scholarly journals Recent Advances in ASIC Development for Enhanced Performance M-Sequence UWB Systems

Sensors ◽  
2020 ◽  
Vol 20 (17) ◽  
pp. 4812 ◽  
Author(s):  
Pavol Galajda ◽  
Martin Pecovsky ◽  
Miroslav Sokol ◽  
Martin Kmec ◽  
Dusan Kocur

Short-range ultra-wideband (UWB) radar sensors belong to very promising sensing techniques that have received vast attention recently. The M-sequence UWB sensing techniques for radio detection and ranging feature several advantages over the other short-range radars, inter alia superior integration capabilities. The prerequisite to investigate their capabilities in real scenarios is the existence of physically available hardware, i.e., particular functional system blocks. In this paper, we present three novel blocks of M-sequence UWB radars exploiting application-specific integrated circuit (ASIC) technology. These are the integrated 15th-order M-sequence radar transceiver on one chip, experimental active Electronic Communication Committee (ECC) bandpass filter, and miniature transmitting UWB antenna with an integrated amplifier. All these are custom designs intended for the enhancement of capabilities of an M-sequence-based system family for new UWB short-range sensing applications. The design approaches and verification of the manufactured prototypes by measurements of the realized circuits are presented in this paper. The fine balance on technology capabilities (Fc of roughly 120 GHz) and thoughtful design process of the proposed blocks is the first step toward remarkably minimized devices, e.g., as System on Chip designs, which apparently allow broadening the range of new applications.

2017 ◽  
Vol 02 (04) ◽  
pp. 1750005
Author(s):  
Oscar Alonso ◽  
Angel Diéguez ◽  
Sebastian Schostek ◽  
Marc O. Schurr

This paper addresses the circuit implementation challenges resulting from the integration of a therapeutic clip in a magnetically maneuverable wireless capsule intended for colonoscopy. To deal with the size constraints typical of a capsule endoscope, an Application Specific Integrated Circuit (ASIC) has been designed specifically to habilitate the release of the therapeutic clip. The ASIC is a complete System on Chip (SoC) that incorporates a circuit for the low power release of the clip, thus overcoming the limitations of the power supply system. With a size of 14[Formula: see text]mm2, the ASIC can be incorporated in practically any capsule endoscope, consuming only an idle-state power of 1.5[Formula: see text]mW.


2004 ◽  
Vol 52 (9) ◽  
pp. 2105-2122 ◽  
Author(s):  
I. Gresham ◽  
A. Jenkins ◽  
R. Egri ◽  
C. Eswarappa ◽  
N. Kinayman ◽  
...  

2016 ◽  
Vol 841 ◽  
pp. 309-314
Author(s):  
Dragos Ronald Rugescu

One of the most challenging problems in developing the astrionics of the recoverable orbital ADDAHORSE microcapsule is represented by the power and size constraints which require an extreme degree of miniaturization. The size, mass and power requirements of the electronic and computing (astrionics) on-board control and command equipment can be conveniently reduced by designing an Application Specific Integrated Circuit (ASIC) which integrates sensors, autopilot logic, drivers, RF communication and interface subsystems in a single, combined SoC (System-on-Chip). The feasibility of such a device is discussed here within the bounds of the ADDAHORSE project which was proposed for structural funding in Romania in 2014. This study was conducted by the Center for Innovation and Development in the Exploration of Space (CIDES) in the emerging Făgăraș facility of the future Făgăraș Space Center in Romania.


Author(s):  
Joachim Massen ◽  
Michael Frei ◽  
Wolfgang Menzel ◽  
Ulrich Möller

The field of short- and mid-range radar sensors for automotive comfort and safety systems is a fast-growing market. The frequency regulation provides a new 76–81 GHz frequency band, which will be mandatory in the EU for ultra-wideband sensors from 2018. In the “radar-on-chip for cars” (RoCC) project funded by the German Ministry of Research (BMBF), a new technology was developed based on SiGe components with the objective to make the sensors affordable for all car platforms. This paper reports on the contribution of Continental A.D.C. GmbH to the joint “RoCC” project. The aim of the project was to exploit the cost-reduction potential of the SiGe technology by a further integration of the individual components and to show that the reliability and the functionality of the new sensors can meet the current requirements of the market. For this purpose, we evaluated the new eWLB package technology of Infineon. The Institute of Microwave Techniques of the University of Ulm supported us in designing a substrate integrated slotted waveguide antenna array. Demonstration sensors for short- and mid-range applications were built up and tested in the laboratory. To show the ability of the sensors to deal with real scenarios on the road, they were integrated into an experimental vehicle.


2015 ◽  
Vol 3 (2) ◽  
pp. 1-14
Author(s):  
Abbas Saleh Hassan

Impulse Radio - Ultra Wideband (IR-UWB) is a wireless technology system that offers a high data rate within a short range. Therefore, IR-UWB system is regarded as an excellent physical layer solution to the multi-piconet Wireless Personal Area Network (WPAN) applications. In spite of all the advantages of IR-UWB, there are several fundamental and practical challenges that need to be carefully addressed. The big and most important one among these challenges is the interference. Two types of Rake receivers are designed and simulated to highly mitigate the MUI these are (PRake receiver) and (SRake receiver).


Author(s):  
K. N. Hooghan ◽  
K. S. Wills ◽  
P.A. Rodriguez ◽  
S.J. O’Connell

Abstract Device repair using Focused Ion Beam(FIB) systems has been in use for most of the last decade. Most of this has been done by people who have been essentially self-taught. The result has been a long learning curve to become proficient in device repair. Since a great deal of the problem is that documentation on this “art form” is found in papers from many different disciplines, this work attempts to summarize all of the available information under one title. The primary focus of FIB device repair is to ensure and maintain device integrity and subsequently retain market share while optimizing the use of the instrument, usually referred to as ‘beam time’. We describe and discuss several methods of optimizing beam time. First, beam time should be minimized while doing on chip navigation to reach the target areas. Several different approaches are discussed: dead reckoning, 3-point alignment, CAD-based navigation, and optical overlay. Second, after the repair areas are located and identified, the desired metal levels must be reached using a combination of beam currents and gas chemistries, and then filled up and strapped to make final connections. Third, cuts and cleanups must be performed as required for the final repair. We will discuss typical values of the beam currents required to maintain device integrity while concurrently optimizing repair time. Maintaining device integrity is difficult because of two potentially serious interactions of the FIB on the substrate: 1) since the beam consists of heavy metal ions (typically Gallium) the act of imaging the surface produces some physical damage; 2) the beam is positively charged and puts some charge into the substrate, making it necessary to use great care working in and around capacitors or active areas such as transistors, in order to avoid changing the threshold voltage of the devices. Strategies for minimizing potential damage and maximizing quality and throughput will be discussed.


Electronics ◽  
2021 ◽  
Vol 10 (6) ◽  
pp. 679
Author(s):  
Jongpal Kim

An instrumentation amplifier (IA) capable of sensing both voltage and current at the same time has been introduced and applied to electrocardiogram (ECG) and photoplethysmogram (PPG) measurements for cardiovascular health monitoring applications. The proposed IA can switch between the voltage and current sensing configurations in a time–division manner faster than the ECG and PPG bandwidths. The application-specific integrated circuit (ASIC) of the proposed circuit design was implemented using 180 nm CMOS fabrication technology. Input-referred voltage noise and current noise were measured as 3.9 µVrms and 172 pArms, respectively, and power consumption was measured as 34.9 µA. In the current sensing configuration, a current noise reduction technique is applied, which was confirmed to be a 25 times improvement over the previous version. Using a single IA, ECG and PPG can be monitored in the form of separated ECG and PPG signals. In addition, for the first time, a merged ECG/PPG signal is acquired, which has features of both ECG and PPG peaks.


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