◽  
Alkali Treatment ◽  
Polyimide Film ◽  
Polyimide Films ◽  
Future Studies ◽  
Polyimide Composites ◽  
First Time ◽  
Better Than

Polyimide films treated with an alkali and ion exchange undergo surface-confined hydrolysis to produce polyimide composites. On the other hand, it is unclear what impact this method has on the mechanical properties of PI films. This paper reports the effects of the mechanical properties of PI films exposed to an alkali (KOH) solution with different treatment time. The mechanical properties of the re-cycloimidization PI films were improved when the proper initial KOH treatment time was used. The reason might be that PI could effectively reduce the formation of the shear zone to cracks due to the increase in ductility after the proper KOH treatment and more ductile PI chains led to re-orientation at the drawing process. Therefore, the strength and elongation of the re-cycloimidization PI films were better than those of the pristine PI films. This study focused on the effects of the KOH treatment on the mechanical properties of the PI film for the first time and proposed a mechanism to explain the reason that the appropriate time of KOH treatment can enhance the mechanical properties. The results presented here can provide guidelines for preparing composite PI films via ion-exchange by the proper KOH treatment time in future studies.

Synthesis of 1,4-Bis(3-amino-5-trifluoromethylphenoxy)Benzene and Properties of the Polyimide Film Therefrom

2012 ◽  
Vol 581-582 ◽  
pp. 297-300
Author(s):  
Yun Hua Lu ◽  
Bing Wang ◽  
Guo Yong Xiao ◽  
Zhi Zhi Hu
Keyword(s):  
Catalytic Reduction ◽  
Visible Region ◽  
Optical Transmittance ◽  
Polyimide Film ◽  
Amic Acid ◽  
Decomposition Temperature ◽  
Structure And Properties ◽  
Thermal Decomposition Temperature ◽  
Fluorinated Polyimides ◽  
Thermal Imidization

Firstly, 1,4-bis(3-nitro-5-trifluoromethylphenoxy)benzene(I) was synthesized through the nucleophilic substitution reaction of 3,5-dinitrobenzotrifluoride and 1,4-dihydroxybenzene in the presence of potassium carbonate. Then, the diamine monomer 1,4-bis(3-amino-5-trifluoromethylphenoxy)benzene (II) was obtained through the catalytic reduction with hydrazine and Pd/C. These fluorinated polyimides (PI) were synthesized from the fluorinated diamine II with four kinds of dianhydrides, including pyromellitic dianhydride (PMDA), 3,3’,4,4’-biphenyltetracarboxylic acid dianhydride (BPDA), 3,3’,4,4’-oxydiphthalic anhydride (ODPA) and 3,3’,4,4’-benzophenonetetracarboxylicdianhydride (BTDA) respectively, via thermal imidization of poly(amic acid) (PAA). The structure and properties of these obtained fluorinated PIs were characterized. These experimental results showed that these fluorinated PI films exhibited excellent optical transmittance in the visible region and thermal resistance. The PI derived from ODPA showed the best optical transparency with the transmittance higher than 85.38 % at 450 nm. These PIs also exhibited good thermal properties with 5 wt% thermal decomposition temperature above 533 °C.

Mechanical Properties of Photosensitive Polyimide Film by Nanoindentation and Microtensile Test

2005 ◽  
Vol 297-300 ◽  
pp. 237-243 ◽  
Author(s):  
Shin Hur ◽  
Sung In Hong ◽  
Dong Kil Shin
Keyword(s):  
Mechanical Properties ◽  
Young’S Modulus ◽  
Young's Modulus ◽  
Polyimide Film ◽  
Nanoindentation Test ◽  
Strain Rates ◽  
Polyimide Films ◽  
Free Standing ◽  
Micro Fabrication ◽  
Microtensile Test

A free-standing photosensitive polyimide film with thickness of 10µm is fabricated with the different curing temperatures using a micro fabrication process. The microtensile specimens of a strip type are made to facilitate a tensile testing. The Young’s modulus and yield strength of photosensitive polyimide film are measured with various strain rates from 10-4 /s to 10-3 /s by using a microtensile test. Also, the hardness and Young’s modulus of polyimide films are obtained from nanoindentation test. Finally, the mechanical properties measured from microtensile test are compared with those from nanoindentation test.

The link between the mechanical properties produced by thermal imidization of poly-(p,p′-diphenylenoxy)pyromellitic amic acid and the reaction conditions

1981 ◽  
Vol 23 (4) ◽  
pp. 915-922 ◽  
Author(s):  
V.V Korshak ◽  
G.L Berestneva ◽  
V.A Marikhin ◽  
L.P Myasnikova ◽  
A.N Lomteva ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Amic Acid ◽  
Reaction Conditions ◽  
Thermal Imidization

scholarly journals Colorless Polyimides Derived from an Alicyclic Tetracarboxylic Dianhydride, CpODA

Polymers ◽  
2021 ◽  
Vol 13 (16) ◽  
pp. 2824
Author(s):  
Hiroki Ozawa ◽  
Eriko Ishiguro ◽  
Yuri Kyoya ◽  
Yasuaki Kikuchi ◽  
Toshihiko Matsumoto
Keyword(s):  
Dipole Interaction ◽  
Amic Acid ◽  
Polymer Chains ◽  
Thermal Method ◽  
Polyimide Films ◽  
Molecular Weights ◽  
Flexible Films ◽  
Thermal Imidization ◽  
Tetracarboxylic Dianhydride ◽  
Low Temperature Cure

An alicyclic tetracarboxylic dianhydride having cyclopentanone bis-spironorbornane structure (CpODA) was polycondensated with aromatic dianhydrides to form the corresponding poly(amic acid)s which possessed logarithmic viscosities in the range 1.47–0.54 dL/g. The poly(amic acid) was imidized by three methods: a chemical, a thermal, and a combined chemical and thermal process. In a thermal method, imidization temperature markedly influenced the film quality and molecular weight of the polyimide. When the poly(amic acid) was cured over the Tg of the corresponding polyimide, the flexible polyimide films were obtained and the molecular weights increased several times, which means that the post-polymerization took place. In spite of low-temperature cure below Tg flexible films with the imidization ratio of 100% were fabricated by a combined chemical and thermal imidization technique. The films possessed the decomposition temperatures in a range of 475–501 °C and Tgs over 330 °C. The high Tg results from a dipole–dipole interaction between the keto groups of the polymer chains as well as development of the rigid polyalicyclic unit. The polyimide films exhibited CTE between 17 and 57 ppm/K. All the films fabricated were entirely colorless and possessed the λcut-offs shorter than 337 nm. Notably, the films prepared by a chemical method exhibited outstanding optical properties.

scholarly journals INVESTIGATION OF MECHANICAL PROPERTIES OF POLYIMIDE FILMS UNDER THE INFLUENCE OF LABORATORY-SIMULATED SPACE FACTORS

2018 ◽  
Keyword(s):  
Mechanical Properties ◽  
Ultimate Strength ◽  
Elastic Deformation ◽  
Mechanical Characteristics ◽  
Proton Irradiation ◽  
Polyimide Film ◽  
Irreversible Deformation ◽  
Total Deformation ◽  
Polyimide Films ◽  
Republic Of China

In work the mechanical properties of polyimide films analogue kapton-H (manufactures of the People's Republic of China) by thickness 75 microns are studied in conditions of uniaxial stretching at temperature 293 K after influence of space factors - a separate and joint irradiation by protons and electrons with energy Е=160 keV and fluence (the total flow of particles with incident on the samples) F=1016 cm-2. The limit of the forced elasticity, the ultimate strength, the total strain before fracture and the contributions to the total deformation related to the elastic deformation occurring in the linear stage, the total forced elastic and irreversible deformation that contribute to the overall deformation of the samples at the nonlinear stage are determined. The total forced elastic deformation consists of a highly elastic deformation, reversible at the test temperature, and delayed elastic deformation. After exposure to irradiation, an increase in the limit of the forced elasticity of the films by 5-11%, a decrease in the ultimate strength by 10-14%, and a reduction in the total deformation by 20-28% were found. The maximum change in all mechanical characteristics occurs under the influence of proton irradiation. It is established that the decrease in the total deformation of irradiated films is mainly due to a 80% reduction in the contribution of irreversible deformation. The contribution of the total forced elastic deformation of the polyimide film practically does not change after irradiation, which has important scientific and applied significance.

Synthesis and Properties of Polyimides Containing Tert-Buty Group

2013 ◽  
Vol 275-277 ◽  
pp. 1636-1639
Author(s):  
Yun Hua Lu ◽  
Peng Pan ◽  
Bing Wang ◽  
Hong Bin Zhao ◽  
Zhi Zhi Hu
Keyword(s):  
Optical Properties ◽  
Fourier Transform ◽  
Amic Acid ◽  
Structure And Properties ◽  
Visible Spectroscopy ◽  
Polyimide Films ◽  
Solubility Test ◽  
Tert Butyl ◽  
Thermal Imidization ◽  
Ft Ir

Two diamine monomers 2-tert-butyl-1,4-bis(4-nitro-2-trifluoromethylphenoxy)benzene and 1,4-bis(4-amino-2-trifluoromethylphenoxy)benzene were reacted with the alicyclic dianhydride monomers 1,2,3,4-cyclobutanetetracarboxylic dianhydride to synthesize the poly(amic acid)s, and then obtain the corresponding polyimide films through thermal imidization. The structure and properties were characterized by fourier transform infrared spectroscopy (FT-IR), ultraviolet visible spectroscopy (UV-vis), thermogravimetic analysis (TGA), solubility test and so on. The effect of introduction of bulky tert-butyl and trifluoromethyl to the polyimide backbone on the properties of polyimide films was investigated. The experimental results showed that polyimides with tert-buty group exhibit excellent solubility, but their thermal and optical properties decreased slightly.

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