Test of IGBT Transient Thermal Impedance and Modeling Research on Thermal Model

2010 ◽  
Vol 148-149 ◽  
pp. 429-433
Author(s):  
Ming Chen ◽  
Yan Ting Yu ◽  
Bo Wang ◽  
Yong Tang
Keyword(s):  
Numerical Simulation ◽  
Thermal Resistance ◽  
Thermal Model ◽  
Transfer Characteristic ◽  
Physical Structure ◽  
Experimental Results ◽  
Compact Model ◽  
Thermal Impedance ◽  
Impedance Curve ◽  
Transient Thermal

As the operation performances and reliability of semiconductor devices are tightly related to its operating temperature, the research on the heat transfer characteristic and thermal modeling do a significant meaning to extend services lifetime and improve application reliability of the IGBT modules. The physical structure and the conception, RC component network of thermal resistance, test principle and platform of the transient thermal impedance of IGBT module and three modeling methods are briefly introduced. The parameters of Cauer RC thermal network of a certain type IGBT is derived based on transmission line method. The junction-case thermal resistance can be deduced by Finite Element Method in the numerical simulator ANSYS and the transient thermal impedance curve. Thermal compact model can also be deduced from the numerical simulation and experimental results. An excellent agreement is obtained between experimental results derived by the transient thermal impedance curve and numerical simulation results based on FEM. The thermal compact model and experimental results could be helpful for modeling of thermal model and heat sink design for such electronic devices.

Investigation Regarding Thermal Resistance of Surface Mount Type Discrete Power Semiconductor Package

2020 ◽  
Author(s):  
Koji Nishi
Keyword(s):  
Thermal Resistance ◽  
Three Dimensional ◽  
Thermal Impedance ◽  
Power Devices ◽  
Power Semiconductor ◽  
Resistance Variation ◽  
Motor Design ◽  
Impedance Curve ◽  
The Difference ◽  
Transient Thermal

Abstract Power electronics is becoming more important than before with motor application expansion. For size reduction of inverter integrated motor design, accurate temperature prediction of power devices is becoming critical. For up to several hundred-watt motor system, inverter is designed with discrete power devices with standard package. This paper investigates package thermal resistance of a DPAK package as an example. Firstly, three-dimensional heat conduction simulation only with DPAK package model is conducted. It is found that its package thermal resistance changes by ∼6.2°C/W due to boundary condition variation. After that, simulation not only with DPAK package but also with PCB is conducted to understand package thermal resistance of a real system implementation case. It is found that package thermal resistance varies drastically by copper trace size. “Smallest” case with minimum copper traces shows ∼0.9 °C/W higher value than larger copper trace case and shows ∼1.5 °C/W higher value than the case that copper trace fully covers PCB top surface, in the case that horizontal PCB size is 50 × 50 mm. After that, two types of test boards with different trace size for of n-channel MOSFET with DPAK package are prepared. Measurements are conducted to know package thermal resistance variation by copper trace size. Transient thermal impedance curve is obtained from measurement result and is converted to a cumulative Rth-Cth curve to know and discuss the difference by copper trace size of these two test boards. The difference is also discussed with and compared to that of simulation results.

A Thermal Quadrupole-Based Model for Heat Diffusion in a Multilayered System: Application to Determination of Transient Performance of a Medium-Voltage Soft Starter

2008 ◽  
Author(s):  
Fabien Volle ◽  
Suresh V. Garimella ◽  
Mark A. Juds
Keyword(s):  
Heat Dissipation ◽  
Heat Diffusion ◽  
Junction Temperature ◽  
Transient Performance ◽  
Thermal Impedance ◽  
Medium Voltage ◽  
Soft Starter ◽  
Impedance Curve ◽  
Transient Thermal ◽  
Analytical Thermal Model

Adverse effects of starting-torque transients and high inrush currents in induction motors are typically mitigated by employing electronically controlled soft starting voltages through silicon controlled rectifiers (SCRs). However, the heat dissipation in the soft starter must be carefully managed in the design of motor drives. The objective of this study is to address the heat dissipation in the soft starter by implementing analytical solutions to the heat diffusion equations inside the soft starter. The transient analytical thermal model allows an estimation of the thermal system transfer function from the transient thermal impedance curve, and can be incorporated into a dynamic system model in order to determine the transient performance of a soft starter by evaluating the thyristor junction temperature for different switching time profiles, motor and load combinations, and “ON/OFF” cycles. Predictions from the model are validated by comparing against a coupled thermal and electrical model using a resistance/capacitance network approach.

Finite Element Modeling for Analyzing Material Removal Rate in ECDM Process

2020 ◽  
Vol 19 (04) ◽  
pp. 815-835 ◽  
Author(s):  
Viveksheel Rajput ◽  
Mudimallana Goud ◽  
Narendra Mohan Suri
Keyword(s):  
Finite Element ◽  
Finite Element Modeling ◽  
Material Removal Rate ◽  
Thermal Model ◽  
Material Removal ◽  
Removal Rate ◽  
Experimental Results ◽  
Temperature Fields ◽  
Work Material ◽  
Transient Thermal

Electrochemical discharge machining (ECDM) has been developed as a hybrid and robust technology for machining non-conductive work material at a preferable removal rate. ECDM exhibits various applications in the micro-machining of these materials like nuclear, automotive, medical industries, etc. Due to some peculiar properties of nonconductive materials, for example, glass transparency, their utilization in MEMS applications are also very numerous. In the ECDM process, removal of material takes place primarily due to high-temperature thermal erosion and secondarily due to electrolyte chemical etching action. Many rigorous experimental studies have reported in the empirical estimation of the material removal rate (MRR) in the ECDM process. However, very few studies have reported in the modeling of the ECDM process for predicting material removal rate through single spark simulation. The present paper attempts to develop a transient thermal model based upon finite element modeling (FEM) to simulate a single spark in the ECDM process for obtaining temperature fields in the work material. The obtained temperature fields are further post-processed to predict the material removal rate. FEM results are compared with the previous simulated and experimental results to confirm the approach. Moreover, an experimental study is also performed to validate the developed thermal model and it was found to be in an acceptable range of the experimental results. Further, a parametric study revealed that MRR increases with the increase in applied voltage and electrolyte concentration during soda-lime glass machining with ECDM. The developed FEM-based transient thermal model can be successfully utilized for predicting the removal rate of nonconductive work material.

Numerical Simulation of Laser Soldering about Electronic Connectors

2013 ◽  
Vol 668 ◽  
pp. 534-537 ◽  
Author(s):  
Yi Liu ◽  
Xun Bo Li ◽  
Zhi Zeng ◽  
Tao Liu
Keyword(s):  
Numerical Simulation ◽  
Finite Element Method ◽  
Thermal Model ◽  
Temperature Fields ◽  
Ansys Software ◽  
3D Finite Element ◽  
Maximum Deformation ◽  
Laser Soldering ◽  
3D Finite Element Method ◽  
Transient Thermal

A transient thermal model for Micro USB V2.0 electronic connector was created based on 3D finite element method. Then get the laser soldering spots on the temperature and stress the distribution of simulation by ANSYS software. Temperature fields at different time, residual stress in different locations and deformations were analyzed. The result shown that the maximum deformation of metal-pin reached 1.4mm, achieved the process standard.

Gas Turbine Shutdown Thermal Analysis and Results Compared With Experimental Data

2016 ◽  
Author(s):  
Vishnu Vardhan Reddy ◽  
Kathiravan Selvam ◽  
Roberto De Prosperis
Keyword(s):  
Thermal Analysis ◽  
Gas Turbine ◽  
Gas Turbines ◽  
Thermal Model ◽  
Experimental Results ◽  
Transient Behaviour ◽  
Current State ◽  
Analytical Studies ◽  
Transient Thermal ◽  
State Of Art

Gas turbines undergo transient operation during startup, load change and shutdown. Understanding transient behaviour is very critical as it has significant influence on the safety and life of turbine components. The transient thermal analysis of the gas turbine is one of the most important aspects to evaluate the clearances and life of various components of the unit. The understanding of the shutdown phenomena is very complex due to huge transient variation in the temperature inside the turbine. In the shutdown process natural convection plays an important role as there is very less flow inside the turbine, which is difficult to model and predict with the current state of art tools. A Flange to Flange 2D axi-symmetric thermal model was considered for this analysis to predict the overall temperature distribution of the gas turbine components with suitable approximations. In this paper detailed experimental results of the GE frame 5 shut down are analysed and numerical modelling was attempted to match the experimental results. Several analytical studies are carried out to understand the various effects including the “heat soak” effect. These effects were captured in both experimental and analytical studies.

scholarly journals Synchronous Machine Winding Modeling Method Based on Broadband Characteristics

2021 ◽  
Vol 11 (10) ◽  
pp. 4631
Author(s):  
Yu Chen ◽  
Xiaoqing Ji ◽  
Zhongyong Zhao
Keyword(s):  
Equivalent Circuit ◽  
High Frequency ◽  
Equivalent Circuit Model ◽  
Black Box ◽  
Synchronous Machine ◽  
Circuit Model ◽  
Modeling Method ◽  
Experimental Results ◽  
Box Model ◽  
Impedance Curve

The accurate establishment of the equivalent circuit model of the synchronous machine windings’ broadband characteristics is the basis for the study of high-frequency machine problems, such as winding fault diagnosis and electromagnetic interference prediction. Therefore, this paper proposes a modeling method for synchronous machine winding based on broadband characteristics. Firstly, the single-phase high-frequency lumped parameter circuit model of synchronous machine winding is introduced, then the broadband characteristics of the port are analyzed by using the state space model, and then the equivalent circuit parameters are identified by using an optimization algorithm combined with the measured broadband impedance characteristics of port. Finally, experimental verification and comparison experiments are carried out on a 5-kW synchronous machine. The experimental results show that the proposed modeling method identifies the impedance curve of the circuit parameters with a high degree of agreement with the measured impedance curve, which indicates that the modeling method is feasible. In addition, the comparative experimental results show that, compared with the engineering exploratory calculation method, the proposed parameter identification method has stronger adaptability to the measured data and a certain robustness. Compared with the black box model, the parameters of the proposed model have a certain physical meaning, and the agreement with the actual impedance characteristic curve is higher than that of the black box model.

Simulation of a Free Standing Riser Model and Validation With Experimental Results

2014 ◽  
Author(s):  
Marcio Yamamoto ◽  
Sotaro Masanobu ◽  
Satoru Takano ◽  
Shigeo Kanada ◽  
Tomo Fujiwara ◽  
...  
Keyword(s):  
Numerical Simulation ◽  
Numerical Analysis ◽  
Previous Experiment ◽  
Numerical Results ◽  
Experimental Results ◽  
Previous Article ◽  
Scale Model ◽  
Analysis Software ◽  
Free Standing ◽  
Reduced Scale

In this article, we present the numerical analysis of a Free Standing Riser. The numerical simulation was carried out using a commercial riser analysis software suit. The numerical model’s dimensions were the same of a 1/70 reduced scale model deployed in a previous experiment. The numerical results were compared with experimental results presented in a previous article [1]. Discussion about the model and limitations of the numerical analysis is included.

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